Method of forming a roughened surface capacitor with two etching steps

• US 5,445,986 A
• Filed: 09/01/1994
• Issued: 08/29/1995
• Est. Priority Date: 09/03/1993
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Hirota, Toshiyuki
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): TSAI, H JEY
• Application Number:
  US08/299,405
• Time in Patent Office: 362 Days
• Field of Search: 437/47, 437/52, 437/60, 437/919, 437/977, 156/651, 148/138
• US Class Current: 438/398
• CPC Class Codes: H01L 21/32134 by liquid etching only
• CPC Class Codes: H01L 28/84 being a rough surface, e.g. using hemispherical grains
• CPC Class Codes: H10B 12/01 Manufacture or treatment
• CPC Class Codes: Y10S 438/964 Roughened surface

Abstract

In a method of manufacturing a semiconductor device having a capacitor constituted by a lower electrode, an upper electrode, and a dielectric film arranged between the lower and upper electrodes, a polysilicon film containing a Group V element as an impurity is formed. The first etching step of forming an uneven portion on a surface of the polysilicon film is performed. The second etching step of forming an uneven portion on the surface of the polysilicon film is performed. The second etching step has an etch rate whose impurity concentration dependency is different from an impurity concentration dependency of an etch rate of the first etching step, thereby forming the uneven portion on the surface of the polysilicon film.

Claims

1. A method of manufacturing a semiconductor device having a capacitor constituted by a lower electrode, an upper electrode, and a dielectric film arranged between said lower and upper electrodes, wherein said lower electrode is formed by comprising:

the step of forming a polysilicon film containing a Group V element as an impurity;

the first etching step of forming an uneven portion on a surface of said polysilicon film; and

the second etching step of forming an uneven portion on the surface of said polysilicon film, and the second etching step having an etch rate whose impurity concentration dependency is different from an impurity concentration dependency of an etch rate of the first etching step,

thereby forming the uneven portion on the surface of said polysilicon film.

2. A method according to claim 1, wherein an etching medium used in the first etching step has an etch rate whose impurity concentration dependency is larger than that of an etch rate of an etching medium used in the second etching step.

3. A method according to claim 2, wherein the etching media used-in the first and second etching steps are liquids.

4. A method according to claim 2, wherein the etching media used in the first and second etching steps are gases.

5. A method according to claim 1, wherein the first etching step includes the step of exposing said polysilicon film to a medium containing a phosphoric acid.

6. A method according to claim 1, wherein the first etching step includes the step of exposing said polysilicon to a solution mixture of a hydrofluoric acid, a nitric acid, and a glacial acetic acid.

7. A method according to claim 1, wherein the second etching step includes the step of exposing said polysilicon film to a solution containing ammonia and hydrogen peroxide.

8. A method according to claim 1, wherein the second etching step includes the step of oxidizing a surface of said polysilicon prospectively serving as said lower electrode and the step of using a hydrofluoric acid.

9. A method according to claim 7, further comprising, after a process of said second etching step is performed, the step of removing a surface oxide film and the step of performing rapid thermal nitriding in an ammonia atmosphere, and then forming an insulating film of said capacitor.