Integrated circuit with diode-connected transistor for reducing ESD damage

• US 5,446,302 A
• Filed: 12/14/1993
• Issued: 08/29/1995
• Est. Priority Date: 12/14/1993
• Status: Expired due to Term

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Wolfe, Edward L., Krieger, William A., Beigel, David F.
• Primary Examiner(s): CARROLL, JAMES J
• Application Number:
  US08/166,636
• Time in Patent Office: 623 Days
• Field of Search: 257/355, 257/362, 257/363, 257/356, 257/357, 257/358, 257/359, 257/360, 257/361, 257/506, 257/565, 257/586, 257/587
• US Class Current: 257/355
• CPC Class Codes: H01L 27/0255 using diodes as protective elements
• CPC Class Codes: H01L 27/0259 using bipolar transistors as protective elements

Abstract

A diode-connected transistor device for IC protection against electrostatic discharge (ESD) that functions as a transistor in the active region during an ESD event. The device cell includes an annular collector at the outer reaches of the cell, a circular base diffusion concentric with the collector, and an annular emitter near the outer edge of the base. The base and emitter regions are connected together by metallization external to the transistor cell. With the base contact enclosed by the annular emitter, during an ESD spike the initial reverse bias current flow is from the collector, under the emitter diffusion and out of the base contact. Eventually, as the magnitude of the ESD spike increases, the reverse biased current becomes sufficient to locally forward bias the base-emitter junction changing the primary ESD current path from collector to base, to collector to emitter, thus lowering the ESD current density in the active base-collector junction. Hence, the active emitter area is significantly increased with only a small increase in transistor area, resulting in reduced power density and joule heating, and increased overall ESD tolerance without significant change in parasitic capacitance.

Claims

1. An integrated-circuit (IC) chip comprising circuitry including elements such as transistors, capacitors or resistors, said circuitry being connected by a lead to an external terminal point of said IC chip, said IC chip further being formed with a clamp device to reduce damage to at least one of said elements of said circuitry from electrostatic discharge (ESD) striking said terminal point, said clamp device being formed during the formation of said circuit elements of the chip and including;

a cell defining a semiconductive region for said clamp device and having a circular cross-section so as to form a right-circular cylindrical configuration having upper and lower regions at opposite ends of the axis of said cylindrical configuration;

said upper and lower regions having top and bottom surfaces respectively at the ends of said axis, and having side surfaces extending around the circumference of said cell;

dielectric isolation means surrounding said cell at said top, bottom and side surfaces thereof;

a vertical bipolar transistor formed in said cell and comprising;

a well with dopant of one type in said upper region of said cell and having an upper surface in contact with said top dielectric isolation means;

said well serving at least as a part of a collector for said vertical bipolar transistor;

a region of semiconductive material of circular cross-section having dopant of type opposite said one type and formed in said well adjacent said top surface to serve as the base of said bipolar transistor, said base being concentric with the right-circular cylindrical configuration of said cell, and further having an upper surface in contact with the dielectric isolation means at said top surface;

base contact means in the center of said circular base region, said base contact means being highly doped with dopant of said opposite type to establish a contact for making electrical connection to said base;

an annular emitter concentrically arranged in said circular base region around said base contact means;

said emitter being spaced radially from said base contact means such that at least part of said base region is between said base contact means and said emitter;

means conductively connecting said base contact means and said emitter;

means to establish a contact for said region functioning as a collector;

means connecting one of said contacts to a low-impedance bus; and

means connecting the other of said contacts to said lead between said terminal point and said IC circuitry so as to shunt electrostatic energy received from said terminal point thereby to prevent damage to said IC circuitry.

2. An IC chip as claimed in claim 1, including a buried layer with dopant of said one type in said lower region of said cell and having a lower surface in contact with said bottom dielectric isolation means.

3. An IC chip as claimed in claim 2, wherein said dopant of said buried layer has a higher concentration than the dopant of said well.

4. An IC chip as claimed in claim 1, including a plug of semiconductive material in said upper cell region and extending at least part way around said cell adjacent said side surfaces thereof, said plug having a dopant of said one type and of concentration greater than that of said well.