High-Q inductors in silicon technology without expensive metalization

• US 5,446,311 A
• Filed: 09/16/1994
• Issued: 08/29/1995
• Est. Priority Date: 09/16/1994
• Status: Expired due to Term

• Current Assignee: MediaTek, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Ewen, John E., Soyuer, Mehmet, Ponnapalli, Saila
• Primary Examiner(s): Ngo, Ngan V.
• Application Number:
  US08/307,953
• Time in Patent Office: 347 Days
• Field of Search: 257/528, 257/531, 257/508, 257/758, 257/774, 257/776, 336/12, 336/65, 336/107, 336/138, 336/173, 336/186, 336/223, 336/225
• US Class Current: 257/531
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01L 23/5226 Via connections in a multilevel interconnection structure
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A monolithic high-Q inductor structure is formed with multiple metalization levels in a conventional integrated circuit technology in which inductor turns utilize these multiple levels to reduce the inductor resistance. Inductors with Q values above five can be integrated with this approach at radio and microwave frequencies.

Claims

1. A high Q monolithic inductor structure formed using a conventional silicon technology comprising at least first and second metal levels separated from one another by a first insulating layer, said first and second metal levels being formed with identical spiral patterns and connected through via holes in the first insulating layer to implement parallel connected turns of the inductor structure having a low resistance value.

2. A high Q monolithic inductor structure as recited in claim 1 further comprising a third metal level formed on a second insulating layer over a silicon substrate, said third metal level having a pattern which crosses under the spiral patterns of said first and second metal levels and is connected to one terminal of the inductor structure, one of said first and second metal levels being connected to a second terminal of the inductor and said second metal level being separated from said third metal level by a third insulating layer and connected at a central portion of said spiral pattern by a via hole through the third insulating layer to said third metal level.

3. The monolithic high Q inductor structure recited in claim 2 wherein said first, second and third insulating layers are silicon dioxide.

4. The monolithic high Q inductor structure recited in claim 3 wherein said the inductor structure has a Q value of seven or more at the 2.4-2.5 GHz band.