Alignment apparatus and method for placing modules on a circuit board

• US 5,446,960 A
• Filed: 02/15/1994
• Issued: 09/05/1995
• Est. Priority Date: 02/15/1994
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Redfield, Bradley H., Kidd, Thomas D., Isaacs, Phillip D., Stone, Jeffrey L.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/196,329
• Time in Patent Office: 567 Days
• Field of Search: 29/833, 29/407, 29/834, 29/741, 29/759, 29/840, 29/740, 228/180.21
• US Class Current: 29/834
• CPC Class Codes: H05K 13/022 with orientation of the elements
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/4978 Assisting assembly or disassembly
• CPC Class Codes: Y10T 29/49895 Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53261 Means to align and advance work part

Abstract

An alignment apparatus and method that provides a pick and placement tool that picks matrix leaded modules from trays, places the modules into a self-aligning nest, picks the modules from the nest and places them on a printed circuit board. The specific location and orientation of the nest with respect to a printed circuit board is known by the pick and placement tool. Once the nest has aligned the module, the tool picks the module from the nest and places it in the appropriate location on the printed circuit board. The nest has sloped sides that angle toward that bottom and are slippery. These sides funnel the module toward the bottom of the nest and correct gross misalignment. At the bottom inside of the nest are locating features into which the leads of the module fit. Between the locating features are slip surfaces so that the module leads slide into the locating features, correcting fine misalignment. Embodiments of the nest work for matrix leaded modules, including ball grid array, column grid array, and land grid array modules.

Claims

1. A method for aligning a matrix leaded module on a circuit board, comprising the steps of:

picking the module for assembly;

placing the module into a self-aligning nest, wherein the nest has

angled sides, the sides having slip surfaces, and

locating features on the inside bottom of the nest for aligning the module leads;

removing the module from the nest with a placement head, the placement head having a known position with respect to the nest; and

placing the module on the circuit board.

2. The method of claim 1 wherein the locating features are depressions for receiving leads of a ball grid array module.

3. The method of claim 1 wherein the locating features are depressions for receiving leads from a column grid array module.

4. The method of claim 1 wherein the placement head removes the module from the nest using a vacuum nozzle.

5. A nest apparatus for self-aligning a matrix leaded module, comprising:

alignment means for aligning the nest to a known position;

angled sides with slip surfaces; and

locating features on inside bottom of the nest for aligning the module leads.

6. The apparatus of claim 5 wherein the locating features further comprise depressions for accepting the leads of a ball grid array module.

7. The apparatus of claim 5 wherein the locating features are depressions for receiving leads from a column grid array module.

8. The apparatus of claim 5 wherein the alignment means comprises alignment pins connected to a shuttle.

9. An apparatus for assembling matrix leaded modules on a circuit board, comprising;

a tray elevator;

a plurality of trays, holding a plurality of modules, mounted in the tray elevator;

a shuttle, disposed adjacent to the tray elevator;

a transfer head, for transporting a module from the tray to the shuttle;

a self-aligning nest mounted on the shuttle, the nest having

angled sides, the sides having slip surfaces, and

locating features on the inside bottom of the nest for aligning the module leads; and

a placement head, having a known orientation with respect to the nest, which picks the module from the nest and places the module on a circuit board.

10. The apparatus of claim 9 wherein the nest is mounted on the shuttle with alignment pins.