Method of sealing

• US 5,447,745 A
• Filed: 10/17/1994
• Issued: 09/05/1995
• Est. Priority Date: 10/19/1993
• Status: Expired due to Fees

• Current Assignee: Dow, Inc.
• Original Assignee: Dow, Inc.
• Inventors: Descamps, Pierre
• Primary Examiner(s): LUSIGNAN, MICHAEL R
• Application Number:
  US08/323,947
• Time in Patent Office: 323 Days
• Field of Search: 427/8, 427/327, 427/387, 427/388.2
• US Class Current: 427/8
• CPC Class Codes: C25D 11/18 After-treatment, e.g. pore-sealing
• CPC Class Codes: G01R 27/26 Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables

Abstract

The specification describes and claims a method of bonding a sealant to an anodised aluminium surface the method comprising the steps of (1) measuring the electrical impedance of anodised aluminium substrates, (2) selecting at least one substrate having an electrical phase shift of from 0.4 to 0.5, (3) cleaning the anodised surface of the substrate, (4) applying to the anodised surface a curable silicone sealant composition and (5) bringing about curing of the sealant composition to form a bond between the anodised surface and the sealant.

Claims

1. A method of bonding a sealant to an anodised aluminium surface the method comprising the steps of (1) measuring the electrical impedance of anodised aluminium substrates, (2) selecting at least one substrate having an electrical phase shift of from 0.4 to 0.5, (3) cleaning the anodised surface of the substrate, (4) applying to the anodised surface a curable silicone sealant composition and (5) bringing about curing of the sealant composition to form a bond between the anodised surface and the sealant.

2. A method according to claim 1 wherein the electrical impedance is determined by a procedure which comprises passing alternating current at several frequencies across the substrate, measuring the electrical impedance at each frequency and using the information to solve equations ##EQU4## and where y is the complex admittance of the substrate, w is the frequency of the measured frequency, a, b, c, d are non-linear combinations of electrical resistances analogous to each of four layers of the substrate and s, t, u, v are non-linear combinations of electrical capacitances analogous to the said four layers of the substrate.

3. A modification of the method according to claim 2 wherein (i) thickness of one layer of the substrate is measured independently and (ii) alternating current is passed across the substrate at a single high frequency and the information is used to solve equation (2) .

4. A method according to claim 1 wherein the silicone sealant composition is convertible to an elastomer at 20°

to 25°

C. and comprises a polymer having silanol groups, a silane or siloxane having at least three silicon-bonded alkoxy groups, an adhesion promoter and a condensation catalyst.