Enclosed transceiver

• US 5,448,110 A
• Filed: 09/14/1993
• Issued: 09/05/1995
• Est. Priority Date: 06/17/1992
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Communications, Inc. (Micron Technology, Inc.)
• Inventors: Tuttle, John R., Lake, Rickie C.
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US08/123,030
• Time in Patent Office: 721 Days
• Field of Search: 257/723, 257/724, 257/679, 340/825.34, 340/825.54, 340/573, 340/572, 455/89, 455/90
• US Class Current: 257/723
• CPC Class Codes: G01S 13/758 using a signal generator powered by the interrogation signal
• CPC Class Codes: G01S 13/767 Responders; Transponders teaching or practice apparatus for gun-aiming or gun-laying using reflecting targets or active targets F41G3/26
• CPC Class Codes: G06K 19/0702 the arrangement including a battery
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G06K 7/10346 the antenna being of the far field type, e.g. HF types or dipoles
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/24998 Reinforcing structures, e.g. ramp-like support
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/82007 involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting a build-up interconnect during or after the bonding process
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/22 : by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/28 : Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00
• CPC Class Codes: H01Q 9/285 : Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H04L 2101/604 : Address structures or formats
• CPC Class Codes: H04L 2101/622 : Layer-2 addresses, e.g. medium access control [MAC] addresses
• CPC Class Codes: H04L 61/35 : involving non-standard use of addresses for implementing network functionalities, e.g. coding subscription information within the address or functional addressing, i.e. assigning an address to a function
• CPC Class Codes: H04L 61/5038 : for local use, e.g. in LAN or USB networks, or in a controller area network [CAN]
• CPC Class Codes: H04L 61/5046 : Resolving address allocation conflicts; Testing of addresses testing when self-assigning an address H04L61/5092
• CPC Class Codes: H04L 61/5084 : Providing for device mobility network addressing or numbering for mobility support in wireless networks H04W8/26; mobile IP H04W80/04
• CPC Class Codes: H04L 61/5092 : by self-assignment, e.g. picking addresses at random and testing if they are already in use

Abstract

An enclosed transceiver includes an integrated circuit and a battery together laminated between two films. Printed conductors on each film couple operative power to the integrated circuit. Other-printed conductors form an antenna coupled to the transceiver for sending and receiving signals. In a preferred embodiment, the integrated circuit has three terminals. The first terminal is connected to a first side of a thin film battery. The second terminal is connected to a first side of a printed loop antenna. The third terminal serves two purposes being connected to the second side of the battery and to the second side of the loop antenna. The enclosing films are treated with silicon nitride for hermeticity. Enclosed transceivers of the present invention are suitable for mass production in web, sheet, and tape formats. Such transceivers are useful as stamps, labels, and tags in object tracking systems including systems for mail delivery, airline baggage tracking, and inventory control.

Claims

1. A sticker comprising:

a. a first film comprising a first surface and a second surface substantially parallel to the first surface, the second surface comprising a plurality of conductors;

b. a first battery comprising a first pole and a second pole, the first pole coupled to a first conductor of the plurality;

c. a second battery comprising a third pole and a fourth pole, the fourth pole coupled to a second conductor of the plurality;

d. an integrated circuit mounted superjacent to the second surface and coupled to the first conductor and the second conductor of the plurality;

e. a second film placed superjacent to the second surface, the second film comprising means for coupling the second pole to the third pole; and

f. means for mechanically coupling the sticker to an article of manufacture.

2. The sticker of claim 1 wherein the second film is sealed to the second surface.

3. The sticker of claim 1 wherein a third conductor of the plurality forms an antenna and the integrated circuit is coupled to the third conductor.

4. The sticker of claim 1 wherein the first battery comprises a conductive surface and the integrated circuit is coupled to the conductive surface so that the conductive surface operates as an antenna.

5. A sticker comprising:

a. a first film comprising a first surface and a second surface substantially parallel to the first surface, the second surface comprising a first plurality of conductors;

b. a battery mounted superjacent to the second surface, the battery comprising a first pole and a second pole, the first pole coupled to a first conductor of the first plurality;

c. an integrated circuit mounted superjacent to the second surface and coupled to the first conductor;

d. a second film placed superjacent to the second surface, the second film comprising an antenna, a second conductor coupled to the antenna and coupled to the second pole, the second conductor for coupling the antenna and the battery to the integrated circuit; and

e. means for mechanically coupling the sticker to an article of manufacture.

6. The sticker of claim 5 wherein the integrated circuit comprises:

a. a memory;

b. a receiver for receiving a first radio signal and providing received data;

c. a controller for writing the received data into the memory and for reading transmit data from the memory; and

d. a transmitter for sending the transmit data as a second radio signal.

7. The sticker of claim 6 wherein the integrated circuit further comprises processing means for editing the transmit data in response to the received data.

8. The sticker of claim 7 wherein the transmit data includes data for billing a cost associated with handling of the article.

9. The sticker of claim 5 wherein the integrated circuit comprises a common terminal for coupling to the battery and for coupling to the antenna.