Lead-on-chip integrated circuit apparatus
First Claim
1. A lead-on-chip integrated circuit package having good thermal conductivity for efficient transfer of heat contained therein comprising:
- an integrated circuit chip having a face with circuit connection pads thereon;
a first layer of adhesive on said face of said integrated circuit chip wherein said circuit connection pads are exposed;
said first layer of adhesive cured to form an insulator on the face of said integrated circuit;
a second layer of adhesive on said cured first layer of adhesive wherein said circuit connection pads are exposed;
a lead frame having tips and a plurality of electrical conductors, wherein a substantial portion of said lead frame is laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads for connection thereto; and
an encapsulating case surrounding said integrated circuit chip and lead frame.
9 Assignments
0 Petitions
Accused Products
Abstract
A lead-on-chip integrated circuit package comprising at least one extremely thin adhesive layer transferred from a carrier onto the face of integrated circuit chips, and a lead frame laminated to the last adhesive layer, with cured adhesive acting as an insulator, integrated circuit chip connection pads bonded to and encapsulating the chip and lead frame. Thermally conductive and electrically insulating filling may be included with the adhesive to improve heat conduction from the IC. Compliant adhesive reduces thermally induced stresses between the lead frame and IC chip. Both the improved thermal performance and reduced moisture absorption of the encapsulated package improves the reliability of the integrated circuit package.
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Citations
9 Claims
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1. A lead-on-chip integrated circuit package having good thermal conductivity for efficient transfer of heat contained therein comprising:
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an integrated circuit chip having a face with circuit connection pads thereon; a first layer of adhesive on said face of said integrated circuit chip wherein said circuit connection pads are exposed; said first layer of adhesive cured to form an insulator on the face of said integrated circuit; a second layer of adhesive on said cured first layer of adhesive wherein said circuit connection pads are exposed; a lead frame having tips and a plurality of electrical conductors, wherein a substantial portion of said lead frame is laminated to said second layer of adhesive and fixedly aligned with said integrated circuit connection pads for connection thereto; and an encapsulating case surrounding said integrated circuit chip and lead frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A lead-on-chip integrated circuit package having good thermal conductivity for efficient transfer of heat contained therein comprising:
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an integrated circuit chip having a face with circuit connection pads thereon; at least two layers of adhesive on said face of said integrated circuit chip wherein said circuit connection pads are exposed; at least one layer of adhesive cured to form an insulator on said face of said integrated circuit; and a lead frame having a plurality of electrical conductors, a substantial portion of said lead frame being laminated to a last layer of adhesive and fixedly aligned with said integrated circuit connection pads for connection thereto, wherein said insulator prevents said lead frame from shorting to said integrated circuit chip; and an encapsulating case surrounding said integrated circuit chip and lead frame.
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Specification