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Memory stack with an integrated interconnect and mounting structure

  • US 5,448,511 A
  • Filed: 06/01/1994
  • Issued: 09/05/1995
  • Est. Priority Date: 06/01/1994
  • Status: Expired due to Fees
First Claim
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1. A memory stack, comprising:

  • (a) an interconnect device, comprisingi. a plurality of rigid sections,ii. a plurality of flexible sections connected between said rigid sections,iii. a plurality of mounting contacts on each of said rigid sections, andiv. a plurality of traces electrically connected to said mounting contacts; and

    (b) a plurality of memory devices, each memory device being mounted on one of said rigid sections of said interconnect device, wherein I/O contacts of said memory devices are electrically connected to said traces of said interconnect device,wherein said interconnect device is folded at said flexible sections to form a stack of memory devices.

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