Memory stack with an integrated interconnect and mounting structure
First Claim
Patent Images
1. A memory stack, comprising:
- (a) an interconnect device, comprisingi. a plurality of rigid sections,ii. a plurality of flexible sections connected between said rigid sections,iii. a plurality of mounting contacts on each of said rigid sections, andiv. a plurality of traces electrically connected to said mounting contacts; and
(b) a plurality of memory devices, each memory device being mounted on one of said rigid sections of said interconnect device, wherein I/O contacts of said memory devices are electrically connected to said traces of said interconnect device,wherein said interconnect device is folded at said flexible sections to form a stack of memory devices.
1 Assignment
0 Petitions
Accused Products
Abstract
A memory stack includes a flexible interconnect device having a plurality of rigid sections connected together by a plurality of flexible sections. Memory devices such as dice or chips are mounted on the flexible interconnect structure and the structure is folded to at the flexible sections to form a stack. Connections among memory device I/Os and interconnect device mounting contacts are made via traces in a signal layer. A thermal conduction layer can be added to increase heat conduction away from the memory devices.
-
Citations
34 Claims
-
1. A memory stack, comprising:
-
(a) an interconnect device, comprising i. a plurality of rigid sections, ii. a plurality of flexible sections connected between said rigid sections, iii. a plurality of mounting contacts on each of said rigid sections, and iv. a plurality of traces electrically connected to said mounting contacts; and (b) a plurality of memory devices, each memory device being mounted on one of said rigid sections of said interconnect device, wherein I/O contacts of said memory devices are electrically connected to said traces of said interconnect device, wherein said interconnect device is folded at said flexible sections to form a stack of memory devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A memory stack, comprising:
-
(a) a flexible interconnect device, comprising i. a plurality of mounting contacts on said flexible interconnect device, ii. a plurality of traces connected to said mounting contacts and forming a first layer of said flexible interconnect device, and iii. thermal conduction means for conducting heat, said thermal conduction means forming a second layer of said flexible interconnect device; and (b) a plurality of memory devices, each memory device being mounted on said flexible interconnect device, wherein I/O contacts of said memory devices are electrically connected to said traces of said flexible interconnect device, wherein said flexible interconnect device is folded to form a stack of memory devices. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 31, 32)
-
-
27. A circuit board having a memory stack, wherein said memory stack comprises:
-
(a) a flexible interconnect device, comprising i. a plurality of mounting contacts on said flexible interconnect device, ii. a plurality of traces connected to said mounting contacts and forming a first layer of said flexible interconnect device, and iii. thermal conduction means for conducting heat, said thermal conduction means forming a second layer of said flexible interconnect device; and (b) a plurality of memory devices having I/O contacts and mounted on said flexible interconnect device, wherein said I/O contacts of said memory devices are electrically connected to said traces of said flexible interconnect device; wherein said flexible interconnect device is folded to form a stack of memory devices. - View Dependent Claims (28, 29, 33, 34)
-
-
30. A method of manufacturing a memory stack, comprising the steps of:
-
(a) mounting a plurality of memory devices on a flexible interconnect structure; and (b) folding said flexible interconnect structure so that said memory devices are positioned in a stack wherein said flexible interconnect structure includes i. a plurality of rigid sections, ii. a plurality of flexible sections connected between said rigid sections, iii. a plurality of mounting contacts on each of said rigid sections, and iv. a plurality of traces electrically connected to said mounting contacts.
-
Specification