×

Multiple valve assembly and process

  • US 5,449,294 A
  • Filed: 01/23/1995
  • Issued: 09/12/1995
  • Est. Priority Date: 03/26/1993
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for purging and vacuum testing a semiconductor process system, said system including a semiconductor processing chamber and a source of process gas, and said method comprising:

  • providing a unitary tri-valve assembly, comprising a principal channel extending between an inlet port and an outlet port;

    a first valve for closing the principal channel between said inlet port and said outlet port;

    a second channel intersecting said principal channel between said inlet port and said first valve;

    a second valve for closing said second channel;

    a third channel intersecting said principal channel between said outlet port and said first valve; and

    a third valve for closing said third channel;

    connecting said tri-valve assembly between said processing chamber and said source of process gas, with said source of process gas connected to said inlet port and said outlet port connected to said processing chamber;

    closing said first valve to isolate said outlet port from said inlet port;

    with said first valve closed, connecting a vacuum pump to said second channel and opening said second valve to evacuate elements of said system upstream of said valve assembly inlet port; and

    with said first valve closed, connecting a source of purge gas to said third channel and opening said third valve to flow said purge gas to purge elements of said system downstream of said valve assembly outlet port.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×