Method for manufacturing an electrophotographic photoreceptor

• US 5,449,573 A
• Filed: 10/06/1993
• Issued: 09/12/1995
• Est. Priority Date: 10/09/1992
• Status: Expired due to Term

• Current Assignee: Fuji Xerox Company Limited (Xerox Holdings Corp.)
• Original Assignee: Fuji Xerox Company Limited (Xerox Holdings Corp.)
• Inventors: Ichizawa, Nobuyuki, Miyamoto, Hiroshi, Aoki, Kazuaki, Yasaku, Koichi, Nakabayashi, Wataru, Tsuyuki, Naohiko, Suwabe, Masaaki
• Primary Examiner(s): MARTIN, ROLAND E
• Application Number:
  US08/132,251
• Time in Patent Office: 706 Days
• Field of Search: 430/131, 430/132, 430/134
• US Class Current: 430/131
• CPC Class Codes: G03G 5/142 Inert intermediate layers
• CPC Class Codes: G03G 5/144 comprising inorganic material

Abstract

There is disclosed a process for manufacturing an electrophotographic photoreceptor having no coating defect, a high charging performance, an excellent stability in a repeated use, and no image quality defect. The manufacturing process comprises the steps of coating a subbing layer-forming coating solution on the conductive substrate under an environment having a dew-point temperature in the range of from 5° C. to 10° C.; drying the coated solution under an environment having a dew-point temperature in the range of from 10° C. to 20° C. to prepare a subbing layer; coating a photosensitive layer-forming coating solution on the subbing layer under an environment having a dew-point temperature in the range of from 5° C. to 10° C.; and drying the coated solution under an environment having a dew-point temperature in the range of from 10° C. to 20° C. to prepare a photosensitive layer.

Claims

1. A manufacturing process for producing an electrophotographic photoreceptor comprising a conductive substrate having thereon a subbing layer and a photosensitive layer, comprising the steps of:

coating a subbing layer-forming coating solution on the conductive substrate under an environment having a dew-point temperature in the range of from 5°

C. to 10°

C.;

drying the coated solution under an environment having a dew-point temperature in the range of from 10°

C. to 20°

C. to prepare a subbing layer;

coating a photosensitive layer-forming coating solution on the subbing layer under an environment having a dew-point temperature in the range of from 5°

C. to 10°

C.; and

drying the coated solution under an environment having a dew-point temperature in the range of from 10°

C. to 20°

C. to prepare a photosensitive layer;

wherein said subbing layer contains an organic metal compound, a silane coupling agent and a binder resin and said coating solution contains a binder.

2. A manufacturing process as in claim 1, wherein said subbing layer contains an organic metal compound and a silane coupling agent.

3. A manufacturing process as in claim 2, wherein said subbing layer further contains a binding resin.

4. A manufacturing process as in claim 3, wherein said binding resin is a polyvinylbutyral resin.

5. A manufacturing process for producing an electrophotographic photoreceptor comprising a conductive substrate having thereon a subbing layer and a photosensitive layer, wherein said subbing layer contains an organic metal compound, a silane coupling agent and a binder resin and said coating solution contains a binder, comprising the steps of:

coating a subbing layer-forming coating solution on the conductive substrate;

drying the coated solution;

coating a photosensitive layer-forming coating solution on the subbing layer; and

drying the coated solution;

further comprising controlling the environment during said coating steps at a dew point temperature in the range of from 5°

C. to 10°

C.; and

controlling the environment of said drying steps at a dew point temperature in the range of from 10°

C. to 20°

C.

6. A manufacturing process as claimed in claim 5, wherein said organic metal compound comprises a zirconium compound or titanium compound.

7. A manufacturing process as claimed in claim 6, wherein said zirconium compound is selected from the group consisting of tetraacetylacetonate zirconium, dibutoxybisacetylacetonate zirconium, tributoxyacetylacetonate zirconium, tetrabisethylacetoacetate zirconium, butoxytrisethylacetoacetate zirconium, tributoxymonoethylacetoacetate zirconium, dibutoxybisethylacetoacetate zirconium, bisacetylacetonatebisethylacetoacetate zirconium, monoacetylacetonatetrisethylacetoacetate zirconium, bisacetylacetonatebisethylacetoacetate zirconium, zirconium n-butoxide and zirconium n-propoxide.

8. A manufacturing process as claimed in claim 6, wherein said titanium compound comprises titanium orthoester represented by formula (I), polyorthotitanic acid ester represented by formula (II) or titanium chelating compound represented by formula (III):

##STR4## wherein R₁, R₂, R₃, and R₄ each represents a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a cresyl group, a stearyl group, a hexyl group, a nonyl group or acetyl group;

##STR5## wherein R₁, R₂, R₃ and R₄ each represents a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a cresyl group, a stearyl group, a hexyl group, a nonyl group or a cetyl group; and

n represents an integer of from 2 to 20, preferably from 2 to 10;

space="preserve" listing-type="equation">Ti(L).sub.n X.sub.4-n (III)

wherein L represents a chelating group;

X represents an ester residue; and

n represents an integer of from 1 to 4.

9. A manufacturing process as claimed in claim 8, wherein said chelating group is a β

-diketone, a hydroxycarboxylic acid, a ketoester or a ketoalcohol.

10. A manufacturing process as claimed in claim 8, wherein said chelating group is octylene glycol, acetylacetone, lactic acid, malic acid, tartaric acid, salicylic acid, acetoacetic acid ester or diacetone alcohol.

11. A manufacturing process as claimed in claim 8, wherein said ester residue is an alkoxy group.

12. A manufacturing process as claimed in claim 8, wherein said titanium compound is a titanium chelating compound selected from the group consisting of di-i-propoxy-bis(acetylacetone)titanate, di-n-butoxy-bis(triethanolamine)titanate, dihydroxy-bis(lactic acid)titanate, tetraoctylene glycol titanate or di-i-propoxybis(ethyl acetoacetate)titanate.

13. A manufacturing process as claimed in claim 5, wherein said organic metal compound is an aluminum alkoxide, an aluminum ethoxide, an indium alkoxide, an antimony alkoxide or a boron alkoxide.

14. A manufacturing process as claimed in claim 13, wherein said organic metal compound is aluminum isopropoxide, monosec-butoxyaluminum diisopropoxide, aluminum sec-butoxide, aluminum ethoxide, diisopropoxy-(ethylacetoacetate)aluminum, tris(ethylacetoacetate) aluminum, tris (acetylacetonate) aluminum, bis-ethylacetoacetatemonoacetylacetonatealuminum, indium methoxide, indium ethoxide, indium isopropoxide, indium n-butoxide, antimony methoxide, antimony ethoxide, antimony isopropoxide, antimony n-butoxide, boron methoxide or boron n-butoxide.

15. A manufacturing process as claimed in claim 5, wherein said silane coupling agent is selected from the group consisting of vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β

-methoxyethoxy) silane, γ

-glycidoxypropyltrimethoxysilane, γ

-methacryloxypropyltrimethoxysilane, γ

-aminopropylmethydimethoxysilane, γ

-chloropropyltrimethoxysilane, γ

-mercaptopropyltrimethoxysilane, γ

-aminopropyltrimethoxysilane, γ

-aminopropyltriethoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmonomethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, monophenyltrimethoxysilane, γ

-(2-aminoethyl)aminopropyltrimethoxysilane, γ

-(2-aminoethyl) aminopropylmethyldimethoxysilane, and γ

-methacryloxypropyltrimethoxysilane.

16. A manufacturing process as claimed in claim 5, wherein said binder resin is a polyurethane resin, a polyvinylbutyral resin, a polyvinylformal resin or a polyvinyl acetate resin.

17. A manufacturing process as claimed in claim 5, wherein the amount of the silane coupling agent is in the range of 5%-95% by weight of the amount of the organic metal compound and the amount of the binding resin is in the range to 5%-25% by weight of the total amount of the organic metal compound and the silane coupling agent.

18. A manufacturing process as claimed in claim 5, wherein the amount of the silane coupling agent is in the range of 5%-50% by weight of the amount of the organic metal compound and the amount of the binding resin is in the range to 5%-25% by weight of the total amount of the organic metal compound and the silane coupling agent.

19. A manufacturing process as claimed in claim 5, wherein the amount of the silane coupling agent is in the range of 5%-20% by weight of the amount of the organic metal compound and the amount of the binding resin is in the range to 5%-25% by weight of the total amount of the organic metal compound and the silane coupling agent.