Method of forming metal-disilicide layers and contacts

• US 5,449,642 A
• Filed: 04/14/1994
• Issued: 09/12/1995
• Est. Priority Date: 04/14/1994
• Status: Expired due to Term

• Current Assignee: Duke University, MCNC, Inc.
• Original Assignee: Duke University, MCNC, Inc.
• Inventors: Tan, Teh Y., McGuire, Gary E., Lynch, William T.
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): EVERHART, CARIDAD
• Application Number:
  US08/227,659
• Time in Patent Office: 516 Days
• Field of Search: 437/200, 437/41, 437/245, 437/246
• US Class Current: 438/151
• CPC Class Codes: H01L 21/28518 the conductive layers comprising silicides H01L21/28537 takes precedence
• CPC Class Codes: H01L 23/4825 for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices, i.e. SOS
• CPC Class Codes: H01L 29/458 for thin film silicon, e.g. source or drain electrode
• CPC Class Codes: H01L 29/66772 Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates H01L29/66666 takes precedence; thin film FinFETs H01L29/66795
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of forming a metal-disilicide (MSi₂) film from a silicon-on-insulator (SOI) substrate having an insulating underlayer and a silicon outerlayer includes the formation of a first capping layer on a portion of the silicon outerlayer. The first capping layer preferably includes titanium and a preselected metal (M) such as cobalt. A step is then performed to convert a first portion of the silicon outerlayer to metal-disilicide. This step is preferably accomplished by a rapid thermal annealing step. Thereafter, a second capping layer is formed on the metal-disilicide layer. The second capping layer preferably includes titanium and metal-monosilicide (MSi). Next, a step is performed to convert a second portion of the silicon outerlayer, beneath the first portion, to metal-disilicide while preventing phase-reversal of the already formed metal-disilicide layer to metal-monosilicide. This step is preferably accomplished by a rapid thermal annealing step as well. The method can preferably be used to form low resistance metal-disilicide contacts to active regions of SOI electronic devices.

Claims

1. A method of forming a cobalt-disilicide layer, comprising the steps of:

providing a silicon-on-insulator substrate having an insulating underlayer and a silicon outerlayer thereon;

forming a first capping layer containing cobalt on said silicon outerlayer;

annealing said substrate to convert a first portion of said silicon outerlayer to a first cobalt-disilicide layer;

forming a second capping layer containing cobalt-silicide on said first cobalt-disilicide layer; and

annealing said substrate to convert a second portion of said silicon outerlayer, between said first portion and said insulating underlayer, to a second cobalt-disilicide layer.

2. The method of forming a cobalt-disilicide layer according to claim 1, wherein said first capping layer forming step comprises the steps of:

depositing a first layer containing titanium on said silicon outerlayer; and

depositing a second layer containing cobalt on said first layer.

3. The method of forming a cobalt-disilicide layer according to claim 2, wherein said second capping layer forming step comprises the steps of:

depositing a third layer containing titanium on said first cobalt-disilicide layer; and

depositing a fourth layer containing cobalt-silicide on said third layer.

4. The method of forming a cobalt-disilicide layer according to claim 3, wherein said third layer depositing step is preceded by the step of etching said substrate to expose said first cobalt-disilicide layer.

5. The method of forming a cobalt-disilicide layer according to claim 4, wherein said annealing step to convert a second portion of said silicon outerlayer comprises the step of annealing said substrate to convert the second portion to monocrystalline cobalt-disilicide.

6. A method of selectively forming a metal-disilicide layer containing silicon and a metal, comprising the steps of:

forming a first capping layer containing the metal on a silicon substrate;

annealing said substrate at a first temperature to convert a first portion thereof to a first metal-disilicide layer containing the metal; and

forming a second metal-disilicide layer containing the metal adjacent said first metal-disilicide layer,

wherein the metal is selected so that at the first temperature, a Gibbs free energy reduction in forming metal-monosilicide from silicon and the metal is greater than 0.5 times a Gibbs free energy reduction in forming metal-disilicide from silicon and the metal.

7. The method of selectively forming a metal-disilicide layer according to claim 6, wherein said second metal-disilicide layer forming step comprises the steps of:

forming a second capping layer containing metal-monosilicide having the preselected metal therein, on said first metal-disilicide layer; and

annealing said substrate to convert a second portion thereof to a second metal-disilicide layer which is contiguous with said first metal-disilicide layer.

8. The method of selectively forming a metal-disilicide layer according to claim 6, wherein said first capping layer forming step comprises the steps of:

forming a first layer containing titanium on said silicon substrate; and

forming a second layer containing the metal on said first layer.

9. The method of selectively forming a metal-disilicide layer according to claim 7, wherein said first capping layer forming step comprises the steps of:

forming a first layer containing titanium on said silicon substrate; and

forming a second layer containing the metal on said first layer.

10. The method of selectively forming a metal-disilicide layer according to claim 9, wherein said second capping layer forming step comprises the steps of:

forming a third layer containing titanium on said first metal-disilicide layer; and

forming a fourth layer containing metal-monosilicide having the preselected metal therein, on said third layer.

11. The method of selectively forming a metal-disilicide layer according to claim 10, wherein said third layer forming step is preceded by the step of etching said substrate to expose said first metal-disilicide layer.

12. The method of selectively forming a metal-disilicide layer according to claim 7, wherein said annealing step to convert the second portion of said silicon substrate comprises the step of annealing said substrate to convert the second portion to monocrystalline metal-disilicide.

13. A method of forming a silicon-on-insulator insulated-gate field effect transistor having cobalt-disilicide source and drain contacts, comprising the steps of:

providing a silicon-on-insulator substrate having an insulating underlayer and a silicon outerlayer thereon;

forming a gate insulating layer on said silicon outerlayer;

forming a conductive gate electrode having first and second ends on said gate insulating layer;

forming a source region and a drain region in said silicon outerlayer adjacent the first end and the second end, respectively, of said conductive gate electrode, to thereby define a silicon channel region between said source region and said drain region and between said insulating underlayer and said gate insulating layer;

forming insulating spacers on said source and drain regions at the first and second ends of said conductive gate electrode, respectively;

forming a first bimetallic capping layer containing cobalt on said source region and on said drain region; and

annealing said substrate to convert a first portion of said source region to cobalt-disilicide and covert a first portion of said drain region to cobalt-disilicide.

14. The method of forming an insulated-gate transistor according to claim 13, wherein said annealing step is followed by the steps of:

forming a second bimetallic capping layer containing cobalt-silicide on said source region and on said drain region; and

annealing said substrate to convert a second portion of said source region, between said first portion of said source region and said insulating underlayer, to cobalt-disilicide and to convert a second portion of said drain region, between said first portion of said drain region and said insulating underlayer, to cobalt-disilicide.

15. The method of forming an insulated-gate transistor according to claim 14, wherein said first bimetallic capping layer forming step comprises the steps of:

depositing a first layer containing titanium on said source region and on said drain region; and

depositing a second layer containing cobalt on said first layer.

16. The method of forming an insulated-gate transistor according to claim 15, wherein said second capping layer forming step comprises the steps of:

depositing a third layer containing titanium on said source region and on said drain region; and

depositing a fourth layer containing cobalt-silicide on said third layer.

17. The method of forming an insulated-gate transistor according to claim 16, wherein said third layer depositing step is preceded by the step of etching said substrate to expose said first portion of said source region and expose said first portion of said drain region.

18. The method of forming an insulated-gate transistor according to claim 17, wherein said annealing step to convert a second portion of said source region and convert a second portion of said drain region comprises the step of annealing said substrate to convert the second portion of said source region and convert the second portion of said drain region to monocrystalline cobalt-disilicide.

22. The method of forming an insulated-gate transistor according to claim 13, wherein said annealing step is performed to convert a first portion of said source region, opposite said channel region, to cobalt-disilicide and convert a first portion of said drain region, opposite said channel region, to cobalt-disilicide, without converting a portion of said source region adjacent said channel region to cobalt-disilicide and without converting a portion of said drain region adjacent said channel region to cobalt-disilicide.

23. The method of forming an insulated-gate transistor according to claim 14, wherein said step of annealing said substrate to convert a second portion of said source region and said drain region to cobalt-disilicide is performed without converting a portion of said source region adjacent said channel region to cobalt-disilicide and without converting a portion of said drain region adjacent said channel region to cobalt-disilicide.

24. The method of forming an insulated-gate transistor according to claim 14, wherein said source and drain regions are of first conductivity type and said channel region is of second conductivity type, opposite said first conductivity type;

wherein the step of annealing said substrate to convert a second portion of said source region to cobalt-disilicide is performed so that a silicon region of first conductivity type is provided between said first and second portions of said source region and said channel region; and

wherein said step of annealing said substrate to convert a second portion of said drain region to cobalt-disilicide is performed so that a silicon region of first conductivity type is provided between said first and second portions of said drain region and said channel region.

19. A method of forming a SOI electronic device having cobalt-disilicide contacts, comprising the steps of:

providing a silicon-on-insulator substrate having an insulating underlayer and a silicon outerlayer thereon;

forming an electronic device having a plurality of active regions in said silicon outerlayer; and

forming a cobalt-disilicide contact to at least one of said active regions by;

forming a first bimetallic capping layer containing cobalt on said active region;

annealing said substrate to convert a first portion of said active region to cobalt-disilicide;

forming a second bimetallic capping layer containing cobalt-silicide on said first portion; and

annealing said substrate to convert a second portion of said active region, between said first portion and said insulating underlayer, to cobalt-disilicide.

20. The method of forming a SOI electronic device according to claim 19, wherein said first bimetallic capping layer forming step comprises the steps of:

depositing a first layer containing titanium on said active region; and

depositing a second layer containing cobalt on said first layer.

21. The method of forming a SOI electronic device according to claim 20, wherein said second capping layer forming step comprises the steps of:

depositing a third layer containing titanium on said first portion; and

depositing a fourth layer containing cobalt-silicide on said third layer.