×

Electrostatic wafer clamp

  • US 5,452,177 A
  • Filed: 01/31/1995
  • Issued: 09/19/1995
  • Est. Priority Date: 06/08/1990
  • Status: Expired due to Term
First Claim
Patent Images

1. Apparatus for electrostatic clamping of a workpiece, comprising:

  • a platen having a substantially circular, electrically insulating clamping surface for receiving a workpiece and at least six platen sectors each having a conductive electrode underlying and electrically isolated from said clamping surface said electrodes being configured in pairs symmetrically disposed about a center of said clamping surface, said clamping surface comprising a dielectric material selected to avoid sticking of the workpiece thereto after clamping; and

    clamping control means for applying AC voltages to said electrodes when clamping of the workpiece is desired, the workpiece being electrostatically clamped in a fixed position on said clamping surface when said AC voltages are applied to said electrodes, said clamping control means comprising means for generating at least six bipolar square wave voltages having relative phases of 0°

    , 60°

    , 120°

    , 180°

    , 240° and

    300°

    , said square wave voltages defining a first set having phases 0° and

    180°

    , a second set having phases 60° and

    240°

    , and a third set having phases 120° and

    300°

    each of said sets including positive and negative, equal amplitude, bipolar square wave voltages that are one half cycle out of phase, each of said bipolar square wave voltages having a predetermined switching speed selected to limit transients which could potentially damage the workpiece, and means for coupling said sets of square wave voltages to said Symmetrically disposed electrode pairs so as to provide symmetrical clamping of said workpiece to said clamping surface providing reliable high speed clamping with reduced risk of damage to said workpiece.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×