Method of computing multi-conductor parasitic capacitances for VLSI circuits

• US 5,452,224 A
• Filed: 08/07/1992
• Issued: 09/19/1995
• Est. Priority Date: 08/07/1992
• Status: Expired due to Fees

• Current Assignee: Hughes Aircraft Company (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Smith, William R. Jr., Beaven, Michael W., Brodie, Richard A.
• Primary Examiner(s): Teska, Kevin J.
• Assistant Examiner(s): NGUYEN, TAN QUANG
• Application Number:
  US07/926,977
• Time in Patent Office: 1,138 Days
• Field of Search: 364/488, 364/489, 364/490, 364/491, 364/578, 324/686, 324/687, 395/919, 395/920, 395/921, 395/922, 307/303.1, 250/492.2
• US Class Current: 716/115
• CPC Class Codes: G06F 30/398 Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] optical proximity correction [OPC] design processes G03F1/36

Abstract

A method of computing parasitic capacitances between multiple electrical conductors within an electric circuit computes a division of the circuit'"'"'s physical layout into a plurality of windows. The parasitic capacitances associated with the conductors of each window are computed, and the results for the various windows combined into a matrix of parasitic capacitances for the overall circuit. The windows are preferably overlapped, with the capacitance values for conductor pairs located in more than one window averaged. Complex polygons are fractured into simpler shapes by extending a ray from a vertex of the polygon to intersect an opposed segment, and defining the peripheries of the simpler elements as comprising the ray and respective different portions of the original polygon'"'"'s periphery. Rays may be extended in a x,y pattern from multiple vertices of the polygon until a ray is located that extends through the polygon'"'"'s interior, with the fracturing performed along that ray. Fracturing preferably continues until all of the elements are reduced to Manhattan-oriented rectangles or triangles. Where one element overlaps another element in another plane, fracturing is performed along a projection of the overlapping edge on the second element to reduce inaccuracies in the approximated charge density on the overlapped element.

Claims

1. A method of designing and fabricating an electrical circuit, comprising the steps of:

producing a tentative electrical circuit design having a physical layout,

computing parasitic capacitances between multiple electrical conductors within said electrical circuit design by;

computing a division of the physical layout of said electrical circuit design into a plurality of windows in which at least one of said windows overlays at least one other of said windows, with at least some of said windows including respective pluralities of electrical conductors and at least one of said overlaps including at least one pair of electrical conductors,

for each window, determining the parasitic capacitance values associated with the electrical conductors of that window by the method of partial capacitances, and

combining the parasitic capacitance values of said windows, and averaging the parasitic capacitance values of electrical conductor pairs included in a window overlap between the windows forming said overlap, to obtain a set of parasitic capacitances for said electrical circuit,

adjusting said tentative circuit design to correct for any excessive computed parasitic capacitances, and

fabricating electrical circuits in accordance with said adjusted circuit design.

2. The method of claim 1, wherein said windows have physical dimensions that are on the order of the distance parasitic capacitances between the conductors of said over which electrical conductors within said electrical circuit have a parasitic capacitance between them that is more than de minimis.

3. The method of claim 2, wherein at east some of said electrical conductors have shapes that are non-rectangular and non-triangular multi-vertex polygons, a division of each said multi-vertex polygon into simpler rectangular and/or triangular elements is calculated, and said windows are overlapped so that pairs of said simpler elements which have substantial potential coefficients between them that is more than de minimis are included together in at least one of said windows.

4. The method of claim 1, wherein at least some of said electrical conductors comprise non-rectangular and non-triangular multi-vertex polygons, further comprising the step of computing the division of each said multi-vertex polygon into respective pluralities of simpler geometric elements by:

extending a ray from a vertex of said multi-vertex polygon through the multi-vertex polygon to intersect an opposed segment of the multi-vertex polygon,

defining the peripheries of said simpler geometric elements as comprising said ray and respective different portions of the periphery of said multi-vertex polygon, and

wherein the parasitic capacitance values are determined for said simpler geometric elements,

whereby said computing of parasitic capacitances is simplified and can be accomplished with increased speed.

5. The method of claim 4, wherein rays are extended from multiple vertices of said multi-vertex polygon to locate a vertex from which a ray extends through the interior of the multi-vertex polygon to intersect an opposed segment of the multi-vertex polygon, and said simpler geometric elements are defined from said located vertex.

6. The method of claim 5, wherein said elements are defined from a located vertex whose ray intersects an odd number of opposed segments of said multi-vertex polygon.

7. The method of claim 5, wherein rays are not extended from vertices that lie along overlapping segments of said multi-vertex polygon.

8. The method of claim 4, wherein a plurality of rays are extended from said vertex to intersect respective opposed segments of said multi-vertex polygon, the periphery of said multi-vertex polygon together with said rays establishing two outer geometric elements and at least one inner geometric element, the outer geometric elements being defined by respective rays and the portion of the multi-vertex polygon'"'"'s periphery between said vertex and the respective intersection points of said rays, and the inner geometric elements being defined by respective pairs of successive rays and the portion of the multi-vertex polygon'"'"'s periphery between the intersection points of said successive rays.

9. The method of claim 8, wherein said rays are extended from said vertex in an x,y coordinate pattern.

10. The method of claim 8, wherein a first one of said geometric elements is defined by progressing from said vertex along the periphery of said multi-vertex polygon to the intersection of a first ray and back along said ray to the vertex;

subsequent geometric elements up to the last element are defined by progressing from said vertex along the ray for the previous element to the periphery of the multi-vertex polygon, along said periphery to the intersection of the next ray and back along said next ray to the vertex; and

the last geometric element is defined by progressing from said vertex along the ray for the previous element to the periphery of the multi-vertex polygon, and along said periphery back to said vertex.

11. The method of claim 4, for use with electrically conductive multi-vertex polygons in generally parallel but mutually spaced planes in which an edge of a first conductive multi-vertex polygon in one plane is aligned with the interior of a second conductive multi-vertex polygon in the other plane, wherein said second conductive multi-vertex polygon is divided into geometric elements of which at least some have a common edge that lies along a projection of said first conductive polygon edge onto the second conductive multi-vertex polygon, with none of the interiors of said geometric elements traversed by said projected edge of the first conductive multi-vertex polygon.

12. The method of claim 11, in which said projected edge of the first conductive multi-vertex polygon extends only partially through the interior of said second conductive multi-vertex polygon, wherein said projected edge is extended to the periphery of said second conductive multi-vertex polygon in dividing said multi-vertex polygon into geometric elements.

13. The method of claim 1, further comprising the steps of generating a preliminary set of parasitic capacitance values between said multiple electrical conductors, storing said preliminary set of parasitic capacitance values in a storage element, substituting said computed parasitic capacitance values for said stored preliminary set of parasitic capacitance values in said storage element, and simulating said electrical circuit using said substituted parasitic capacitance values from said storage element.

14. A method of computing the division of an electrically conductive, multi-vertex polygon in an electrical circuit into a plurality of simpler geometric elements in order to facilitate the computation of parasitic capacitances within said electrical circuit by the method of partial capacitances, comprising:

establishing a mutually orthogonal x-y coordinate system

extending a ray from a vertex of said polygon through the polygon in an x or y direction to intersect an opposed segment of the polygon, and thereby establish subpolygons of said poly on that are bounded in part by said ray,

determining whether said subpolygons are all either triangles or Manhattan-oriented rectangles based upon said coordinate system,

if said determination is positive, defining the peripheries of said simpler geometric elements as comprising said subpolygons, and

if said determination is negative, extending at least one additional ray from at least one vertex of said polygon through respective subpolygons in an x or y direction to intersect respective opposed segments of the polygon and thereby establish additional subpolygons, bounded in part by their respective additional rays, until said polygon is divided into a set of subpolygons that are all either triangles or Manhattan-oriented rectangles based upon said x-y coordinate system.

15. The method of claim 14, wherein rays are extended from multiple vertices of said polygon to locate a vertex from which a ray extends through the interior of the polygon to intersect an opposed segment of the polygon, and said simpler geometric elements are defined from said located vertex.

16. The method of claim 15, wherein said elements are defined from a located vertex whose ray intersects an odd number of opposed segments of said polygon.

17. The method of claim 15, wherein rays are not extended from vertices that lie along overlapping segments of said polygon.

18. The method of claim 14, wherein a plurality of rays are extended from said vertex to intersect respective opposed segments of said polygon, the periphery of said polygon together with said rays establishing two outer geometric elements and at least one inner geometric element, the outer geometric elements being defined by respective rays and the portion of the polygon'"'"'s periphery between said vertex and the respective intersection points of said rays, and the inner geometric elements being defined by respective pairs of successive rays and the portion of the polygon'"'"'s periphery between the intersection points of said successive rays.

19. The method of claim 18, wherein rays are extended from said vertex in an x,y coordinate pattern.

20. The method of claim 18, wherein a first one of said geometric elements is defined by progressing from said vertex along the periphery of said polygon to the intersection of a first ray and back along said ray to the vertex;

subsequent geometric elements up to the last element are defined by progressing from said vertex along the ray for the previous element to the periphery of the polygon, along said periphery to the intersection of the next ray and back along said next ray to the vertex; and

the last geometric element is defined by progressing from said vertex along the ray for the previous element to the periphery of the polygon, and along said periphery back to said vertex.

21. The method of claim 15, for use with electrically conductive polygons in generally parallel but mutually spaced planes in which an edge of a first conductive polygon in one plane is aligned with the interior of a second conductive polygon in the other plane, wherein said second conductive polygon is divided into geometric elements of which at least some have a common edge that lies along a projection of said first conductive polygon edge onto the second conductive polygon, with none of the interiors of said geometric elements traversed by said projected edge of the first conductive polygon.

22. The method of claim 21, in which said projected edge of the first conductive polygon extends only partially through the interior of said second conductive polygon, wherein said projected edge is extended to the periphery of said second conductive polygon in dividing said polygon into geometric elements.

23. A method of designing and fabricating an electrical circuit, comprising the steps of:

producing a tentative electrical circuit design having a physical layout with a plurality of electrically conductive polygons in respective planes,

computing the parasitic capacitance between a first electrically conductive polygon in a first plane and a second electrically conductive polygon in a second plane that is generally parallel to but spaced from the first plane, in which an edge of the first polygon is aligned with the interior of the second polygon, by;

dividing said second conductive polygon into a plurality of geometric elements, with at least some of said geometric elements having a common edge that is aligned with said first conductive polygon edge, and none of the interiors of said geometric elements overlapping said first conductive polygon edge, and

determining separately for each of the geometric elements of said second conductive polygon, by the method of partial capacitances, the parasitic capacitance associated with said first conductive polygon and the geometric elements of said second conductive polygon,

adjusting said tentative circuit design to correct for any excessive computed parasitic capacitances, and

fabricating electrical circuits in accordance with said adjusted circuit design.

24. The method of claim 23, in which said projected edge of the first conductive polygon extends only partially through the interior of said second conductive polygon, wherein said projected edge is extended to the periphery of said second conductive polygon in dividing said polygon into geometric elements.

25. A computer programmed to compute parasitic capacitances between multiple electrical conductors within an electrical circuit that has a known physical layout, said computer comprising:

means for computing a division of the physical layout of said electrical circuit into a plurality of windows in which at least one of said windows overlays at least one other of said windows, with at least some of said windows including respective pluralities of electrical conductors and at least one of said overlaps including at least one pair of electrical conductors,

means for determining for each window, the parasitic capacitance values associated with the electrical conductors of that window by the method of partial capacitances, and

means for combining the parasitic capacitance values of said windows, and averaging the parasitic capacitance values of electrical conductor pairs included in a window overlap between the windows forming said overlap, to obtain a set of parasitic capacitances for said electrical circuit.

26. A computer programmed to compute the parasitic capacitance between a first electrically conductive polygon in a first plane and a second electrically conductive polygon in a second plane that is generally parallel to but spaced from the first plane, in which an edge of the first polygon is aligned with the interior of the second polygon, said computer comprising:

means for dividing said second conductive polygon into a plurality of geometric elements, with at least some of said geometric elements having a common edge that is aligned with said first conductive polygon edge, and none of the interiors of said geometric elements overlapping said first conductive polygon edge, and

means for determining separately for each of the geometric elements of said second conductive polygon, by the method of partial capacitances, the parasitic capacitance associated with said first conductive polygon and the geometric elements of said second conductive polygon.

27. A machine having a memory which contains data representing a set of parasitic capacitances between multiple electrical conductors within an electrical circuit that has a known physical layout, said data generated by the method of:

computing a division of the physical layout of said electrical circuit into a plurality of windows in which at least one of said windows overlays at least one other of said windows, with at least some of said windows including respective pluralities of electrical conductors and at least one of said overlaps including at least one pair of electrical conductors,

determining, for each window, the parasitic capacitance values associated with the electrical conductors of that window by the method of partial capacitances, and

combining the parasitic capacitance values of said windows, and averaging the parasitic capacitance values of electrical conductor pairs included in a window overlap between the windows forming said overlap.

28. A machine having a memory which contains data representing a set of parasitic capacitance between a first electrically conductive polygon in a first plane and a second electrically conductive polygon in a second plane that is generally parallel to but spaced from the first plane, in which an edge of the first polygon is aligned with the interior of the second polygon, said data generated by the method of:

dividing said second conductive polygon into a plurality of geometric elements, with at least some of said geometric elements having a common edge that is aligned with said first conductive polygon edge, and none of the interiors of said geometric elements overlapping said first conductive polygon edge, and

determining separately for each of the geometric elements of said second conductive polygon, by the method of partial capacitances, the parasitic capacitance associated with said first conductive polygon and the geometric elements of said second conductive polygon.

29. A method of computing the division of electrically conductive, multi-vertex polygons in an electrical circuit into respective pluralities of simpler geometric elements in order to facilitate the computation of parasitic capacitances within said electrical circuit by the method of partial capacitances, for use with electrically conductive polygons in generally parallel but mutually spaced planes in which an edge of a first conductive polygon in one plane is aligned with the interior of a second conductive polygon in the other plane, comprising:

dividing said first conductive polygon into simpler geometric elements, and

dividing said second conductive polygon into geometric elements of which at least some have a common edge that lies along a projection of said first conductive polygon edge onto the second conductive polygon, with none of the interiors of said second polygon'"'"'s geometric elements traversed by said projected edge of the first conductive polygon.