×

Method of detecting defects in semiconductor package leads

  • US 5,452,368 A
  • Filed: 08/02/1993
  • Issued: 09/19/1995
  • Est. Priority Date: 08/02/1993
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of detecting defects in leads of a semiconductor package comprising:

  • providing a first semiconductor package having a first conductive line;

    acquiring a first grey level image of the first conductive line;

    providing a second semiconductor package having a second conductive line;

    acquiring a second grey level image of the second conductive line;

    converting the first grey level image to a first edge feature image;

    converting the second grey level image to a second edge feature image;

    skeletonizing the first edge feature image to form a first skeletonized image;

    dilating the second edge feature image to form a first dilated image;

    comparing the first skeletonized image to the first dilated image;

    detecting shapes in the first skeletonized image that are not contained within the first dilated image;

    skeletonizing the second edge feature image to form a second skeletonized image;

    dilating the first edge feature image to form a second dilated image;

    comparing the second skeletonized image to the second dilated image; and

    detecting shapes in the second skeletonized image that are not contained within the second dilated image.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×