Device for cooling power electronics
First Claim
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1. A cooling device comprising:
- a plate having a surface defining a plane of the plate, the surface being adapted to support a power electronic component;
a recess formed in the surface of the plate;
means for securing the power electronic component to the plate, the securing means being adapted to position the power electronic component on the surface of the plate so as to enclose the recess with a base surface of the power electronic component;
a passage formed in the plate for transporting a fluid to and from the recess;
first means disposed in the passage for deflecting and diverting the fluid as the fluid flows from an upstream portion of the passage and into the recess so as to direct the fluid into the recess at an acute angle relative to the plane of the plate; and
second means disposed in the passage for deflecting and diverting the fluid as the fluid flows from the recess into a downstream portion of the passage, so as to direct the fluid into the downstream portion of the passage at an angle from the plane of the plate.
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Abstract
A heatsink or cold plate is provided with which power electronic components mounted to a surface of the cold plate can be cooled with a cooling fluid flowing through the cold plate. The cold plate generally consists of a relatively planar structure through which one or more passages are formed for directing the cooling fluid through the cold plate. The passages direct the cooling fluid to recesses in the surface of the cold plate which are enclosed by the power electronic components. As such, cooling of the power electronic components is achieved by directly impinging the cooling fluid at their lower surfaces, preferably at an acute angle, such that enhanced heat transfer characteristics result.
70 Citations
12 Claims
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1. A cooling device comprising:
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a plate having a surface defining a plane of the plate, the surface being adapted to support a power electronic component; a recess formed in the surface of the plate; means for securing the power electronic component to the plate, the securing means being adapted to position the power electronic component on the surface of the plate so as to enclose the recess with a base surface of the power electronic component; a passage formed in the plate for transporting a fluid to and from the recess; first means disposed in the passage for deflecting and diverting the fluid as the fluid flows from an upstream portion of the passage and into the recess so as to direct the fluid into the recess at an acute angle relative to the plane of the plate; and second means disposed in the passage for deflecting and diverting the fluid as the fluid flows from the recess into a downstream portion of the passage, so as to direct the fluid into the downstream portion of the passage at an angle from the plane of the plate. - View Dependent Claims (2, 3, 4, 5)
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6. A cooling device comprising:
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a plate having a surface; a power electronic component secured to the surface of the plate, the power electronic component having a base surface abutting the surface of the plate; a recess formed in the plate beneath the power electronic component, such that the base surface of the power electronic component forms an interior surface of the recess; a passage formed in the plate for transporting a fluid to and from the recess; first means disposed in the passage for deflecting and diverting the fluid as the fluid flows from an upstream portion of the passage and into the recess so as to direct the fluid into the recess at an acute angle relative to the base surface of the power electronic component; and second means disposed in the passage for deflecting and diverting the fluid as the fluid flows from the recess into a downstream portion of the passage so as to direct the fluid into the downstream portion of the passage at an angle from the base surface of the power electronic component; whereby the fluid impinges the base surface of the power electronic component such that the power electronic component transfers heat directly to the fluid without an intermediate thermal conductor therebetween. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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Specification