Tab tape

• US 5,453,913 A
• Filed: 04/26/1994
• Issued: 09/26/1995
• Est. Priority Date: 05/28/1993
• Status: Expired due to Fees

• Current Assignee: 3M Company
• Original Assignee: 3M Company
• Inventors: Koyanagi, Tatsunori
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Thomas, L.
• Application Number:
  US08/233,334
• Time in Patent Office: 518 Days
• Field of Search: 174/52.5, 174/52.4, 174/262, 174/266, 361/728, 361/813, 29/827
• US Class Current: 361/813
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

A TAB tape having multiple metallic conductors arranged on the surface of a base film with substantially square device holes is formed with designed areas of stress refief formed by one or more slits and/or arrays of holes which extend outward from the corners or sides of the device holes, such that dimensional stability in the base film is improved in a direction parallel to inner leads when thermo-compression bonding is performed to connect the inner leads with IC chips resulting in improved connection reliability for connection between inner leads and IC chips.

Claims

1. A tape automated bonding tape having a plurality of metallic conductors arranged on one surface of a base film having generally square device holes each device hole having a plurality of sides and corners connecting said sides, and means defining areas of stress relief formed to extend about the sides of said device holes for improving dimensional stability, said means defining areas including slits extending parallel to said sides of said device holes and slits extending outward from said corners of said device holes, wherein said tape has a two-ply structure in which an adhesive layer is interposed between said metallic conductors and a base film.