Hermetically sealed pressure sensor and method thereof

• US 5,454,270 A
• Filed: 06/06/1994
• Issued: 10/03/1995
• Est. Priority Date: 06/06/1994
• Status: Expired due to Term

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Wallace, Daniel J. Jr., Velez, Mario F., Brown, Clem H.
• Primary Examiner(s): Chilcot, Jr., Richard E.
• Assistant Examiner(s): Artis, Jewel V.
• Application Number:
  US08/254,849
• Time in Patent Office: 484 Days
• Field of Search: 73/720, 73/721, 73/754, 73/726, 73/727
• US Class Current: 73/720
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14

Abstract

A differential pressure sensor (10) has a sensor die (16) attached to a stress isolation package base (12) with a bonding glass (27) having a similar coefficient of thermal expansion. The bonding glass, and alternately an aluminum layer, provides a hermetic seal between the stress isolation base and sensor die. Pressure is applied to the sensor die port (24). A plastic housing (14) is attached to the stress isolation base with an adhesive (29). A port (23) in the plastic housing is filled with a silicone gel (22). A second pressure source is transferred by way of the silicone gel to the sensor die. Any hostile chemical entering the via contacts the first surface of the sensor die to assert pressure against a transducer circuit (25) to generate the electrical signals representative of the applied pressure but are isolated from the sensitive interconnects by the hermetic seal.

Claims

1. A differential pressure sensor, comprising:

a base having a first port for receiving a first pressure, said base having a coefficient of thermal expansion;

a sensor die mounted to said base and coupled for receiving said first pressure from said first port, said sensor die having a coefficient of thermal expansion similar to said coefficient of thermal expansion of said base;

a glass bonding agent disposed between said sensor die and said base for providing a hermetic seal between said sensor die and said base, said glass bonding agent having a coefficient of thermal expansion similar to said coefficients of thermal expansion of said base and said sensor die for diminishing effects of thermal stress upon said sensor die; and

a plastic housing having a second port positioned over said sensor die for receiving a second pressure, said plastic housing having a mating surface attached to a mating surface of said base.

2. The differential pressure sensor of claim 1 wherein said base is made of a ceramic having a coefficient of thermal expansion similar to said sensor die.

3. The differential pressure sensor of claim 2 further including a silicone gel disposed in said second port of said plastic housing.

4. The differential pressure sensor of claim 3 wherein said sensor die includes:

a transducer diaphragm that flexes in response to a difference of said first and second pressures;

a piezoresistive transducer circuit mounted to said transducer diaphragm that changes resistance in response to said flexing of said transducer diaphragm; and

a bonding-wire coupled between a tap point of said transducer circuit and a conductive lead of said plastic housing.

5. The differential pressure sensor of claim 4 wherein said plastic housing attaches to said mating surface of said base with an adhesive made of an epoxy that provides stress isolation by allowing thermal expansion of said plastic housing.

6. A method of sealing a differential pressure sensor, comprising the steps of:

providing a base with a port for receiving a first pressure, said base having a coefficient of thermal expansion;

mounting a sensor die on said base with a glass bonding agent to provide a hermetic seal between said sensor die and said base while said sensor die receives said first pressure, said sensor die and said glass bonding agent each having a coefficient of thermal expansion that is similar to said coefficient of thermal expansion of said base to diminish effects of thermal stress upon said sensor die; and

providing a plastic housing with a port positioned over said sensor die for receiving a second pressure; and

mounting a mating surface of said plastic housing to a mating surface of said.

7. The method of claim 6 wherein said base is made of a ceramic having a coefficient of thermal expansion similar to said sensor die.

8. The method of claim 7 further including the step of filling said second port of said plastic housing with a silicone gel for transferring said second pressure to said sensor die.

9. The method of claim 8 further including the steps of:

providing a transducer diaphragm that flexes in response to a difference of said first and second pressures;

providing a piezoresistive transducer circuit mounted to said transducer diaphragm that changes resistance in response to said flexing of said transducer diaphragm; and

providing a bonding wire coupled between a tap point of said transducer circuit and a conductive lead of said plastic housing.

10. The method of claim 9 further including the step of attaching said plastic housing to said mating surface of said base with an adhesive made of an epoxy that provides stress isolation by allowing thermal expansion of said plastic housing.

11. A differential pressure sensor, comprising:

a stress isolation base having a mating surface and having a port for receiving a first pressure;

a sensor die mounted to said stress isolation base and coupled for receiving said first pressure;

an aluminum layer disposed on said stress isolation base;

a bonding agent disposed between said aluminum layer and said sensor die for providing a hermetic seal between said sensor die and said stress isolation base;

a plastic housing having a port positioned over said sensor die for receiving a second pressure, said plastic housing having a mating surface attached to said mating surface of said stress isolation base; and

a silicone gel disposed in said port of said plastic housing.

12. The differential pressure sensor of claim 11 wherein said stress isolation base is made of a ceramic having a having a coefficient of thermal expansion similar to said sensor die.

13. The differential pressure sensor of claim 12 wherein said bonding agent is made of glass.

14. The differential pressure sensor of claim 13 wherein said sensor die includes a transducer diaphragm that flexes in response to a difference of said first and second pressures.

15. The differential pressure sensor of claim 14 wherein said sensor die includes a piezoresistive transducer circuit mounted to said transducer diaphragm that changes resistance in response to said flexing of said transducer diaphragm.

16. The differential pressure sensor of claim 15 wherein said sensor die includes a bonding wire coupled between a tap point of said transducer circuit and a conductive lead of said plastic housing.

17. The differential pressure sensor of claim 16 wherein said plastic housing attached to said mating surface of said stress isolation base with an adhesive made of an epoxy that provides stress isolation by allowing thermal expansion of said plastic housing.