Process of activating anti-microbial materials

• US 5,454,886 A
• Filed: 11/18/1993
• Issued: 10/03/1995
• Est. Priority Date: 11/18/1993
• Status: Expired due to Term

• Current Assignee: NUCRYST Pharmaceuticals Corp. (The Westaim Corporation)
• Original Assignee: Westaim Technologies Inc.
• Inventors: McIntosh, Catherine L., Burrell, Robert E., Morris, Larry R.
• Primary Examiner(s): CRISPINO, RICHARD D
• Application Number:
  US08/154,490
• Time in Patent Office: 684 Days
• Field of Search: 148/565, 623/11, 623/66
• US Class Current: 148/565
• CPC Class Codes: A01N 2300/00 Combinations or mixtures of active ingredients covered by classes A01N27/00 - A01N65/48 with other active or formulation relevant ingredients, e.g. specific carrier materials or surfactants, covered by classes A01N25/00 - A01N65/48
• CPC Class Codes: A01N 41/08 Sulfonic acid halides; alpha-Hydroxy-sulfonic acids; Amino-sulfonic acids; Thiosulfonic acids; Derivatives thereof
• CPC Class Codes: A01N 43/78 1,3-Thiazoles; Hydrogenated 1,3-thiazoles
• CPC Class Codes: A01N 43/80 five-membered rings with one nitrogen atom and either one oxygen atom or one sulfur atom in positions 1,2
• CPC Class Codes: A01N 47/30 Derivatives containing the group >N—CO—N aryl or >N—CS—N—aryl
• CPC Class Codes: A01N 59/16 Heavy metals; Compounds thereof
• CPC Class Codes: A01N 59/26 Phosphorus; Compounds thereof
• CPC Class Codes: A61B 2018/00119 with metal oxide nitride
• CPC Class Codes: A61L 17/145 Coating
• CPC Class Codes: A61L 29/106 Inorganic materials other than carbon
• CPC Class Codes: C23C 14/0036 Reactive sputtering
• CPC Class Codes: C23C 14/025 Metallic sublayers
• CPC Class Codes: C23C 14/06 characterised by the coating material C23C14/0021 , C23C14/04 take precedence
• CPC Class Codes: C23C 14/0688 Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/14 Metallic material, boron or silicon
• CPC Class Codes: C23C 14/16 on metallic substrates or on substrates of boron or silicon
• CPC Class Codes: C23C 14/588 by mechanical treatment
• CPC Class Codes: Y10S 623/924 Material characteristic

Abstract

Anti-microbial coatings and powders and method of forming same on medical devices are provided. The coatings are formed by depositing an anti-microbial biocompatible metal by vapour deposition techniques to produce atomic disorder in the coating such that a sustained release of metal ions sufficient to produce an anti-microbial effect is achieved. Preferred deposition conditions to achieve atomic disorder include a lower than normal substrate temperature, and one or more of a higher than normal working gas pressure and a lower than normal angle of incidence of coating flux. Anti-microbial powders formed by mechanical working to produce atomic disorder are also provided. The anti-microbial effect of the coatings or powders may be further activated or enhanced by irradiating with a low linear energy transfer form of radiation such as gamma radiation.

Claims

1. A method of forming an anti-microbial material containing one or more anti-microbial metals, said method comprising:

creating atomic disorder in a material containing one or more anti-microbial metals under conditions which limit diffusion for retaining atomic disorder therein to provide sustained release of atoms, ions, molecules or clusters of at least one of the metals into an alcohol or water based electrolyte at an enhanced rate relative to the material in its normal ordered crystalline state; and

irradiating the material with a low linear energy transfer form of radiation to release at least one anti-microbial metal at a concentration sufficient to provide a localized anti-microbial effect.

2. The method as set forth in claim 1, wherein the anti-microbial metal is selected from the group consisting of Ag, Au, Pt, Pd, Ir, Sn, Cu, Sb, Bi, Zn, alloys thereof, and compounds thereof.

3. The method as set forth in claim 2, wherein the material is a powder or foil of one or more of the anti-microbial metals, and wherein the atomic disorder is formed by cold working of the powder or foil.

4. The method as set forth in claim 2, wherein the material is formed as a coating on a substrate by vapour deposition under conditions which limit diffusion during deposition and which limit annealing or recrystallization following deposition.

5. The method as set forth in claim 3, wherein the material is a nanocrystalline powder.

6. The method as set forth in claim 4, wherein the material is formed by vacuum evaporation, sputtering, magnetron sputtering or ion plating.

7. The method as set forth in claim 4, wherein the coating is formed by magnetron sputtering at conditions such that the ratio of the temperature of the surface being coated to the melting point of the anti-microbial material being deposited is less than about 0.5, and the working gas pressure is greater than about 10 mT.

8. The method as set forth in claim 6, wherein the anti-microbial material is a composite coating formed by co-, sequentially or reactively depositing an anti-microbial metal in a matrix with atoms or molecules of a different material to create atomic disorder in the matrix, said different material being deposited as one or more members selected from the group consisting of oxygen, nitrogen, hydrogen, boron, sulphur or halogen absorbed or trapped in the matrix from the atmosphere of the vapour deposition;

an oxide, nitride, carbide, boride, halide, sulphide or hydride of an anti-microbial metal; and

an oxide, nitride, carbide, boride, halide, sulphide or hydride of an inert biocompatible metal selected from the group consisting of Ta, Ti, Nb, V, Hf, Zn, Mo, Si, and Al.

9. The method as set forth in claim 8, wherein the anti-microbial metal is silver and said different material is one or both of silver oxide and atoms or molecules containing oxygen trapped or absorbed in the matrix from the atmosphere of the vapour deposition.

10. The method as set forth in claim 8, wherein the coating is formed by magnetron sputtering at conditions such that the ratio of the temperature of the surface being coated to the melting point of the anti-microbial material being deposited is less than about 0.5, and the working gas pressure is greater than about 10 mT.

11. The method as set forth in claim 9, wherein the coating is formed by magnetron sputtering at conditions such that the ratio of the temperature of the surface being coated to the melting point of the anti-microbial material being deposited is less than about 0.5, and the working gas pressure is greater than about 10 mT.

12. The process as set forth in claim 1, 3 or 6, wherein the form of radiation is selected from gamma, beta and x-rays.

13. The process as set forth in claim 1, 3 or 6, wherein the source of radiation is gamma radiation, used at a dose of greater than about 1 Mrad.

14. The process as set forth in claim 1, 3 or 6, wherein the anti-microbial material being irradiated is oriented substantially perpendicular to the incoming radiation.

15. The process as set forth in claim 1, 3 or 6, wherein the material is placed adjacent to a dielectric material during irradiation.

16. The process as set forth in claim 1, 3 or 6, wherein the material is sandwiched between silicon oxide surfaces during irradiation.