Method of providing sacrificial spacer for micro-mechanical devices

• US 5,454,906 A
• Filed: 06/21/1994
• Issued: 10/03/1995
• Est. Priority Date: 06/21/1994
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Baker, James C., Prengle, Scott H.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/263,208
• Time in Patent Office: 469 Days
• Field of Search: 156/655, 156/659.1, 156/668, 359/223, 359/291, 437/229
• US Class Current: 216/66
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G03F 7/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K

Abstract

A method of fabricating micro-mechanical devices that use support elements (13) raised from a substrate (15), to support moveable elements (11). First, support elements (13) having reflective top surfaces (31) are fabricated. A layer of photoresist material (41) is then deposited over the support elements (13), to a thickness that substantially covers their reflective top surfaces (31). The photoresist layer (41) is exposed, which results in the areas (61) over the support elements (13) being more highly exposed than the areas (62) between the support elements (13). This permits a subsequent developing step that can be controlled to the purpose of removing the photoresist between the support elements (13) to a height planar with the reflective top surfaces of the support elements, while guaranteeing that the photoresist will be removed over the support elements (13).

Claims

1. A method of fabricating a micro-mechanical device having a moveable element which is movably supported by a support element, the support element being on, and having a free end spaced away from, a substrate, comprising the steps of:

rendering the free end of the support element radiant energy-reflective;

depositing a photoresist layer on the substrate to an initial thickness sufficient to cover the free end of the support element;

flood exposing the free surface of said photoresist layer to radiant energy without the use of a mask;

developing the photoresist to produce a substantially planar, continuous element-supportive surface which includes the free end of the support element and the free surface of the remaining, reduced-in-thickness photoresist;

fabricating the moveable element from materials deposited on the element-supportive surface; and

removing the remaining photoresist.

2. The method of claim 1, wherein at least one of the deposited materials is in contact with the free end of the support element.

3. The method of claim 1, wherein the exposing time relative to the initial thickness of the photoresist layer is less than that required to saturate the photoresist layer.

4. The method of claim 1, wherein the photoresist between the free surface thereof and the free end of the support element is more highly exposed to the radiant energy than the initial thickness of the photoresist so that developing removes the photoresist overlying the free end of the support element at a faster rate than the photoresist overlying the substrate.

5. A method of fabricating a micro-mechanical device having at least one moveable element, using a maskless sacrificial spacer, comprising the steps of:

fabricating on a substrate, at least one support element for supporting said moveable element, said support element extending upwardly from said substrate and having a reflective top surface;

depositing a photoresist layer over said support element and on the surrounding substrate, said photoresist layer having a thickness that is greater than the distance between said reflective top surface and said substrate such that it covers said reflective top surface of said support element;

exposing said photoresist layer with a substantially uniform exposure;

developing said photoresist layer such said photoresist layer is removed down to a height that is substantially the same as the height of said reflective top surface of said support element, thereby forming a substantially planar surface comprised of said reflective top surface of said support element and of the top surface of the remaining photoresist material on said surrounding substrate;

fabricating said moveable element on said planar surface; and

removing said remaining photoresist material after said moveable element has been fabricated.

6. The method of claim 5, wherein said step of fabricating at least one support element is partly performed by depositing a substantially conformal layer of reflective material over said support element and the substrate surrounding said support element.

7. The method of claim 5, wherein said step of fabricating at least one support element is performed by fabricating said support element from a reflective material.

8. The method of claim 5, wherein said step of depositing a photoresist layer is performed by depositing said layer to a thickness of approximately twice the height of said at least one support element.

9. The method of claim 5, further comprising the step of baking said photoresist layer before said developing step.

10. The method of claim 5, further comprising the step of baking said photoresist layer after said developing step.

11. The method of claim 5, wherein said exposing step is performed for a time less than the saturation time of said photoresist layer.

12. The method of claim 5, wherein said micro-mechanical device has an array of micro-mechanical elements, each having at least one support element and at least one moveable element, and wherein said developing step results in spacer areas, comprised of said remaining photoresist material, between said support elements.

13. A method of manufacturing a digital micro-mirror device having at least one deflectable mirror element, comprising the steps of:

fabricating on a substrate, at least one support post for supporting said mirror element, said support post extending upwardly from said substrate and having a reflective top surface;

depositing a photoresist layer over said support post and on the surrounding substrate, said photoresist layer having a thickness such that it covers said reflective top surface of said support post;

exposing said photoresist layer;

developing said photoresist layer such that said photoresist layer is removed down to a height that is substantially the same as the height of said support post, thereby forming a substantially planar surface comprised of said reflective top surface of said support post and of the top surface of the remaining photoresist material on said surrounding substrate;

fabricating said deflectable mirror element on said planar surface; and

removing said remaining photoresist material after said deflectable mirror element has been fabricated.

14. The method of claim 13, wherein said step of fabricating at least one support post is performed by depositing a substantially conformal layer of reflective material over said support post and the substrate surrounding said support post.

15. The method of claim 13, wherein said step of fabricating at least one support post is performed by fabricating said support post from a reflective material.

16. The method of claim 13, wherein said step of depositing a photoresist layer is performed by depositing said layer to a thickness of approximately twice the height of said support post.

17. The method of claim 13, further comprising the step of baking said photoresist layer before said developing step.

18. The method of claim 13, further comprising the step of baking said photoresist layer after said developing step.