Microelectronics unit mounting with multiple lead bonding

• US 5,455,390 A
• Filed: 02/01/1994
• Issued: 10/03/1995
• Est. Priority Date: 02/01/1994
• Status: Expired due to Term

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: DiStefano, Thomas H., Smith, John W. Jr.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Figlin, Cheryl R.
• Application Number:
  US08/190,779
• Time in Patent Office: 609 Days
• Field of Search: 174/251, 174/254, 174/256, 174/257, 174/262, 174/263, 174/264, 174/265, 174/266, 174/267, 361/749, 361/760, 361/772, 361/776, 439/67, 439/77, 257/30
• US Class Current: 174/262
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/4885 Wire-like parts or pins wire ball formation B23K20/00; methods related to connecting semiconductor or other solid state bodies H01L24/00
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49208 : by assembling plural parts

Abstract

A component for mounting semiconductor chips or other microelectronic units includes a flexible top sheet with an array of terminals on it, and with flexible leads extending downwardly from the terminals. A compliant dielectric support layer surrounds the leads, holding the lead tips in precise locations. The leads are desirably formed from wire such as gold wire, and have eutectic bonding alloy on their tips. The component can be laminated to a chip or other unit under heat and pressure to form a complete subassembly with no need for individual bonding to the contacts of the chip. The subassembly can be tested readily and provides compensation for thermal expansion.

Claims

1. A component for forming connections to a microelectronic unit comprising:

(a) a flexible dielectric top sheet having oppositely facing top and bottom surfaces and holes extending through the top sheet;

(b) a plurality of electrically conductive terminals mounted on said top surface of said top sheet;

(c) a compliant dielectric support layer underneath said top sheet, said support layer having a bottom surface remote from said top sheet; and

(d) a plurality of flexible, electrically conductive, elongated leads connected to said terminals through said holes in said top sheet and extending side-by-side downwardly from said terminals through said support layer, each said lead having a lower end adjacent the bottom surface of said support layer, said lower ends of said lead having means for bonding to contacts on a microelectronic unit when the component is engaged with a unit under predetermined temperature and pressure conditions, and thereby electrically connecting said terminals with the contacts on the surface, said support layer surrounding and supporting said leads.

2. A component as claimed in claim 1 wherein said leads are curved.

3. A component as claimed in claim 1 wherein each said lead includes a wire connected to one said terminal.

4. A component as claimed in claim 3 wherein each said wire has a bulbous tip remote from the terminal at the bottom end of the lead and an enlarged transition section at a juncture between the wire and the associated terminal.

5. A component as claimed in claim 4 wherein each said wire is between about 100 microns and about 1000 microns long and between about 25 microns and about 100 microns in diameter remote from said bulbous tip and transition section.

6. A component as claimed in claim 4 wherein each said wire has a bend between said bulbous tip and said transition section.

7. A component as claimed in claim 1 or claim 12 wherein each said lead is formed from a structural metal and each said lead has a bonding metal different from said structural metal on the lower end of the lead, said bonding metal being adapted to form a liquid phase upon exposure to said predetermined temperature.

8. A component as claimed in claim 7 wherein said structural metal includes gold and said bonding metal includes one or more metals selected from the group consisting of tin, silicon and germanium.

9. A component as claimed in claim 1 wherein each said lead is formed from a structural metal and each said lead has a bonding composition including a polymeric material and conductive material dispersed therein on the lower end of the lead, said bonding composition being adapted to form a flowable phase upon exposure to said predetermined temperature.

10. A component as claimed in claim 1 wherein said support layer is an elastomeric layer.

11. A component as claimed in claim 1 A component for forming connections to a microelectronic unit comprising:

(a) a flexible dielectric top sheet having oppositely facing top and bottom surfaces and holes extending through the top sheet;

(b) a plurality of electrically conductive terminals mounted on said top surface of said top sheet;

(c) a support layer underneath said top sheet, said support layer having a bottom surface remote from said top sheet, said support layer being soluble in at least one solvent which does not dissolve said top layer, whereby said support layer can be removed by exposure to such solvent, and;

(d) a plurality of flexible, electrically conductive, elongated leads connected to said terminals through said holes in said top sheet and extending side-by-side downwardly from said terminals through said support layer, each said lead having a lower end adjacent the bottom surface of said support layer, said lower ends of said leads having means for bonding to contacts on a microelectronic unit when the component is engaged with a unit under predetermined temperature and pressure conditions, and thereby electrically connect said terminals with the contacts on the surface, said support layer surrounding and supporting said leads.

12. A component as claimed in claim 1 wherein the bottom end of each said lead is disposed directly beneath the terminal to which such lead is connected, in vertical alignment therewith so that a straight line from the bottom end of each lead to the associated terminal is substantially perpendicular to the top sheet.

13. A component as claimed in claim 1 wherein said leads and terminals are disposed in a substantially regular horizontally-extensive grid.

14. A component as claimed in claim 13 wherein adjacent leads and adjacent terminals are spaced apart from one another by between about 200 microns and about 3000 microns.

15. A component for forming connections to a microelectronic unit comprising:

(a) a dielectric structure having top and bottom surfaces;

(b) a plurality of electrically conductive terminals disposed adjacent said top surface;

(c) a plurality of electrically conductive, elongated leads connected to said terminals and extending downwardly from the terminals through said dielectric structure, each said lead having a lower end at said bottom surface; and

(d) an sealant distributed on said bottom surface, said sealant being adapted to seal the bottom surface of the dielectric structure to a microelectronic unit when the component is juxtaposed with the unit and subjected to predetermined temperature and pressure conditions, said lower ends of said leads including means for bonding to contacts on the surface of the unit under said predetermined temperature and pressure conditions and thereby electrically connect said terminals with the contacts on the surface of the unit.

16. A component as claimed in claim 15 wherein each said lead is formed from a structural metal and has a layer of a bonding material different from said structural metal at its lower end, said bonding material being adapted to form a liquid phase upon exposure to said predetermined temperature.

17. A component as claimed in claim 16 wherein said bonding material is a bonding metal different from said structural metal.

18. A component as claimed in claim 17 wherein said bonding metal is adapted to form a low melting point alloy with said structural metal.

19. A component as claimed in claim 18 wherein said structural metal includes gold and said bonding metal includes an alloy of gold with at least one metal selected from the group consisting of tin, germanium and silicon.

20. A component as claimed in claim 15 wherein said dielectric structure includes a flexible top layer and a compliant support layer disposed beneath said top layer, said terminals being mounted on said top layer, said leads extending through said support layer, said leads being flexible.

21. A component as claimed in claim 20 wherein each said lead is curved.

22. A component as claimed in claim 15 wherein said bottom surface is substantially planar.

23. A component as claimed in claim 15 wherein said sealant includes an adhesive adapted to bond to said microelectronic unit and to said dielectric structure upon exposure to said predetermined temperature and pressure conditions.