Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
First Claim
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1. A method of producing packaged integrated circuit devices comprising the steps of:
- producing a plurality of integrated circuits on a wafer having first and second planar surfaces, each of the integrated circuits comprising a multiplicity of pads;
separating the integrated circuits from each other so as to define edges thereof and generally surrounding said integrated circuits on said edges and on said first and second planar surfaces with generally the same protective sealant and waferwise attaching to said protective sealant adjacent both of said surfaces a layer of protective material, thereby producing a waferwise sandwich; and
thereafter slicing the waferwise sandwich, thereby to define a plurality of prepackaged integrated circuit devices.
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Abstract
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described.
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Citations
46 Claims
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1. A method of producing packaged integrated circuit devices comprising the steps of:
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producing a plurality of integrated circuits on a wafer having first and second planar surfaces, each of the integrated circuits comprising a multiplicity of pads; separating the integrated circuits from each other so as to define edges thereof and generally surrounding said integrated circuits on said edges and on said first and second planar surfaces with generally the same protective sealant and waferwise attaching to said protective sealant adjacent both of said surfaces a layer of protective material, thereby producing a waferwise sandwich; and thereafter slicing the waferwise sandwich, thereby to define a plurality of prepackaged integrated circuit devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of producing packaged integrated circuit devices comprising the steps of:
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producing a plurality of integrated circuits having planar surfaces on a wafer, each of the integrated circuits comprising a multiplicity of pads; separating the integrated circuits from each other so as to define edges thereof and generally surrounding said integrated circuits on their edges and on their planar surfaces with generally the same protective sealant, thereby producing a waferwise sandwich; and thereafter slicing the waferwise sandwich, thereby to define a plurality of prepackaged integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of said multiplicity of pads. - View Dependent Claims (21, 22)
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23. A method of producing packaged integrated circuit devices comprising the steps of:
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producing a plurality of integrated circuits on a wafer having first and second planar surfaces, each of the integrated circuits comprising a multiplicity of pads; separating the integrated circuits from each other so as to define edges thereof and generally surrounding said integrated circuits on said edges with epoxy and waferwise bonding onto both of said surfaces a layer of protective material, thereby producing a waferwise sandwich; and thereafter slicing the waferwise sandwich, thereby to define a plurality of prepackaged integrated circuit devices, and wherein prior to said slicing step, the integrated circuits are surrounded on their planar surfaces by said layer of protective material and on their edges by said epoxy. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A method of producing packaged semiconductor devices comprising the steps of:
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producing a plurality of semiconductor elements on a wafer having first and second planar surfaces, each of the semiconductor elements comprising a multiplicity of pads; separating the integrated circuits from each other so as to define edges thereof and generally surrounding said semiconductor elements at said edges and said first and second planar surfaces with generally the same protective sealant and waferwise attaching to said protective sealant adjacent both of said surfaces a layer of protective material, thereby producing a waferwise sandwich; thereafter slicing the waferwise sandwich, thereby to define a plurality of prepackaged semiconductor element devices, each comprising a mechanically protective and electrically insulative package having a plurality of exposed cross-sections of said pads exposed at edges thereof; and providing electrical connections between said exposed cross-sections and external circuitry. - View Dependent Claims (39)
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40. An integrated circuit device comprising:
a packaged integrated circuit assembly comprising a semiconductor substrate having at least first and second patterned metal layers formed over said semiconductor substrate, defining therewith semiconductor circuit elements having edges, said semiconductor substrate being generally surrounded along its edges and over said first and second patterned metal layers by generally the same protective sealant, said integrated circuit assembly having top and bottom surfaces formed of electrically insulative and mechanically protective material and electrically insulative edge surfaces defined by said protective sealant and having exposed sections of conductive pads formed by at least one of said first and second patterned metal layers. - View Dependent Claims (41, 42, 43, 44, 45, 46)
Specification