Microelectromechanical signal processors

• US 5,455,547 A
• Filed: 10/31/1994
• Issued: 10/03/1995
• Est. Priority Date: 12/11/1992
• Status: Expired due to Term

• Current Assignee: Regents of the University of California (University of California)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Pisano, Albert P., Howe, Roger T., Lin, Liwei, Nguyen, Clark T.-C.
• Primary Examiner(s): Pascal, Robert J.
• Assistant Examiner(s): GAMBINO, DARUIS
• Application Number:
  US08/332,981
• Time in Patent Office: 337 Days
• Field of Search: 333/186, 333/188, 333/189, 333/191, 333/192
• US Class Current: 333/186
• CPC Class Codes: H03H 9/02275 Comb electrodes
• CPC Class Codes: H03H 9/02377 Symmetric folded-flexure
• CPC Class Codes: H03H 9/46 Filters multiple-port electromechanical filters H03H9/70
• CPC Class Codes: H03H 9/462 Microelectro-mechanical filters

Abstract

A micromechanical filter having planar components, and manufacturable using very large scale integrated circuit microfabrication techniques. The input and output transducers are interdigitated comb electrodes. The mechanical coupling between the input and output transducers includes planar flexures, displacement of the electrodes producing bending of the elements of the flexures. By sealing micromechanical filters in a vacuum and providing on-board circuitry, high signal-to-noise ratios and quality factors are achievable. Construction of a real-time spectrum analyzer using many micromechanical resonators, provides a device with high accuracy and a short sample time.

Claims

1. A micromechanical signal processor comprising:

a substrate;

a first rigid mass;

a second rigid mass;

a third rigid mass;

a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate;

a second flexible structure mechanically connecting said second mass to said first mass, said second flexible structure allowing said second rigid mass to move relative to said first rigid mass, said first and second masses and said second flexible structure being thin film structures; and

a third flexible structure mechanically connecting said third mass to a mass selected from the group consisting of said first and second masses, said second flexible structure being substantially located in a first plane to a first side of said substrate, said third flexible structure being substantially located in a second plane to said first side of said substrate, and said first plane lying between said second plane and said substrate.

2. A micromechanical signal processor comprising:

a substrate;

a first rigid mass;

a first flexible structure mechanically connecting said first mass to said substrate and allowing said first mass to move relative to said substrate at a first resonant frequency;

a second rigid mass; and

a second flexible structure mechanically connecting said second mass to said substrate and allowing said second mass to move relative to said substrate at a second resonant frequency;

a first electrode electrostatically coupled to said first mass;

a second electrode electrostatically coupled to said first mass;

a third electrode electrically connected to said first electrode and electrostatically coupled to said second mass; and

a fourth electrode electrostatically coupled to said second one of said masses and electrically connected to said second electrode.