Apparatus and method for inspection of high component density printed circuit board

• US 5,455,870 A
• Filed: 06/24/1994
• Issued: 10/03/1995
• Est. Priority Date: 07/10/1991
• Status: Expired due to Fees

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Jones, George B., Hong, Khanh, Whalen, Brian L., Sepai, Dinyar, Daly, Kevin R.
• Primary Examiner(s): Boudreau, Leo H.
• Assistant Examiner(s): Bella, Matthew C.
• Application Number:
  US08/265,567
• Time in Patent Office: 466 Days
• Field of Search: 382/8, 382/18, 356/237, 356/376, 356/273, 250/563, 250/562, 348/126, 348/131
• US Class Current: 382/147
• CPC Class Codes: G01N 2021/8825 Separate detection of dark field and bright field
• CPC Class Codes: G01N 21/95684 Patterns showing highly reflecting parts, e.g. metallic elements
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing

Abstract

An automated electronic module inspection system having illumination sources that produce digitized gray scale images that are then analyzed by a computer. The inspection system illuminates the module including solder joints, components and printed circuit board using a sequence of illumination that produce visual images which are used to identify defects. The inspection system inspects for all defects as specified in MIL-STD-2000A (Section 4.4) by using both surface reflectance properties as well as topological properties of objects. The system comprises two video cameras. A positioning table aligns a module-under-test with the optical axis of each camera thereby enabling the same field-of-view to be observed under different lighting conditions. A dark field illumination associated with a first camera preferentially illuminates non-flat surfaces, but not vertical surfaces. A bright field illumination associated with a second camera preferentially illuminates relatively flat surfaces. The flat-surface illumination light source is collimated with the optical axis of the camera using a conventional partially reflecting angled mirror that reflects the light along the camera'"'"'s optical axis onto a circuit board of the module. The angled surfaces are illuminated using four ring-lights concentrically aligned with the optical axis of the second camera. The images observed by the camera are then analyzed by inspection programs for discrepancies between image model attributes and the images, and such programs provide compensation for nonuniformities of the light sources and cameras and compensation of shadows resulting from the dark field illumination light source.

Claims

1. Apparatus for inspection of surface mount solder joints of an electronic module comprising:

means for positioning and aligning said module during said inspection;

a first light source means for providing a dark field illumination to non-flat surfaces of said module on said positioning means;

a first sensing means disposed above said first light source means for sensing an intensity of reflected light from said first light source to obtain a first image;

a second light source means for providing a bright field illumination to flat surfaces of said module on said positioning means;

a second sensing means disposed above said second light source means for sensing an intensity of reflected light from said second light source to obtain a second image;

processing means for compensating said first image for nonuniformities resulting from said first light source means and said first sensing means and for compensating said second image for nonuniformities resulting from said second light source means and said second sensing means;

means included in said processing means for providing information describing predetermined shadows to said detecting and compensating means using a PCB module data base and said second compensated image to compensate for predetermined shadows;

means included in said processing means for differentiating between a low light intensity region of said first image and said predetermined shadows of said first image;

means included in said processing means for detecting and compensating for said predetermined shadows resulting from surface mount components attached to said electronic module and said first light source means, said shadows including omni-directional and uni-directional shadows;

means included in said processing means for performing a transposition on said first image and said second image for establishing a three-dimensional topography of said module; and

means included in said processing means for analyzing said three-dimensional topography and said intensity of said first image and said second image to determine the condition of said module.

2. The apparatus as recited in claim 1 wherein:

said positioning means comprises means for moving said module in an X-axis and a Y-axis directions.

3. The apparatus as recited in claim 2 wherein:

said positioning means comprises means for moving said module in a circular direction.

4. The apparatus as recited in claim 1 wherein:

said apparatus comprises means coupled to said first sensing means and said second sensing means for transferring said first image and said second image to said processing means.

5. The apparatus as recited in claim 1 wherein:

said means for performing a transposition comprises conversion of said intensity of said first image and said second image to a surface angle representation.

6. The apparatus as recited in claim 1 wherein:

said means for performing a transposition comprises means for performing a gradient analysis, a component interconnect boundary detection, a supervised segmentation and histogram analysis in predefined windows, an unsupervised segmentation connectivity analysis and a circular feature identification on said first image and said second image for establishing said three dimensional topography.

7. The apparatus as recited in claim 1 wherein:

said means for analyzing said three-dimensional topography comprises means for comparing said established three-dimensional topography to a predetermined three-dimensional topography criteria.

8. The apparatus as recited in claim 6 wherein:

said analyzing means further comprises an expert system having a plurality of decision levels.

9. The apparatus as recited in claim 7 wherein said analyzing means comprises an expert system having a neural network means.

10. The apparatus as recited in claim 1 wherein:

said means for analyzing said three-dimensional topography comprises means for determining a defective condition of solder connections, components, and printed circuit materials of said module.

11. The apparatus as recited in claim 1 wherein:

said first light source means comprises a plurality of ring lamps.

12. The apparatus as recited in claim 11 wherein:

said apparatus further comprises means for individually activating each of said plurality of ring lamps in accordance with a control signal generated by said processing means.

13. The apparatus as recited in claim 11 wherein:

said apparatus comprises means for activating said ring lamps simultaneously in accordance with a control signal generated by said processing means.

50. The apparatus as recited in claim 1 wherein:

said means for detecting and compensating for shadows comprises correcting a reduction in intensity of said first image due to shadows by increasing said intensity by an equivalent amount.

14. An automated vision inspection system comprising:

a computer means for controlling the operation of said vision inspection system;

a positioning table having a plurality of axes for positioning and aligning a module during an inspection in accordance with a command signal from said computer means;

a dark field illumination means positioned above said module for illuminating non-flat surfaces of said module;

a first camera disposed above said dark field illumination means for sensing an intensity of reflected light from said module to obtain a first image;

a bright field illumination means positioned above said module and adjacent to said dark field illumination means for illuminating flat surfaces of said module;

a second camera disposed above said bright field illumination means for sensing an intensity of reflected light from said module to obtain a second image;

processing means within said computer means for compensating said first image for nonuniformities from said dark field illumination means and said first camera and for compensating said second image for nonuniformities resulting from said bright field illumination means and said second camera;

means included in said processing means for providing information describing predetermined shadows to said detecting and compensating means using a PCB module data base to compensate for said predetermined shadows;

means included in said processing means for differentiating between a low light intensity region of said first image and said predetermined shadows of said first image;

means included in said processing means for detecting and compensating for said predetermined shadows resulting from surface mount components attached to an electronic module and said dark field illumination means, said shadows including omni-directional and uni-directional shadows;

means included in said processing means for performing a transposition on said first image and said second image for establishing a three-dimensional topography of said module;

means for comparing said established three-dimensional topography to a predetermined three-dimensional topography criteria; and

expert system means for analyzing the results of said comparing means to detect a defect in said module.

15. The automated vision inspection system as recited in claim 17 wherein:

said positioning table comprises means for moving said module in an X-axis and a Y-axis directions.

16. The automated vision inspection system as recited in claim 14 wherein:

said positioning table comprises means for moving said module in a circular direction.

17. The automated vision inspection system as recited in claim 14 wherein:

said inspection system comprises means coupled to said first sensing means and said second sensing means for transferring said first image and said second image to said computer means.

18. The automated vision inspection system as recited in claim 14 wherein:

said means for performing a transposition comprises conversion of said intensity of said first image and said second image to a surface angle representation.

19. The automated vision inspection system as recited in claim 14 wherein:

said means for performing a transposition comprises means for performing a gradient analysis, a component interconnect boundary detection, a supervised segmentation and histogram analysis in predefined windows, an unsupervised segmentation connectivity analysis, and a circular feature identification on said first image and said second image for establishing said three dimensional topography.

20. The automated vision inspection system as recited in claim 14 wherein:

said expert system means comprises a plurality of decision levels.

21. The automated vision inspection system as recited in claim 14 wherein:

said expert system means comprises a neural network means.

22. The automated vision inspection system as recited in claim 14 wherein:

said expert system determines a defective condition of solder connections, components, and printed circuit materials of said module.

23. The automated vision inspection system as recited in claim 14 wherein:

said dark field illumination means comprises a plurality of ring lamps.

24. The automated vision inspection system as recited in claim 23 wherein:

said system further comprises means for individually activating each of said plurality of ring lamps in accordance with a control signal generated by said computer means.

25. The automated vision inspection system as recited in claim 23 wherein:

said system comprises means for activating said ring lamps simultaneously in accordance with a control signal generated by said computer means.

26. A method for inspection of surface mount solder joints of an electronic module comprising the steps of:

positioning and aligning said module for said inspection with a positioning means having a plurality of axes;

illuminating non-flat surfaces of said module with a first light source having a dark field illumination means positioned above said module;

sensing an intensity of reflected light from said first light source with a first sensing means to obtain a first image;

repositioning said module for said inspection;

illuminating flat surfaces of said module with a second light source having a bright field illumination means positioned above said module and adjacent to said first light source;

sensing an intensity of reflected light from said second light source with a second sensing means to obtain a second image;

compensating in a processing means said first image for nonuniformities resulting from said first light source and compensating said second image for nonuniformities resulting from said second light source and said second sensing means;

providing information describing predetermined shadows to said detecting and compensating means with means included in said processing means using a PCB module data base to compensate for said predetermined shadows;

differentiating in said processing means between a low light intensity region of said first image and said predetermined shadows of said first image;

detecting and compensating in said processing means for said predetermined shadows resulting from surface mount components attached to said electronic module and said first light source means, said, shadows including omni-directional and uni-directional shadows;

performing in said processing means a transposition on said first image and said second image for establishing a three-dimensional topography of said module; and

analyzing said three-dimensional topography and said intensity of said first image and said second image in said processing means to determine the condition of said module.

27. The method as recited in claim 26 wherein:

said step of positioning said module comprises moving said module in an X axis and a Y axis direction.

28. The method as recited in claim 26 wherein:

said step of positioning said module comprises moving said module in a circular direction.

29. The method as recited in claim 26 wherein:

said steps of sensing an intensity of reflected light from said first light source and said second light source to obtain said first image and said second image comprises the steps of transferring said first image and said second image to a processing means.

30. The method as recited in claim 26 wherein:

said step of performing a transposition comprises the step of converting said intensity of said first image and said second image to a surface angle representation.

31. The method as recited in claim 26 wherein:

said step of performing a transposition comprises the steps of performing a gradient analysis, a component interconnect boundary detection, a supervised segmentation and histogram analysis in predefined windows, an unsupervised segmentation connectivity analysis, and a circular feature identification on said first image and said second image for establishing said three dimensional topography.

32. The method as recited in claim 26 wherein:

said step of analyzing said three-dimensional topography comprises the step of comparing said established three-dimensional topography to a predetermined three-dimensional topography criteria.

33. The method as recited in claim 32 wherein:

said step of analyzing said established three dimensional topography to a predetermined three dimensional criteria comprises the step of employing an expert system comprising a plurality of decision levels.

34. The method as recited in claim 32 wherein:

said step of analyzing said established three dimensional topography to a predetermined three dimensional criteria comprises the step of employing an expert system comprising a neural network means.

35. The method as recited in claim 26 wherein:

said step of determining the condition of said module includes detecting a defective condition in devices, solder connections and printed circuit materials.

36. The method as recited in claim 26 wherein:

said step of illuminating said module with a first light source includes said first light source having a plurality of ring lamps.

37. The method as recited in claim 36 wherein said step of illuminating said module with a plurality of ring lamps further comprises the step of individually activating each of said ring lamps in accordance with a control signal from said processing means.

51. The method as recited in claim 26 wherein:

said step of detecting and compensating in said processing means for shadows resulting from said first light source means comprises the step of correcting a reduction in intensity of said first image due to shadows by increasing said intensity of said first image by an equivalent amount.

38. A method of inspecting surface mount solder joints of an electronics module with an automated vision inspection system comprising the steps of:

controlling the operation of said vision inspection system with a computer means;

positioning a module during an inspection in accordance with a command signal from said computer means to a positioning table having a plurality of axes;

aligning said positioned module to a first camera and to a second camera;

.

illuminating non-flat surfaces of said module with a dark field illumination means positioned above said module;

sensing an intensity of reflected light from said module to obtain a first image using said first camera disposed above said dark field illumination means;

illuminating flat surfaces of said module with a bright field illumination means positioned above said module and adjacent to said dark field illumination means;

sensing an intensity of reflected light from said module to obtain a second image using said second camera disposed above said bright field illumination means;

compensating said first image for nonuniformities from said dark field illumination means and said first camera and compensating said second image for non uniformities resulting from said bright field illumination means and said second camera with a processing means within said computer means;

providing information describing predetermined shadows to said processing means using a PCB module data base to compensate for said predetermined shadows;

differentiating in said processing means between a low light intensity region of said first image and said predetermined shadows of said first image;

performing detection and compensation in said processing means for said predetermined shadows resulting from surface mount components attached to said electronic modules and said dark field illumination means, said shadows including omni-directional and uni-directional shadows;

performing in said processing means a transposition on said first image and said second image for establishing a three-dimensional topography of said module;

comparing said established three-dimensional topography to a predetermined three-dimensional topography criteria; and

analyzing the results of said comparing means to detect a defect in said module with an expert system means.

39. The automated vision inspection system method as recited in claim 38 wherein:

said step of positioning said module comprises the steps of moving said module in an X-axis and a Y-axis directions.

40. The automated vision inspection system method as recited in claim 38 wherein:

said step of positioning said module comprises the step of moving said module in a circular direction.

41. The automated vision inspection system method as recited in claim 38 wherein:

said step of sensing an intensity of reflected light from said first light source and said second light source to obtain said first image and said second image comprises the steps of transferring said first image and said second image to said computer means.

42. The automated vision inspection system method as recited in claim 38 wherein:

said step of performing a transformation comprises the step of converting said intensity of said first image and said second image to a surface angle representation.

43. The vision inspection system as recited in claim 38 wherein:

said step of performing a transposition comprises the steps of performing a gradient analysis, a component interconnect boundary detection, a supervised segmentation and histogram analysis in predefined windows, an unsupervised segmentation connectivity analysis, and a circular feature identification on said first image and said second image for establishing said three dimensional topography.

44. The vision inspection system as recited in claim 38 wherein:

said step of analyzing with an expert system means comprises a plurality of decision level steps.

45. The automated vision inspection system method as recited in claim 38 wherein:

said step of analyzing with an expert system means comprises a step of analyzing with a neural network means.

46. The automated vision inspection system method as recited in claim 38 wherein:

said step of analyzing with said expert system determines a defective condition of solder connections, components, and printed circuit materials of said module.

47. The automated vision inspection system method as recited in claim 38 wherein:

said step of illuminating non-flat surfaces of said module with a dark field illumination means comprises the step of illuminating a plurality of ring lamps.

48. The automated vision inspection system method as recited in claim 47 wherein:

said step of illuminating said plurality of ring lamps comprises the steps of sequentially activating each of said plurality of ring lamps in accordance with a control signal generated by said computer means.

52. The automated vision inspection system method as recited in claim 38 wherein:

said step of performing detection and compensation in said processing means for shadows resulting from said dark field illumination means further comprises the step of correcting a reduction in intensity of said first image due to shadows by increasing said intensity of said first image by an equivalent amount.

49. The vision inspection system as recited in claim 55 wherein:

said step of illuminating said plurality of ring lamps comprises activating said ring lamps simultaneously in accordance with a control signal generated by said computer means.