Dual pendulum vibrating beam accelerometer

• US 5,456,110 A
• Filed: 11/12/1993
• Issued: 10/10/1995
• Est. Priority Date: 11/12/1993
• Status: Expired due to Term

• Current Assignee: Alliedsignal Inc.
• Original Assignee: Alliedsignal Inc.
• Inventors: Hulsing, Rand H. II
• Primary Examiner(s): Williams, Hezron E.
• Assistant Examiner(s): Oda, Christine K.
• Application Number:
  US08/151,410
• Time in Patent Office: 697 Days
• Field of Search: 73/DIG. 1, 73/862.59, 73/517 AV, 73/517 B, 73/517 R, 73/516 R, 73/DIG. 4, 73/497
• US Class Current: 73/514.36
• CPC Class Codes: G01P 15/097 by vibratory elements
• CPC Class Codes: G01P 15/0975 by acoustic surface wave resonators or delay lines
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends

Abstract

A micromachined push-pull accelerometer formed with dual vibrating beam transducers in one plane of a silicon substrate includes a pair of proof masses or pendulums supported by flexures formed in a plane adjacent a surface of the silicon substrate opposite the vibrating beam transducers on opposing sides of the pendulums to define opposing pendulous axes. The accelerometer is configured such that the dual vibrating beam transducers are in a push-pull relationship (e.g., one transducer is subjected to a tension force while the other transducer is subjected to a compression force in response to accelerations along a sensitive axis SA). In order to form the push-pull configuration, one vibrating beam transducer is connected to one pendulum on a side opposite the hinge axis for that pendulum while the other vibrating beam transducer is connected to the other pendulum on the same side as the hinge axis for that pendulum. Such a configuration not only provides for cancellation of cross-axis acceleration over a relatively wide frequency range but, in addition, provides an effective sensitive axis SA, generally perpendicular to the surface of the silicon substrate, thus obviating the need for a special mounting structure while obviating the problem relating to the rotation of the input axis. The configuration also enables the electrically conductive material for the electrodes to be deposited on one side of the substrate, thus simplifying the fabrication of the accelerometer.

Claims

1. A method for making a micromachined accelerometer from a generally rectangular silicon substrate having upper and lower surfaces for measuring acceleration along a predetermined axis, comprising the steps of:

(a) forming first and second pendulums defining opposing ends in said substrate and defining a support portion;

(b) forming at least one flexure in a single plane adjacent the lower surface of said substrate for each of said first and second pendulums defining first and second hinge axes, respectively, to enable said first and second pendulums to rotate relative to said support portion, said first and second hinge axes being disposed on said opposing ends of said support portion;

(c) forming a first force transducer in a single plane adjacent said upper surface, connected between said support portion of said substrate and said first pendulum; and

(d) forming a second force transducer in a single plane adjacent said upper surface of said substrate, connected between said support portion and said second pendulum, wherein said first and second transducers are configured in a push-pull arrangement, said first and second force transducers both connected to said support portion adjacent at least one of said first hinge axis or said second hinge axis.

2. A method as recited in claim 1, wherein said first and second force transducers are formed as vibrating beam force transducers.

3. A method as recited in claim 1, wherein both of said first and second force transducers span at least one of said first or second hinge axes.

4. A method as recited in claim 1, wherein both of said first and second force transducers are disposed adjacent at least one of said first or second hinge axes.

5. A method as recited in claim 4, further including the step of forming first and second struts in said substrate for reducing torsion relative to said first and second force transducers.

6. A method as recited in claim 5, wherein said first and second struts are formed adjacent said upper surface of said substrate.

7. A method as recited in claim 5, wherein each of said struts is formed adjacent ends of said pendulums opposite their respective hinge axes.

8. A push-pull accelerometer for measuring accelerations along a predetermined axis, comprising:

a generally planar support defining opposing ends;

first and second pendulums having first and second centers of mass;

at least one flexure for rotatably connecting each of said first and second pendulums to said support, said flexure for each pendulum defining first and second hinge axes, respectively, said first and second hinge axes being disposed at said opposing ends of said support and further defining first and second pendulous axes between the hinge axis and the center of mass of each of the pendulums, said first and second pendulous axes being at a predetermined angular offset relative to the plane of the support;

a first force transducer connected between said support and said first pendulum; and

a second force transducer connected between said support and said second pendulum in a push-pull relationship, said first and second force transducers being connected, both being connected to at least one end of said support.

9. The accelerometer of claim 8, wherein said first and second force transducers are vibrating beam transducers.

10. The accelerometer of claim 9, further including means for preventing torsional movement relative to said pendulous axes.

11. The accelerometer of claim 10, wherein said preventing means includes struts.

12. The accelerometer of claim 11, wherein said struts are disposed adjacent ends of said first and second pendulums opposite their respective first and second hinge axes.

13. The accelerometer of claim 8, wherein both of said first and second force transducers span at least one of said first or second hinge axes.

14. The accelerometer of claim 8, wherein both of said first and second force transducers are disposed adjacent at least one of said first or second hinge axes.

15. In a micromachined push-pull accelerometer formed from a general planar silicon substrate having upper and lower surfaces and defining opposing ends which includes a first pendulum rotatably connected to the lower surface by at least one flexure formed in a first plane of said substrate defining a first hinge axis, said first hinge axis disposed adjacent one or the other of said opposing ends of said support and a first force transducer formed in a second plane connected between an upper surface of said substrate and said pendulum defining a sensitive axis that is angularly offset from an axis perpendicular to the plane of the substrate, the improvement comprising:

a second pendulum and a second force transducer formed in said second plane and at least one flexure formed in said first plane defining a second hinge axis for rotatably connecting said second pendulum to said support, said second hinge axis disposed adjacent to an end opposite said first hinge axis, wherein said first transducer is connected between said first pendulum and said support and said second transducer is connected between said second pendulum and said support in a push-pull configuration, said first and second transducers both connected to at least one end of said support.

16. The accelerometer recited in claim 15, wherein said first plane is in a layer of the substrate adjacent its bottom surface.

17. The accelerometer recited in claim 16, wherein said first and second hinge axes are spaced apart.

18. The accelerometer as recited in claim 17, wherein said first force transducer is connected between said substrate and a side of said first pendulum adjacent said first hinge axis and said second force transducer is connected between said substrate and said second pendulum on a side opposite said second hinge axis.

19. The accelerometer as recited in claim 18, wherein both of said first and second force transducers span at least one of said first and second hinge axes.

20. The accelerometer as recited in claim 18, wherein both of said first and second force transducers are disposed adjacent at least one of said first or second hinge axes.