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Method of testing semiconductor chips with reusable test package

  • US 5,456,404 A
  • Filed: 10/28/1993
  • Issued: 10/10/1995
  • Est. Priority Date: 10/28/1993
  • Status: Expired due to Term
First Claim
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1. A method of testing a semiconductor device having electrical contacts, comprising the steps of:

  • forming a semiconductor device test package, the package forming step including the steps of;

    placing a layer of a flexible electrical insulator having in it electronic circuitry on a rigid substantially planar substrate, removing a portion of the substrate, such that a portion of the flexible insulator layer lies above the removed portion of said rigid substrate;

    forming interconnect pads to match locations of said electrical contacts;

    comprising providing metalized particles protruding from said interconnect pads on a surface of the layer lying above the removed portion of the rigid substrate;

    placing the semiconductor device on the semiconductor device test package so that the electrical contacts contact the interconnect pads; and

    urging the semiconductor device toward the interconnect pads to cause the metallized particles to pierce surfaces of said electrical contacts, controlling the urging force to be sufficient to cause the flexible electrical insulator to deflect to increase uniformity of the depth to which the metallized particles pierce the surface of the electrical contacts for test purposes.

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