Conditioner for a polishing pad and method therefor
First Claim
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1. An apparatus for conditioning a polishing surface of a pad that is rotatable about a pad axis, comprising:
- end effector means for contacting said polishing surface;
arm means coupled to said end effector means for moving said end effector means along a radial line passing through said pad axis; and
programming means coupled to said arm means for moving said end effector means across said polishing surface of said pad at a programmable rate to obtain uniform conditioning of said polishing surface of said pad.
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Abstract
An axially rotating circular polishing pad is conditioned by a rotating end effector that has an abrasion disc in contact with a polishing surface of the pad. The end effector moves along a radius of the polishing pad surface at a velocity that varies to compensate for locations on the polishing pad surface having linear velocities that are directly related to their respective radii. A desired contact force is maintained between the end effector and the polishing pad surface.
196 Citations
16 Claims
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1. An apparatus for conditioning a polishing surface of a pad that is rotatable about a pad axis, comprising:
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end effector means for contacting said polishing surface; arm means coupled to said end effector means for moving said end effector means along a radial line passing through said pad axis; and programming means coupled to said arm means for moving said end effector means across said polishing surface of said pad at a programmable rate to obtain uniform conditioning of said polishing surface of said pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for conditioning a polishing surface of a pad that is rotatable about a pad axis, comprising the steps of:
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providing end effector means for contacting said polishing surface; providing arm means coupled to said end effector means for moving said end effector means along a radial line passing through said pad axis; and providing programming means coupled to said arm means for moving said end effector means across said polishing surface of said pad at a programmable rate to obtain uniform conditioning of said polishing surface of said pad. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification