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Method for fabricating a circuit element through a substrate

  • US 5,456,942 A
  • Filed: 09/29/1993
  • Issued: 10/10/1995
  • Est. Priority Date: 09/29/1993
  • Status: Expired due to Term
First Claim
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1. A method for fabricating a circuit element through a substrate comprising the steps of:

  • providing a first compressible layer having at least one aperture disposed therethrough commencing on a first surface and continuing to an opposing second surface wherein the at least one aperture is bounded within a second area;

    disposing a first surface of a substrate on the first surface of said compressible layer, wherein said substrate has at least one via disposed therethrough commencing on an opposing second surface and continuing to the first surface, wherein the at least one via is bounded within a first area on the opposing second surface and the first surface, wherein the first area is smaller than the second area associated with the at least one aperture of the first compressible layer, and wherein said disposing step aligns the at least one aperture with the at least one via;

    disposing a second surface of a second compressible layer on the opposing second surface of said substrate, wherein said second compressible layer has at least a second aperture disposed commencing on an opposing first surface and continuing to the second surface, wherein the at least a second aperture is bounded within a third area on the second surface larger than the first area of the at least one via of said substrate, and wherein said disposing step aligns the at least a second aperture and the at least one via;

    compressing said first compressible layer and the second compressible layer about the first surface and the opposing second surface of said substrate respectively;

    disposing a coating into the at least a second aperture of said second compressible layer, wherein said coating is confined within the third area of said second compressible layer; and

    providing a pressure difference between the at least a second aperture, and the at least one aperture, thereby drawing the coating from the at least a second aperture, through the at least one via, and through the at least one aperture and providing an interconnect of the coating between the first and opposing second surfaces of said substrate.

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