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Photovoltaic module fabrication process

  • US 5,457,057 A
  • Filed: 06/28/1994
  • Issued: 10/10/1995
  • Est. Priority Date: 06/28/1994
  • Status: Expired due to Term
First Claim
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1. A method for the manufacture of a photovoltaic panel, said method including the steps of:

  • providing a photovoltaic material comprising a substrate electrode;

    a photovoltaic body disposed atop, and in electrical communication with said substrate electrode, said photovoltaic body operative to absorb photons and provide a photocurrent in response thereto; and

    a transparent, electrically conductive top electrode disposed atop the photovoltaic body;

    dividing photovoltaic said, material into a plurality of individual slabs, each slab comprising a portion of said substrate electrode, photovoltaic body, and top electrode;

    isolating a photoactive area within each slab, said photoactive area being substantially free of any edge defects which establish a short-circuit current path between the top electrode and substrate electrode of said slab;

    passivating any defect regions which may be present within said photoactive area;

    affixing a first bus bar tape to said slab in electrical communication with the substrate electrode thereof;

    affixing a second bus bar tape to said slab, said second tape being electrically insulated from said substrate electrode;

    providing at least one current collecting member;

    bonding said at least one current collecting member to the top electrode of said slab with an electrically conductive adhesive so as to establish electrical communication therewith;

    establishing electrical contact between said at least one current collecting member and said second bus bar tape, whereby said second tape is in electrical communication with the top electrode;

    applying a transparent, protective coating to said slab after affixation of said at least one current collecting member so as to cover said top electrode and said at least one member;

    electrically interconnecting a plurality of said slabs;

    affixing a flexible, transparent, electrically insulating encapsulant to a front surface of each electrically interconnected slab of said plurality so that a back surface of each of said slabs is not covered by said encapsulant; and

    ,affixing a common backing plate to the back surface of each slab of said plurality.

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