Semiconductor module device having a desired electrical circuit constituted by combination of seminconductor devices formed on circuit boards

• US 5,457,604 A
• Filed: 09/26/1994
• Issued: 10/10/1995
• Est. Priority Date: 09/28/1993
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Ando, Masaru
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/311,034
• Time in Patent Office: 379 Days
• Field of Search: 174/163, 257/678, 257/686, 257/692, 257/706, 257/712-713, 257/723, 257/724, 257/730, 361/679, 361/702, 361/704, 361/707, 361/709-710, 361/715-722, 361/728, 361/730, 361/736, 361/749, 361/777, 361/784
• US Class Current: 361/707
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A semiconductor module device according to the present invention includes a disk-shaped DBC circuit board which are divided into, e.g., six sectorial DBC circuit boards. A plurality of semiconductor pellets are arranged in a staggered fashion on each of the sectorial DBC circuit boards. Externally leading electrodes are provided at the respective innermosts of the sectorial DBC circuit boards, and externally leading power terminals, which are connected to the externally leading electrodes, are extracted from the central part of the DBC circuit board. With this constitution, the distances between the externally leading power terminals and the sectorial DBC circuit boards can be minimized, and the distances between the externally leading power terminals and the semiconductor pellets on the sectorial DBC circuit boards can be uniformed, with the result that the efficiency and reliability of the module device can be improved. Since the DBC circuit board is shaped like a disk, it can be protected from breakage due to the stress concentrated when the device is mounted.

Claims

1. A semiconductor module device comprising:

a substantially rectangular heat radiation plate;

a disk-shaped circuit board on said heat radiation plate with an insulator interposed therebetween and divided into a plurality of equal-sized sectorial circuit boards;

a plurality of semiconductor devices arranged in a staggered fashion on each of said sectorial circuit boards to constitute device sections, and constituting a desired electrical circuit together with said sectorial circuit boards;

externally leading electrodes provided at respective innermost locations of said sectorial circuit boards;

externally leading terminals electrically connected to said externally leading electrodes and located at central positions of said disk-shaped circuit board in corresponding relations to said innermost locations of said externally leading electrodes; and

a plurality of mounting holes in said heat radiation plate outside said disk-shaped circuit board.

2. The semiconductor module device according to claim 1, wherein said disk-shaped circuit board is a DBC circuit board constituted by bonding a copper plate onto said insulator.

3. The semiconductor module device according to claim 1, wherein said externally leading terminals are in a central part of a resin cover covering an upper surface of said disk-shaped circuit board, and said externally leading terminals and said cover are integral with each other as one component.