Low profile mechanical interconnect system having metalized loop and hoop area

• US 5,457,610 A
• Filed: 06/01/1993
• Issued: 10/10/1995
• Est. Priority Date: 06/01/1993
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Bernardoni, Lonnie L., Swirbel, Thomas J.
• Primary Examiner(s): Ledynh, Bot L.
• Application Number:
  US08/069,318
• Time in Patent Office: 861 Days
• Field of Search: 361/724, 361/728, 361/730, 361/816-818, 361/736, 361/739, 361/748, 361/752, 361/760-764, 174/35 R, 174/35 MS, 174/250, 174/256, 174/260-261
• US Class Current: 361/816
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/10568 Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
• CPC Class Codes: H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A substrate (100) includes a surface (102) having a hook and loop fastener area (106). The area (106) is selectively metallized to produce interconnect points (108). The area (106) is used to attach a connector, another substrate, or a flex circuit to the substrate (100) without the use of solder or other conductive adhesives. The area (106) provides for the mechanical coupling. The selectively metallized areas (108) provide for the electrical coupling of the two substrates.

Claims

1. A substrate comprising;

a surface having an area with loop and hook fasteners, the loop and hook fastener area having a circuit pattern and being selectively metalized to provide the substrate with simultaneous mechanical and electrical coupling to a second substrate.

2. The substrate of claim 1, wherein the loop and hook fastener area includes an area selectively metalized via a sputtering process.

4. The substrate of claim 2, further including a shield attached to the surface via a metalized loop and hook fastener portion.

5. The substrate of claim 4, wherein the circuit pattern includes a metalized loop and hook fastener portion to attach to the shield.

6. The substrate of claim 2, wherein the circuit pattern includes at least one interconnection pad.

3. A substrate, comprising:

a surface;

a circuit pattern printed on the surface; and

a selectively metalized loop and hook fastener portion attached to the circuit pattern to provide for the mechanical and the electrical coupling of the substrate to a second substrate.