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Plasma enhancement apparatus and method for physical vapor deposition

DC
  • US 5,458,754 A
  • Filed: 04/15/1994
  • Issued: 10/17/1995
  • Est. Priority Date: 04/22/1991
  • Status: Expired due to Term
First Claim
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1. A plasma enhancement apparatus for use in combination with an electric arc vapor deposition system having a vacuum chamber, a consumable cathode source of coating material defining a cathode evaporation surface and an anode operable with the vacuum chamber, means for supporting a substrate to be coated in spaced line-of-sight relation to said cathode, said line-of-sight extending along an axis line extending between said cathode evaporation surface and said substrate, means for initiating and sustaining an electric arc between the cathode evaporation surface and said anode to create a column of plasma material projecting in line-of-sight manner along said axis line in a vacuum space extending from said cathode evaporation surface toward said substrate, comprising:

  • field generating means mounted relative to said cathode evaporation surface and said substrate, so as to maintain said line-of-sight therebetween, for generating a magnetic field having magnetic field lines arranged around said axis line and between said cathode evaporation surface and said substrate and of a configuration whereby said field lines are constricted in at least a portion of said vacuum space;

    said magnetic field being further characterized by having;

    a. strength and orientation relative to said cathode evaporation surface that defines the intensity and confined movement of an arc spot of said arc over said cathode evaporation surface so as to minimize the generation of macroparticles at said cathode evaporation surface and to minimize their presence in said column of plasma material projected therefrom; and

    b. strength and orientation that energizes electrons of said column of plasma material within at least a portion of said vacuum space, sufficiently to cause macroparticle vaporization therein, and that significantly increases the ionization, ionic charge and ionization fraction of said column of plasma material at said substrate;

    whereby highly ionized substantially macroparticle reduced coating material from said cathode source impinges upon said substrate.

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