×

Power semiconductor module having a plurality of semiconductor arrangements

  • US 5,459,356 A
  • Filed: 02/16/1995
  • Issued: 10/17/1995
  • Est. Priority Date: 08/26/1992
  • Status: Expired due to Term
First Claim
Patent Images

1. A power semiconductor module having a plurality of semiconductor arrangements arranged on and electrically connected to interconnects and connected in parallel to one another and lie opposite one another in pairs along an axis lying parallel to a floor of the module, the module comprising:

  • a plurality of lead conductors wherein the plurality of lead conductors are connected to the interconnects such that at least one pair of the semiconductor arrangements and at most two pairs of the semiconductor arrangements lying behind one another in a direction of the axis are connected to at least two of the plurality of lead conductors, the at least two of the plurality of lead conductors being arranged in close immediate proximity and parallel to one another such that positions of the plurality of the at least two lead conductors with respect to the semiconductor arrangements are the same for each of the pair of semiconductor arrangements or for each of the two pairs of semiconductor arrangements resulting in symmetry of the semiconductor arrangements along the axis and identical inductances with respect to the semiconductor arrangements wherein the lead conductors corresponding to one another being electrically connectable above the interconnects by connecting lines.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×