Surface acoustic wave device mounted module

• US 5,459,368 A
• Filed: 07/22/1994
• Issued: 10/17/1995
• Est. Priority Date: 08/06/1993
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Onishi, Keiji, Seki, Shunichi, Taguchi, Yutaka, Eda, Kazuo
• Primary Examiner(s): BUDD, MARK OSBORNE
• Application Number:
  US08/278,905
• Time in Patent Office: 452 Days
• Field of Search: 310/313 R, 310/313 B, 310/313 C, 310/313 D, 333/150, 333/155, 333/193, 333/195, 333/196
• US Class Current: 310/313.00R
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03H 9/0542 consisting of a lateral arrangement H03H9/0566 takes precedence
• CPC Class Codes: H03H 9/0557 the other elements being buried in the substrate
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/1085 : the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Abstract

This invention provides a surface acoustic wave device mounted module which is miniature, light, and highly reliable. The surface acoustic wave device mounted module also has excellent frequency characteristics. The surface acoustic wave device mounted module includes a multilayer substrate which has at least one layer of a shield pattern, input-output electrodes, grounding electrodes, through holes used for connecting electrodes, and a surface acoustic wave element. The surface acoustic wave element has metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin around the surface acoustic wave element. The electrode pads are input-output terminals and grounding terminals formed on the surface acoustic wave element. Continuities between the input-output terminals and the input-output electrodes, and between the grounding terminals and the grounding electrodes are established by the through holes. An electrode pattern is formed on the surface of the multilayer substrate facing and surrounding the surface acoustic wave element. A metallic lid is attached to the electrode pattern by a solder or a conductive resin so that the surface acoustic wave element is sealed in an airtight condition. The electrode pattern is connected to the grounding electrodes by the through holes.

Claims

1. A surface acoustic wave device mounted module, comprising:

a multilayer substrate comprising at least one layer of shield electrode pattern, input-output electrodes, grounding electrodes and through holes used for connecting electrodes; and

a surface acoustic wave element placing a inter-digital transducer to face said multilayer substrate, said surface acoustic wave element having metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin partially or entirely disposed around said surface acoustic wave element;

wherein said electrode pads are input-output terminals and grounding terminals formed on said surface acoustic wave element;

wherein continuities between said input-output terminals and said input-output electrodes, and between said grounding terminals and said grounding electrodes are established by said through holes;

wherein a continuous grounding electrode pattern is formed on a surface of said multilayer substrate surrounding said surface acoustic wave element;

wherein a metallic lid is attached to said continuous grounding electrode pattern by a solder or a conductive resin so that said surface acoustic wave element is sealed in an airtight condition by said metallic lid; and

wherein said continuous grounding electrode pattern is connected to said grounding electrodes by said through holes.

2. The surface acoustic wave device mounted module according to claim 1, wherein the surface acoustic wave element is a piezoelectric substrate, and wherein said piezoelectric substrate is at least one material selected from the group consisting of lithium tantalate, lithium niobate, lithium borate and quartz.

3. The surface acoustic wave device mounted module according to claim 1, wherein the multilayer substrate comprises a grounding electrode pattern on its surface facing an inter-digital transducer of the surface acoustic wave element, said grounding electrode pattern having continuity with the grounding electrodes or the shield electrode pattern by the through holes.

4. The surface acoustic wave device mounted module according to claim 1, wherein the surface acoustic wave element comprises a conductive film on a surface opposite a surface facing the multilayer substrate to establish continuity between the metallic lid and said conductive film by a conductive resin.

5. The surface acoustic wave device mounted module according to claim 1, wherein the metallic lid has a continuity with a surface of the surface acoustic wave element opposite a surface facing the multilayer substrate by a conductive resin.

6. The surface acoustic wave device mounted module according to claim 1, wherein the bumps are made of at least one metal selected from the group consisting of gold and aluminum.

7. The surface acoustic wave device mounted module according to claim 1, wherein the surface acoustic wave element is mounted on a flat surface of the multilayer substrate.

8. The surface acoustic wave device mounted module according to claim 1, wherein the surface acoustic wave element is mounted in a depression formed in the multilayer substrate.

9. The surface acoustic wave device mounted module according to claim 1, wherein the multilayer substrate comprises circuit elements to match input-output impedances of surface acoustic wave element with those of outside circuits.

10. A surface acoustic wave device mounted module, comprising:

a multilayer substrate comprising at least one layer of shield electrode pattern, input-output electrodes, grounding electrodes and through holes used for connecting electrodes;

a surface acoustic wave element placing an inter-digital transducer facing said multilayer substrate, said surface acoustic wave element having metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin partially or entirely disposed around said surface acoustic wave element; and

active components or passive components;

wherein said electrode pads are input-output terminals and grounding terminals formed on said surface acoustic wave element;

wherein said surface acoustic wave element and said active components or passive components are integrated into one body on said multilayer substrate;

wherein a continuous grounding electrode pattern is formed on said multilayer substrate surrounding said surface acoustic wave element;

wherein a metallic lid is attached to said continuous grounding electrode pattern by a solder or a conductive resin to seal said surface acoustic wave element in an airtight condition by said metallic lid; and

wherein said continuous grounding electrode pattern is connected to said grounding electrodes by said through holes.

11. The surface acoustic wave device mounted module according to claim 10, wherein the surface acoustic wave element is mounted in a depression of the multilayer substrate.

12. The surface acoustic wave device mounted module according to claim 10, wherein the electrode pattern is formed on the multilayer substrate so as to surround the surface acoustic wave element and the active components or passive components in one body.

13. The surface acoustic wave device mounted module according to claim 10, wherein the bumps are made of at least one metal selected from the group consisting of gold and aluminum.