Stencils having enhanced wear-resistance and methods of manufacturing the same

• US 5,460,316 A
• Filed: 09/15/1994
• Issued: 10/24/1995
• Est. Priority Date: 09/15/1993
• Status: Expired due to Term

• Current Assignee: NCR Corporation (NCR Voyix Corporation)
• Original Assignee: AT&T Global Information Solutions Company (NCR Voyix Corporation)
• Inventors: Hefele, Hermann L.
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US08/306,547
• Time in Patent Office: 404 Days
• Field of Search: 228/39, 228/215, 228/248.1, 228/248.5, 118/406, 101/127, 101/128.4, 427/249, 427/282
• US Class Current: 228/39
• CPC Class Codes: B41F 15/36 flat
• CPC Class Codes: B41N 1/24 Stencils; Stencil materials; Carriers therefor stencilling apparatus for office or other commercial use B41L13/00
• CPC Class Codes: H05K 3/1225 Screens or stencils; Holders therefor

Abstract

Stencils having enhanced wear-resistance consisting of a metal body, preferably fabricated from stainless steel, having a first major surface and a second major surface and a plurality of apertures extending through the metal body from the first major surface to the second major surface, and a diamond coating which is preferably applied to at least the top surface of the metal body, and to the side walls of the plurality of apertures. Such stencils are particularly useful for positioning solder paste in predetermined areas on contact pads of printing wiring boards. The diamond coating is preferably deposited on the stencil surfaces from a vapor phase of carbon-containing gases. By applying the diamond coating to the top and side wall surfaces of the stencil, improved wear-resistance is achieved, resulting in increased service life for the stencils.

Claims

1. A stencil, comprising a body having a first major surface, a second major surface and at least one aperture extending through said body from said first major surface to said second major surface, said at least one aperture having a side wall surface, wherein said side wall surface of said at least one aperture and at least one of said first major surface and said second major surface have a diamond coating thereon.

2. The stencil in accordance with claim 1, wherein said side wall surface of said at least one aperture slopes outwardly in a direction from said first major surface to said second major surface.

3. The stencil in accordance with claim 1, wherein said stencil has a thickness of between 0.1 mm and 0.2 mm.

4. The stencil in accordance with claim 2 wherein said stencil has a thickness of between 0.1 mm and 0.2 mm.

5. The stencil in accordance with claim 1, wherein the thickness of said diamond coating is between 0.5 μ

m and 2 μ

m.

6. The stencil in accordance with claim 4, wherein the thickness of said diamond coating is between 0.5 μ

m and 2 μ

m.

7. The stencil in accordance with claim 1, wherein said second major surface also has said diamond coating thereon.

8. The stencil in accordance with claim 6, wherein said second major surface also has said diamond coating thereon.

9. A stencil for positioning solder paste in a predetermined pattern on contact pads of a printed circuit board, the stencil comprising a body having a first major surface, a second major surface and a plurality of apertures extending through said body from said first major surface to said second major surface, said apertures each having a side wall surface, wherein said side wall surfaces of said apertures and at least one of said first major surface and said second major surface have a diamond coating thereon.

10. The stencil in accordance with claim 9, wherein said side wall surfaces of said apertures slope outwardly in a direction from said first major surface to said second major surface.

11. The stencil in accordance with claim 9, wherein said stencil has a thickness of between 0.1 mm and 0.2 mm.

12. The stencil in accordance with claim 10, wherein said stencil has a thickness of between 0.1 mm and 0.2 mm.

13. The stencil in accordance with claim 9, wherein the distance between the center of adjacent apertures is between 0.2 mm and 1.25 mm.

14. The stencil in accordance with claim 12, wherein the distance between the center of adjacent apertures is between 0.2 mm and 1.25 mm.

15. The stencil in accordance with claim 9, wherein the thickness of said diamond coating is between 0.5 μ

m and 2 μ

m.

16. The stencil in accordance with claim 14, wherein the thickness of said diamond coating is between 0.5 μ

m and 2 μ

m.

17. The stencil in accordance with claim 9, wherein said second major surface also has said diamond coating thereon.

18. The stencil in accordance with claim 16, wherein said second major surface also has said diamond coating thereon.

19. The stencil in accordance with claim 9, wherein said body is fabricated from a stainless steel material.

20. The stencil in accordance with claim 18, wherein said body is fabricated from a stainless steel material.

21. The stencil in accordance with claim 9, wherein said apertures correspond with the contact pads of the printed circuit board.

22. The stencil in accordance with claim 20, wherein said apertures correspond with the contact pads of the printed circuit board.

23. A method of manufacturing a stencil, comprising the steps of:

providing a stainless steel body having a first major surface, a second major surface and at least one aperture extending through said body from said first major surface to said second major surface, said at least one aperture having a side wall surface;

applying a diamond coating to said side wall surface of said at least one aperture and at least one of said first major surface and said second major surface by a low pressure diamond synthesis process.

24. The method of manufacturing a stencil in accordance with claim 23, wherein said step of applying a diamond coating to said side wall surface of said at least one aperture and at least one of said first major surface and said second major surface by a low pressure diamond synthesis process consists of depositing said diamond coating from a vapor phase of carbon-containing gases.

25. The method of manufacturing a stencil in accordance with claim 23, wherein said step of applying a diamond coating to said side wall surface of said at least one aperture and at least one of said first major surface and said second major surface by a low pressure diamond synthesis process consists of depositing said diamond coating by a hot filament technique from a mixture of approximately 1% methane in hydrogen at a pressure of 50 millibars, using a tungsten wire mesh heated to approximately 2200°

C.

26. The method of manufacturing a stencil in accordance with claim 23, wherein said step of applying a diamond coating to said side wall surface of said at least one aperture and at least one of said first major surface and said second major surface by a low pressure diamond synthesis process consists of depositing said diamond coating by directing microwave radiation at a mixture of approximately 1% methane in hydrogen at a pressure of 50 millibars so as to form a glowing plasma which causes decomposition of the methane, dissociation of the hydrogen and formation of said diamond coating.