Portable semiconductor device with resin
First Claim
Patent Images
1. A portable semiconductor device comprising:
- a two-part container serving as an outer skin;
a circuit board on which electronic parts are mounted, said circuit board being accommodated in said container; and
a foamed resin filled in a gap between said container and said circuit board,wherein at least one part of said two-part container has a recessed electronic part accommodating portion in which the electronic parts mounted on said circuit board are accommodated and in which said foamed resin is charged, a foamed resin accommodating portion provided at a peripheral edge portion of said container to accommodate an excess of foamed resin, and being partitioned from said electronic part accommodating portion by a rib, and a coupling groove extending through said rib for coupling said electronic part accommodating portion to said foamed resin accommodating portion.
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Accused Products
Abstract
At least one part of a two-part container of a portable semiconductor device has an electronic part accommodating portion, a foamed resin accommodating portion provided at a peripheral edge portion of the container for accommodating an excess of foamed resin, and a coupling groove for coupling the electronic part accommodating portion to the foamed resin accommodating portion. Since the electronic parts and a circuit board are completely embedded in the device, a semiconductor device exhibiting excellent resistance to environment can be manufactured by a simple process.
72 Citations
27 Claims
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1. A portable semiconductor device comprising:
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a two-part container serving as an outer skin; a circuit board on which electronic parts are mounted, said circuit board being accommodated in said container; and a foamed resin filled in a gap between said container and said circuit board, wherein at least one part of said two-part container has a recessed electronic part accommodating portion in which the electronic parts mounted on said circuit board are accommodated and in which said foamed resin is charged, a foamed resin accommodating portion provided at a peripheral edge portion of said container to accommodate an excess of foamed resin, and being partitioned from said electronic part accommodating portion by a rib, and a coupling groove extending through said rib for coupling said electronic part accommodating portion to said foamed resin accommodating portion. - View Dependent Claims (2, 3, 4, 5)
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6. A portable semiconductor device comprising:
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a container serving as an outer skin, said container including a frame serving as an outer edge portion, and a surface sheet material adhered to each of two surfaces of said frame; a circuit board on which electronic parts are mounted, said circuit board being accommodated in said container; and a foamed resin filling a gap between said container and said circuit board, wherein a rib is formed integrally with said frame on an inner side of said frame, whereby an electronic part accommodating portion in which said electronic parts on said circuit board are mounted and in which said foamed resin is charged is formed on an inner side of said rib and whereby a foamed resin accommodating portion for accommodating an excess of the foamed resin in said electronic part accommodating portion is formed between said rib and said a peripheral edge portion of said frame, and wherein a coupling groove for coupling said electronic part accommodating portion to said foamed resin accommodating portion is provided. - View Dependent Claims (7, 8, 9, 10, 11)
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12. A semiconductor device comprising:
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a container serving as an outer shell; a circuit board on which electronic parts are mounted, said circuit board being disposed in said container; and a foamed resin which fills a gap between said container and said circuit board, wherein said container has an electronic part accommodating portion to accommodate said circuit board, a resin accommodating portion disposed along a perimeter of said container to accommodate an excess of foamed resin, said resin accommodating portion being partitioned from said electronic part accommodating portion by a rib, and a coupling groove extending through said rib to couple said electronic part accommodating portion to said resin accommodating portion. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. An integrated circuit card comprising:
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a container serving as an outer shell of the integrated circuit card; a circuit board disposed in said container; and a resin which fills a gap between said container and said circuit board, wherein said container has an electronic part accommodating portion to accommodate said circuit board, a resin accommodating portion disposed along a peripheral edge of said container to accommodate an excess of resin, said resin accommodating portion being partitioned from said electronic part accommodating portion by a rib, and a coupling groove extending through said rib to couple said electronic part accommodating portion to said resin accommodating portion. - View Dependent Claims (24, 25, 26, 27)
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Specification