Enclosure for an electronic circuit module

• US 5,461,541 A
• Filed: 02/22/1994
• Issued: 10/24/1995
• Est. Priority Date: 02/22/1994
• Status: Expired due to Fees

• Current Assignee: Pacsci Motion Control, Inc. (Regal Rexnord Corp.)
• Original Assignee: Dana Corporation (Dana, Inc.)
• Inventors: Wentland, William A. Jr., Rosati, Ramon W., Hansen, Alan M.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/200,071
• Time in Patent Office: 609 Days
• Field of Search: 248/316.7, 174/16.3, 267/160, 267/164, 165/80.3, 165/185, 165/80.1, 165/80.2, 403/372, 411/516, 411/520, 411/522, 24/295, 24/457, 24/458, 24/530, 24/531, 24/568, 24/570, 257/707, 257/709, 257/713, 257/718, 257/719, 257/726, 257/727, 361/704-707, 361/713-719, 361/807, 361/809, 361/811
• US Class Current: 361/707
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence
• CPC Class Codes: Y10T 24/44983 formed from single rigid piece of material

Abstract

An enclosure for protectively housing a printed circuit board in an electronic circuit module includes a base having an internal surface and an external surface. The base includes a pair of raised mounting pads formed on the internal surface which define respective mounting surfaces. A pair of channels are also formed on the internal surface of the base. The enclosure further includes a cover having a panel portion and a pair of end wall portions. Respective projections are formed on each of the end wall portions which define grooves therein. The cover is assembled to the base by inserting the edges of the end wall portions provided on the cover into the channels provided on the base. A plurality of spring clips is disposed within each of the grooves provided on the cover. The spring clips can be positioned at any desired location along each of the grooves. When the cover is connected to the base, the spring clips urge electrical components mounted on the printed circuit board into abutment with the mounting pads provided on the base. As a result, a firm mechanical engagement is maintained between the electrical components and the mounting pads. The mounting pads conduct heat generated by electrical components away therefrom for dissipation.

Claims

1. An electronic circuit module comprising:

a base including a surface;

a cover secured to said base, said cover including a surface having a groove formed therein;

a spring slidably mounted in said groove formed in said cover; and

an electrical component disposed between said base and said cover, said spring urging said electrical component into engagement with said surface of said base.

2. The electronic circuit module defined in claim 1 wherein said base is formed from a thermally conductive material.

3. The electronic circuit module defined in claim 2 wherein said base is formed from aluminum.

4. The electronic circuit module defined in claim 1 wherein said cover is formed from a thermally conductive material.

5. The electronic circuit module defined in claim 4 wherein said base is formed from aluminum.

6. The electronic circuit module defined in claim 1 wherein said spring is a generally V-shaped spring clip.

7. The electronic circuit module defined in claim 1 wherein said spring is normally frictionally retained in said groove and is slidable throughout said groove upon flexing thereof.

8. The electronic circuit module defined in claim 1 further including a plurality of electrical components disposed between said base and said cover.

9. The electronic circuit module defined in claim 8 further including a plurality of springs slidably mounted in said groove, said springs urging said plurality of electrical components into engagement with said surface of said base.

10. The electronic circuit module defined in claim 1 wherein said cover includes a plurality of grooves formed therein, and wherein at least one spring is slidably mounted in each of said grooves.

11. The electronic circuit module defined in claim 1 further including a mounting pad projecting from said surface of said base generally toward said cover, and wherein said electrical component is urged into engagement with said mounting pad by said spring.

12. The electronic circuit module defined in claim 1 further including a layer of electrically insulating material disposed between said electrical component and said surface of said base.

13. The electronic circuit module defined in claim 12 wherein said layer of electrically insulating material is formed from silicon.

14. The electronic circuit module defined in claim 1 wherein said cover includes a generally fiat panel having an end wall extending generally perpendicular thereto, said surface of said cover being located on said end wall.

15. The electronic circuit module defined in claim 14 wherein said end wall is a first end wall, and wherein said cover further includes a second end wall extending generally perpendicular to said panel.

16. The electronic circuit module defined in claim 15 wherein said groove is a first groove, and wherein a second groove is formed in said second end wall of said cover, a second spring being slidably mounted in said second groove for urging a second electrical component into engagement with said surface of said base.

17. The electronic circuit module defined in claim 16 wherein said base is formed having first and second surfaces, said first spring urging said first electrical component into engagement with said first surface of said base, said second spring urging said second electrical component into engagement with said second surface of said base.

18. The electronic circuit module defined in claim 1 further including a side plate secured to said base and said cover to form an enclosure.

19. The electronic circuit module defined in claim 1 further including first and second side plates secured to opposite ends of said base and said cover to form an enclosure.