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Process and device for hermetic encapsulation of electronic components

  • US 5,461,545 A
  • Filed: 09/13/1994
  • Issued: 10/24/1995
  • Est. Priority Date: 08/24/1990
  • Status: Expired due to Term
First Claim
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1. Device for hermetic encapsulation of electronic components, comprisingpackages enclosing electronic components,a printed circuit board on which the packages are mechanically mounted and electrically connected,a first layer of a deposited organic material covering the whole of the board and the packages except where needed to make contacts;

  • a second layer of a deposited hermetic inorganic material covering the first layer.

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