Process and device for hermetic encapsulation of electronic components
First Claim
1. Device for hermetic encapsulation of electronic components, comprisingpackages enclosing electronic components,a printed circuit board on which the packages are mechanically mounted and electrically connected,a first layer of a deposited organic material covering the whole of the board and the packages except where needed to make contacts;
- a second layer of a deposited hermetic inorganic material covering the first layer.
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Accused Products
Abstract
According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.
142 Citations
12 Claims
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1. Device for hermetic encapsulation of electronic components, comprising
packages enclosing electronic components, a printed circuit board on which the packages are mechanically mounted and electrically connected, a first layer of a deposited organic material covering the whole of the board and the packages except where needed to make contacts; a second layer of a deposited hermetic inorganic material covering the first layer. - View Dependent Claims (2, 3, 4, 9, 10, 11, 12)
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5. A hermetic encapsulation of at least one electronic component, comprising
an electronic component, a first layer on the component, said first layer being made of a deposited organic material and of a thickness and having an outer surface shape smoother than the surface shape of the component, and a second layer on the first layer, said second layer being made of a deposited hermetic inorganic material.
Specification