Circuit board for optical devices
First Claim
1. An optical circuit board for adapted mounting one or more LSI chips for emitting and/or receiving light, comprising:
- a transparent substrate;
a window portion which is formed as a slit-like transparent region of said transparent substrate for transmitting light coming in and going out of said LSI chip;
a plurality of electrodes provided on a first primary surface of said transparent substrate corresponding to said LSI chip respectively and disposed at least on one side of said window portion along the longitudinal direction of said window portion;
a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being opposite to said first primary surface with reference to said transparent substrate; and
an electrical connection portion penetrating said transparent substrate;
whereineach of said aggregated electrodes is electrically connected with a plurality of electrodes which constitute a part of said electrodes through said electrical connection portion, respectively.
2 Assignments
0 Petitions
Accused Products
Abstract
A circuit board for mounting one or more optical devices such as light receiving LSI chips and light emitting LSI chips. The circuit board has a flexible transparent substrate, a window portion which is formed as a slit-like transparent region of the transparent substrate, a plurality of electrodes for bonding the optical devices thereon provided on one surface of the substrate, a plurality of aggregated electrodes provided on the other surface on a region corresponding to the electrodes in a manner extending respectively in the longitudinal direction of the window portion and electrical connection portions penetrating the substrate. Each of the aggregated electrodes is electrically connected with two or more of the electrodes through the electrical connection portion. The circuit board will be used in, for example, an optical reader, an optical printer or the like in such a manner that the light which is coming in and/or going out of the optical device is transmitted through the window portion.
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Citations
39 Claims
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1. An optical circuit board for adapted mounting one or more LSI chips for emitting and/or receiving light, comprising:
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a transparent substrate; a window portion which is formed as a slit-like transparent region of said transparent substrate for transmitting light coming in and going out of said LSI chip; a plurality of electrodes provided on a first primary surface of said transparent substrate corresponding to said LSI chip respectively and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate;
whereineach of said aggregated electrodes is electrically connected with a plurality of electrodes which constitute a part of said electrodes through said electrical connection portion, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. An optical circuit board adapted for mounting thereon one or more optical reading LSI chips with connection bumps used in an optical reader for optically reading a manuscript, comprising:
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a transparent substrate; a window portion which is formed as a slit-shaped transparent region of said transparent substrate for transmitting the light incident upon said reading devices; a plurality of electrodes provided on a first primary surface of said transparent substrate to be used for electrical connection with said LSI chip respectively and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being disposed opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate;
whereinsaid circuit board is disposed with the longitudinal direction of said window portion traversing the direction of the relative movement of said manuscript exercised with reference to said optical reader; and each of said aggregated electrodes is electrically connected with a plurality of electrodes which constitute a part of said electrodes, through said electrical connection portion.
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39. An optical circuit board adapted for mounting one or more optical image forming LSI chips with connection bumps used in an optical image forming apparatus for optically forming an image with reference to photosensitive matter, comprising:
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a transparent substrate; a window portion which is formed as a slit-shaped transparent region of said transparent substrate for transmitting the light emitted from said optical image forming LSI chip; a plurality of electrodes provided on a first primary surface of said transparent substrate to be used for electrical connection with said optical image forming LSI chip, respectively, and disposed at least on one side of said window portion along the longitudinal direction of said window portion; a plurality of aggregated electrodes provided on a second primary surface on a region corresponding to said electrodes in a manner extending respectively in the longitudinal direction of said window portion, said second primary surface being disposed opposite to said first primary surface with reference to said transparent substrate; and an electrical connection portion penetrating said transparent substrate;
whereinsaid circuit board is placed with the longitudinal direction of said window portion traversing the direction in which the relative movement between said photosensitive matter and said optical image forming apparatus occurs; and each of said aggregated electrodes is electrically connected with a plurality of electrodes which are included in said electrodes through said electrical connection portion, respectively.
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Specification