Hybrid electrostatic chuck

• US 5,463,526 A
• Filed: 01/21/1994
• Issued: 10/31/1995
• Est. Priority Date: 01/21/1994
• Status: Expired due to Term

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Mundt, Randall S.
• Primary Examiner(s): Gaffin, Jeffrey A.
• Application Number:
  US08/184,707
• Time in Patent Office: 648 Days
• Field of Search: 361/230, 361/233, 361/234, 269/8, 269/903, 279/128
• US Class Current: 361/234
• CPC Class Codes: C23C 28/00 Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

An electrostatic chuck comprises a hybrid dielectric between a wafer and an electrode. The hybrid dielectric is comprised of two layers; a thin insulating layer for attracting and holding the bottom of the wafer; and a mechanically and electrically robust semiconducting layer below. The resistivity of the semiconducting layer can cover a wider range of values for equivalent performance than has been achievable heretofore with Johnson-Rahbeck effect devices. The hybrid layer combines the high force/voltage ratio and quick charge/discharge features of a thin insulating dielectric chuck with the protection provided by a current limiting semiconducting layer. The hybrid layer chuck provides improved performance with simple, low cost structures.

Claims

1. An electrostatic chuck for electrostatically attracting and holding an object, comprising:

a first layer having top and bottom surfaces, the first layer consisting essentially of an insulating material for attracting and supporting such object on its top surface;

a second layer having upper and lower surfaces, the second layer consisting essentially of a semiconducting material, the upper surface of the second layer being in contact with the bottom surface of the first layer;

an electrode formed on the lower surface of the second layer;

supporting means for supporting the first layer, the second layer and the electrode; and

electrical connection means for connecting an electric potential between the object and the electrode;

whereby an attractive electrostatic force will be generated between the object and the chuck.

2. An electrostatic chuck as set forth in claim 1 wherein the second layer is a semiconductor having a bulk resistivity between 10⁸ ohm-cm and 10¹³ ohm-cm.

3. An electrostatic chuck as set forth in claim 1 wherein the second layer has a thickness greater than 0.005 inches.

4. An electrostatic chuck as set forth in claim 1 wherein the second layer is composed of a material consisting essentially of aluminum oxide and titanium dioxide.

5. An electrostatic chuck as set forth in claim 1 wherein the second layer comprises between 5% and 30% titanium dioxide with the remainder essentially being aluminum oxide.

6. An electrostatic chuck as set forth in claim 1 wherein the first layer consists of a material having a bulk resistivity of greater than about 10¹⁵ ohm-cm.

7. An electrostatic chuck as set forth in claim 1 wherein the first layer has a thickness of between about 0.0005 inches and 0.005 inches.

8. An electrostatic chuck as set forth in claim 1 wherein the first layer consists essentially of aluminum oxide.

9. An electrostatic chuck as set forth in claim 1 wherein the first layer consists essentially of aluminum oxide and the second layer is composed of a material consisting essentially of aluminum oxide and titanium dioxide.

10. An electrostatic chuck for electrostatically attracting and holding an object, comprising

a first layer having top and bottom surfaces, the first layer consisting essentially of an insulating material for attracting and supporting the object on the top surface;

a second layer having upper and lower surfaces, the second layer consisting essentially of a semiconductive material, the upper surface of the second layer being in contact with the bottom surface of the first layer;

at least two planar electrodes formed on the lower surface of the second layer and separated by a gap therebetween, the electrodes forming a first and a second capacitor between the electrodes and the work object, wherein portions of the first layer and second layer form a series dielectric between the two capacitors;

supporting means for supporting the electrodes, the second layer and the first layer; and

electrical connection means for connecting an electric potential between the at least two electrodes;

whereby an attractive electrostatic force will be generated between the object and the chuck.

11. An electrostatic chuck as set forth in claim 10 wherein the second layer is a semiconductor having a bulk resistivity between 10⁸ ohm-cm and 10¹³ ohm-cm.

12. An electrostatic chuck as set forth in claim 10 wherein the second layer has a thickness of greater than 0.005 inches.

13. An electrostatic chuck as set forth in claim 10 wherein the second layer is composed of a material consisting essentially of aluminum oxide and titanium dioxide.

14. An electrostatic chuck as set forth in claim 10 wherein the second layer consists essentially of between 5% and 30% titanium dioxide with the remainder essentially being aluminum oxide.

15. An electrostatic chuck as set forth in claim 10 wherein the first layer consists of a material having a bulk resistivity of greater than about 10¹⁵ ohm-cm.

16. An electrostatic chuck as set forth in claim 10 wherein the first layer has a thickness of between about 0.0005 inches and 0.005 inches.

17. An electrostatic chuck as set forth in claim 10 wherein the first layer consists essentially of aluminum oxide.

18. An electrostatic chuck as set forth in claim 10 wherein the first layer consists essentially of aluminum oxide and the second layer is composed of a material consisting essentially of aluminum oxide and titanium dioxide.