High performance thermal interface for low temperature electronic modules

• US 5,463,872 A
• Filed: 09/08/1994
• Issued: 11/07/1995
• Est. Priority Date: 09/08/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Vasile, Vincent C., Vader, David T.
• Primary Examiner(s): KILNER, CHRISTOPHER B
• Application Number:
  US08/303,254
• Time in Patent Office: 425 Days
• Field of Search: 62/64, 62/62, 62/259.2, 62/51.1, 361/699, 361/700, 165/80.4
• US Class Current: 62/51.1
• CPC Class Codes: H01L 23/445 the fluid being a liquefied gas, e.g. in a cryogenic vessel
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A device and method for cryogenic cooling of electronic components. A mixture of a first non-condensible gas and a second condensible gas is provided within an insulative housing. The non-condensible gas mixture has a partial pressure equal to the desired saturation pressure of the condensible gas. The insulative housing also includes an immersion chamber for housing electronic components. The immersion chamber preferably comprises two retainer parts and provides an module retainer top and a lower coldplate retainer bottom. The module retainer top allows gas to pass through the module retainer portion freely. The condensible gas is then turned into liquid form by a provided condensing means. The condensed liquid thus forms and collects inside the immersion chamber against the coldplate retainer bottom to cool the electronic components placed within. The non-condensible gas permits the condensed liquid to be subcooled.

Claims

1. A cryogenic cooling device for cooling electronic components, said device comprising:

a thermally insulative and sealed housing containing a gas mixture of a first gas and a second gas, said gas mixture being at a pressure equal to the partial pressure of said first gas and to the saturation pressure of said second gas, said first gas being non-condensible and said second gas being condensible within a desired operating temperature range for said electronic components;

an immersion chamber disposed within said insulative housing for holding said electronic components in contact with a condensed phase of said condensible second gas, said chamber being in gaseous flow communication with the interior of said insulative housing; and

condensing means in thermal contact with said immersion chamber for condensing said second condensible gas to a liquid form, said condensed liquid collecting in said immersion chamber for cooling said electronic components.

2. The device of claim 1, wherein said insulative housing comprises a vacuum sealed dome holding said gas mixtures;

and

an insulation portion, partially in contact with said immersion chamber which serves to insulate said device in locations not sealed by said vacuum sealed dome.

3. The device of claim 2, wherein said insulative portion comprises a first insulative material area disposed against an exterior surface of said coldplate bottom whereby liquid condensate forms only within said tray;

a second insulative material area made of same or different material as said first insulative material, disposed under said vacuum sealed dome where said sealed housing is not insulated.

4. The device of claim 3, wherein said second insulative material area includes seal preserving means for allowing an electrical cable to pass through.

5. The device of claim 1, further including protruding radial fingers extending from a wall of said immersion chamber to contact said electronic components.

6. The device of claim 1, further including spring loaded plungers extending from a wall of said immersion chamber to contact said electronic components.

7. The device of claim 1, wherein said condensing means is a cryocooler cold head.

8. The device of claim 1, wherein said immersion chamber includes means for mounting electronic components so as to insure their contact with said condensed phase.

9. The device of claim 1, wherein said immersion chamber separates a module retainer top from a coldplate bottom;

and

said module retainer top allowing said gas mixture to pass through freely.

10. The device of claim 9, wherein said immersion chamber includes a portion having a lip, said lip forming a tray inside said chamber for holding said condensed phase.

11. The device of claim 10, wherein said coldplate bottom also includes fins, said fins serving to facilitate condensation of said second condensable gas.

12. The device of claim 1, wherein high internal gas mixture pressure prior to condensation is adjusted by connecting said sealed housing to a remote gas means for providing a second gas mixture;

said sealed housing being connected to said remote gas means via a small diameter connecting tube, said connecting tube being thermally isolated;

said second gas mixture being at room temperature and containing said same condensible and non-condensible gases with same pressure as said gas mixture in said cavity so as to impose room temperature pressure at all times even after said gas mixture adjacent to said immersion chamber is cooled; and

said connecting tube permitting said two gas mixtures to flow freely between said remote means and said cavity and also allowing said condensible gas from said remote gas means to diffuse into said immersion chamber.

13. The device of claim 1, wherein said sealed housing only contains a condensible gas and lower maximum gas pressures in said sealed housing are attained by connecting said sealed housing via a small diameter connecting tube to a second remote gas means providing a non-condensible gas at room temperature;

a low cracking pressure check valve placed inside said connecting tube, said check valve only allowing flow of said non-condensible gas from said second remote means into said sealed housing;

pressure of said gas mixture and said first non-condensible gas from said second remote gas means being equal at room temperature and exceeding saturation pressure of said condensible gas by an amount equal to said check valve'"'"'s cracking pressure;

said check valve having an open and a closed position and being in said closed position when said second condensible gas is not yet condensed into liquid form;

said check valve moving into said open position when said liquid condensate is formed causing said gas pressure in said immersion chamber to become different and lower than pressure of said non-condensible gas from said remote gas means;

said sealed housing also having a pressure relief vent for discharging said gas mixture when pressure in said immersion chamber is increased due to rising temperatures expanding said gas mixtures, said gas pressure in said immersion chamber becoming different and greater than pressure of said gas from said remote gas means.

14. A method for cryogenic cooling of electronic components in a computer system, said method comprising the steps of:

enclosing a first non-condensible gas and a second condensible gas in a thermally insulative and sealed housing, said non-condensible gas having partial pressure equal to saturation pressure of said second condensible gas;

providing an immersion chamber within said housing for contacting said electronic components with a condensed phase of said condensible gas; and

condensing said condensible gas to a liquid form and collecting said condensed liquid within said immersion chamber.