High performance thermal interface for low temperature electronic modules
First Claim
1. A cryogenic cooling device for cooling electronic components, said device comprising:
- a thermally insulative and sealed housing containing a gas mixture of a first gas and a second gas, said gas mixture being at a pressure equal to the partial pressure of said first gas and to the saturation pressure of said second gas, said first gas being non-condensible and said second gas being condensible within a desired operating temperature range for said electronic components;
an immersion chamber disposed within said insulative housing for holding said electronic components in contact with a condensed phase of said condensible second gas, said chamber being in gaseous flow communication with the interior of said insulative housing; and
condensing means in thermal contact with said immersion chamber for condensing said second condensible gas to a liquid form, said condensed liquid collecting in said immersion chamber for cooling said electronic components.
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Accused Products
Abstract
A device and method for cryogenic cooling of electronic components. A mixture of a first non-condensible gas and a second condensible gas is provided within an insulative housing. The non-condensible gas mixture has a partial pressure equal to the desired saturation pressure of the condensible gas. The insulative housing also includes an immersion chamber for housing electronic components. The immersion chamber preferably comprises two retainer parts and provides an module retainer top and a lower coldplate retainer bottom. The module retainer top allows gas to pass through the module retainer portion freely. The condensible gas is then turned into liquid form by a provided condensing means. The condensed liquid thus forms and collects inside the immersion chamber against the coldplate retainer bottom to cool the electronic components placed within. The non-condensible gas permits the condensed liquid to be subcooled.
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Citations
14 Claims
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1. A cryogenic cooling device for cooling electronic components, said device comprising:
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a thermally insulative and sealed housing containing a gas mixture of a first gas and a second gas, said gas mixture being at a pressure equal to the partial pressure of said first gas and to the saturation pressure of said second gas, said first gas being non-condensible and said second gas being condensible within a desired operating temperature range for said electronic components; an immersion chamber disposed within said insulative housing for holding said electronic components in contact with a condensed phase of said condensible second gas, said chamber being in gaseous flow communication with the interior of said insulative housing; and condensing means in thermal contact with said immersion chamber for condensing said second condensible gas to a liquid form, said condensed liquid collecting in said immersion chamber for cooling said electronic components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for cryogenic cooling of electronic components in a computer system, said method comprising the steps of:
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enclosing a first non-condensible gas and a second condensible gas in a thermally insulative and sealed housing, said non-condensible gas having partial pressure equal to saturation pressure of said second condensible gas; providing an immersion chamber within said housing for contacting said electronic components with a condensed phase of said condensible gas; and condensing said condensible gas to a liquid form and collecting said condensed liquid within said immersion chamber.
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Specification