Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar structures

• US 5,465,152 A
• Filed: 06/03/1994
• Issued: 11/07/1995
• Est. Priority Date: 06/03/1994
• Status: Expired due to Term

• Current Assignee: Rudolph Technologies Incorporated (Onto Innovation Inc.)
• Original Assignee: Robotic Vision Systems, Inc. (Omron Corporation)
• Inventors: Cain, James, Bilodeau, Steve, Jacovino, Frank, Cameron, Joanne
• Primary Examiner(s): Rosenberger, Richard A.
• Application Number:
  US08/253,989
• Time in Patent Office: 522 Days
• Field of Search: 356/376, 356/371, 356/237
• US Class Current: 356/602
• CPC Class Codes: G01B 11/306 for measuring evenness
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3511 Warping

Abstract

A method for determining coplanarity with 3-D sensing means of substrates for ball grid array, column grid array, and similar surface mount integrated circuit chips, in which opaque fiducials are provided as index pads. Heights of the index pads are correlated with signal pad heights in a neighborhood about the index pads. The index pads are opaque to incident radiation from the 3-D sensor. The index pads reflect sufficient radiation to be detected easily by the 3-D sensor. The index pads are disposed in a prearranged pattern over a domain of ball grid array signal pads. The index pads are restricted to a predetermined range of heights.

Claims

1. A method for determining coplanarity of substrates for ball grid array, column grid array, and similar surface mount integrated circuit chips, using 3-D optical sensing means, comprising the steps of:

providing opaque fiducials as index pads where the heights of said index pads are correlated with signal pad heights in a neighborhood about said index pads;

said index pads being opaque to incident radiation from said 3-D optical sensing means;

reflecting by said index pads sufficient radiation allow height measurement by said 3-D optical sensing means;

disposing said index pads in a prearranged pattern over a domain of array signal pads;

restricting said index pads to a predetermined range of heights;

measuring the heights of each of at least three said index pads at said index pad coordinate locations;

suitably fitting a preselected surface shape to the index pad height and coordinate location data; and

calculating the difference in height between each index pad and the preselected surface shape evaluated at the index pad location.

2. A method as defined in claim 1, wherein said index pads are distributed uniformly in regions where, from substrate mechanical design considerations, coplanarity varies slowly with position, said index pads having a denser distribution where the coplanarity varies abruptly;

bounding said range of heights of said index pads to a maximum value corresponding to a smallest height of balls of said ball grid array, columns of said column grid array, or elements of other types of arrays;

measuring heights of said index pads by said 3-D optical sensing means;

said index pads having top surface areas;

measures of said index pad heights determining coplanarity at each of the index pad locations by curvefitting a preselected curve shape to the index pad height measurements at each of the grid array element locations, be they ball, column, or other, and calculating the difference in height between each index pad and the preselected surface shape evaluated at the index pad location;

avoiding erroneous measurements associated with translucent and transparent substrate materials that lead said 3-D sensor to determine mistakenly that a signal pad surface is located at an embedded conductor line or subsurface location; and

avoiding measurement problems associated with substrate surface imperfections having height variations not representative of array substrate coplanarity.

3. A method as defined in claim 1, wherein said index pads are metallic and opaque.

4. A method as defined in claim 1, wherein said index pads are produced separately from the signal pads.

5. A method as defined in claim 4, wherein said index pads are produced separately from the signal pads by addition of material to unused signal pads.

6. A method as described in claim 4, in which the index pads are fabricated from an opaque, nonconductive material.

7. A method as described in claim 4, in which the index pads are fabricated from an opaque, composite structure consisting of a conductive core coated with a nonconductive outer surface layer.

8. A method as defined in claim 1, wherein said index pads are produced separately and located in interstices between adjacent signal pads.

9. A method as described in claim 1, in which the index pads are fabricated from an opaque, nonconductive material.

10. A method as described in claim 1, in which the index pads are fabricated from an opaque, composite structure consisting of a conductive core Coated with a nonconductive outer surface layer.

11. A method as described in claim 1, in which the index pads are identical with the signal pads rather than separately fabricated elements intended solely for use as fiducial pads, which index pads are located at signal pad sites outside of sites occupied by array elements such as bga balls, columns or other.

12. A method as described in claim 1, in which the index pads are identical with the signal pads rather than separately fabricated elements intended solely for use as fiducial pads, which index pads are located at signal pad sites occupied by array elements such as bga balls, columns or other;

and determining coplanarity prior to deposition of grid array elements.