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Method for producing semiconductor articles

  • US 5,466,631 A
  • Filed: 02/23/1995
  • Issued: 11/14/1995
  • Est. Priority Date: 10/11/1991
  • Status: Expired due to Term
First Claim
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1. A method for producing a semiconductor article, comprising, in sequence, the steps of:

  • (i) preparing a first substrate having a non-porous semiconductor layer on a porous semiconductor region;

    (ii) forming unevenness on the surface at the side of said semiconductor layer of said first substrate;

    (iii) bonding the surface of said first substrate having said unevenness formed thereon to the surface of a second substrate so as to be in contact with each other; and

    (iv) removing said porous semiconductor such that said semiconductor layer is bonded to said second substrate to thereby transfer said semiconductor layer from said first substrate onto said second substrate.

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