Printed circuit boards and heat sink structures
First Claim
Patent Images
1. A printed circuit board and heat sink structure comprising:
- a heat sink and a printed circuit board;
the printed circuit board having a substantially planar circuitry layer, a plurality of electronic components disposed on one side of the plane of the circuitry layer, and a heat conductive layer means disposed on the other side of the plane of the circuitry layer, the heat conductive layer means extending across an area of the printed circuit board between positions in which the heat conductive layer means lies opposite to the plurality of electronic components and in heat conductive relationship with the electronic components for distributing heat received from any component throughout the heat conductive layer means and between said positions;
and the heat sink is spaced from the printed circuit board to define an air gap between the heat sink and the printed circuit board;
and wherein the heat conductive layer means comprises a first and second heat conductive layers which are spaced apart by heat insulating material of the printed circuit board and are connected to one another by heat conductive members extending through the insulating material, the first of the heat conductive layers on one side of the insulating material being in heat conductive relationship with the electronic components and the second conductive layer being in heat exchange relationship with the heat sink by thermally conductive bridge members which extend in localized and spaced positions across the gap to transmit heat from the second conductive layer into the heat sink, the bridge members limiting the rate of heat transfer into the heat sink such as to enable distribution of heat from the electronic components throughout the heat conductive layer means.
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0 Petitions
Accused Products
Abstract
Printed circuit board and heat sink assembly in which heat conductive elements are provided to distribute heat across the board before transferring heat into the heat sink. Also in other structures, heat is conducted directly into a heat sink from surface mount components while bypassing the board.
143 Citations
10 Claims
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1. A printed circuit board and heat sink structure comprising:
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a heat sink and a printed circuit board; the printed circuit board having a substantially planar circuitry layer, a plurality of electronic components disposed on one side of the plane of the circuitry layer, and a heat conductive layer means disposed on the other side of the plane of the circuitry layer, the heat conductive layer means extending across an area of the printed circuit board between positions in which the heat conductive layer means lies opposite to the plurality of electronic components and in heat conductive relationship with the electronic components for distributing heat received from any component throughout the heat conductive layer means and between said positions; and the heat sink is spaced from the printed circuit board to define an air gap between the heat sink and the printed circuit board; and wherein the heat conductive layer means comprises a first and second heat conductive layers which are spaced apart by heat insulating material of the printed circuit board and are connected to one another by heat conductive members extending through the insulating material, the first of the heat conductive layers on one side of the insulating material being in heat conductive relationship with the electronic components and the second conductive layer being in heat exchange relationship with the heat sink by thermally conductive bridge members which extend in localized and spaced positions across the gap to transmit heat from the second conductive layer into the heat sink, the bridge members limiting the rate of heat transfer into the heat sink such as to enable distribution of heat from the electronic components throughout the heat conductive layer means. - View Dependent Claims (2, 3, 4)
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5. A printed circuit board and heat sink structure comprising a printed circuit board having an electronic component connected to electrical circuitry terminals on the board, the component being spaced apart from one side of the board and the component having full operational temperature at which heat is required to be removed from the component;
- and a cured thermally conductive resinous mass disposed between the board and the component and heat conductively connected to the heat sink, the mass being spaced from the component for component temperatures below its full operational temperature and the mass being expandable under influence of heat convected and radiated during heating of the component so as to contact the component and conduct heat away from the component at the full operational temperature.
- 6. A printed circuit board and heat sink structure comprising a printed circuit board, a heat sink, and at least one electronic component comprising a plurality of electronic devices mounted upon a substrate and electrically connected to circuitry on the printed circuit board, the substrate mounted upon the heat sink with the heat sink and electronic component spaced away from the printed circuit board with the electronic component electrically connected by compliant leads to electrical terminals on the board.
- 8. A printed circuit board and heat sink structure comprising a printed circuit board, at least one electronic component, and a heat sink, the electronic component mounted upon the heat sink at one side of the printed circuit board with the heat sink and electronic component spaced away from the printed circuit board and with the electronic component electrically connected by compliant leads to electrical terminals on the other side of the board, the compliant leads extending through an aperture in the board to the electrical terminals.
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10. A printed circuit board and heat sink structure comprising:
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a heat sink and a printed circuit board; the printed circuit board having a substantially planar first circuitry layer, a plurality of electronic components disposed on one side of the plane of the first circuitry layer, and a heat conductive layer means disposed on the other side of the plane of the first circuitry layer, the heat conductive layer means extending across an area of the printed circuit board between positions in which the heat conductive layer means lies opposite to the plurality of electronic components and in heat conductive relationship with the electronic components for distributing heat received from any component throughout the heat conductive layer means and between said positions; and the heat sink is spaced from the printed circuit board to define an air gap between the heat sink and the printed circuit board, the heat sink connected to the heat conductive layer means by thermally conductive bridge members extending in localized and spaced positions across the gap from the circuit board to transmit heat into the heat sink, the bridge members limiting the rate of heat transfer into the heat sink such as to enable distribution of heat from the electronic components throughout the heat conductive layer means; and wherein the printed circuit board comprises a second circuitry layer which faces and is spaced from the heat sink by the thermally conductive bridge members, and at least one further electronic component is carried upon the second circuitry layer, the further component located between the heat sink and the second circuitry layer and also spaced from the heat sink.
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Specification