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Printed circuit boards and heat sink structures

  • US 5,467,251 A
  • Filed: 10/08/1993
  • Issued: 11/14/1995
  • Est. Priority Date: 10/08/1993
  • Status: Expired due to Term
First Claim
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1. A printed circuit board and heat sink structure comprising:

  • a heat sink and a printed circuit board;

    the printed circuit board having a substantially planar circuitry layer, a plurality of electronic components disposed on one side of the plane of the circuitry layer, and a heat conductive layer means disposed on the other side of the plane of the circuitry layer, the heat conductive layer means extending across an area of the printed circuit board between positions in which the heat conductive layer means lies opposite to the plurality of electronic components and in heat conductive relationship with the electronic components for distributing heat received from any component throughout the heat conductive layer means and between said positions;

    and the heat sink is spaced from the printed circuit board to define an air gap between the heat sink and the printed circuit board;

    and wherein the heat conductive layer means comprises a first and second heat conductive layers which are spaced apart by heat insulating material of the printed circuit board and are connected to one another by heat conductive members extending through the insulating material, the first of the heat conductive layers on one side of the insulating material being in heat conductive relationship with the electronic components and the second conductive layer being in heat exchange relationship with the heat sink by thermally conductive bridge members which extend in localized and spaced positions across the gap to transmit heat from the second conductive layer into the heat sink, the bridge members limiting the rate of heat transfer into the heat sink such as to enable distribution of heat from the electronic components throughout the heat conductive layer means.

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