Circuitized structure including flexible circuit with elastomeric member bonded thereto

• US 5,468,917 A
• Filed: 02/23/1994
• Issued: 11/21/1995
• Est. Priority Date: 03/23/1994
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Sharp, Timothy L., Shovlowsky, George J., Brodsky, William L., Herard, James D., Macek, Thomas G.
• Primary Examiner(s): TSO, LAURA K
• Application Number:
  US08/217,141
• Time in Patent Office: 636 Days
• Field of Search: 174/254, 174/255, 174/250, 174/261, 439/76, 439/83, 439/78, 439/67, 439/77, 439/55, 361/748, 361/749, 361/790
• US Class Current: 174/255
• CPC Class Codes: H01R 12/62 connecting to rigid printed circuits or like structures
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A circuitized structure including a flexible circuit with at least one layer of dielectric having a plurality of electrically conductive members (e.g., copper pads) thereon. An elastomeric member including a plurality of upstanding portions each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

Claims

1. A circuitized structure comprising:

a flexible circuit including at least one layer of dielectric material having a plurality of electrically conductive members on a first surface thereof;

an elastomeric member including a plurality of upstanding portions;

a plurality of metallic pad members, selected ones of said pad members being secured to a respective one of said upstanding portions of said elastomeric member; and

means for bonding each of said selected ones of said pad members to said flexible circuit at locations relative to respective ones of said electrically conductive members, said means for bonding comprising an adhesive.

2. The circuitized structure of claim 1 wherein said layer of dielectric material is comprised of polyimide.

3. The circuitized structure of claim 1 wherein each of said electrically conductive members comprises a metal pad.

4. The circuitized substrate of claim 3 wherein said metal pads are comprised of copper.

5. The circuitized substrate of claim 1 wherein said elastomeric member is comprised of silicone rubber.

6. The circuitized substrate of claim 1 wherein said metallic pad members are comprised of copper.

7. The circuitized substrate of claim 1 wherein said adhesive is a silicone-based adhesive.

8. The circuitized substrate of claim 1 wherein said flexible circuit further includes a plurality of metallic elements, each of selected ones of said metallic elements located on a second surface of said dielectric material substantially opposite a respective one of said electrically conductive members, said pad members secured to said elastomeric member being bonded to respective ones of said metallic elements.

9. The circuitized substrate of claim 1 further including a stiffener member secured to said elastomeric member for providing substantial rigidity to said elastomeric member.

10. A circuitized structure comprising:

a flexible circuit including at least one layer of dielectric material having a plurality of electrically conductive members on a first surface thereof and a plurality of metallic elements located on a second surface of said dielectric material opposite respective ones of said electrically conductive members;

an elastomeric member including a plurality of upstanding portions;

a plurality of metallic pad members, selected ones of said pad members being secured to a respective one of said upstanding portions of said elastomeric member; and

means for bonding selected ones of said pad members to selected ones of said metallic elements on said second surface of said flexible circuit at locations relative to respective ones of said electrically conductive members, said means for bonding said metallic pad members to said metallic elements comprising solder.

11. The circuitized structure of claim 10 wherein said layer of dielectric material is comprised of polyimide.

12. The circuitized structure of claim 10 wherein each of said electrically conductive members comprises a metal pad.

13. The circuitized substrate of claim 12 wherein said metal pads are comprised of copper.

14. The circuitized substrate of claim 10 wherein said elastomeric member is comprised of silicone rubber.

15. The circuitized substrate of claim 10 wherein said metallic pad members are comprised of copper.

16. The circuitized substrate of claim 10 further includes a stiffener member secured to said elastomeric member for providing substantial rigidity to said elastomeric member.