High pin count package for semiconductor device

• US 5,468,994 A
• Filed: 12/10/1992
• Issued: 11/21/1995
• Est. Priority Date: 12/10/1992
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Company (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Pendse, Rajendra D.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US07/988,640
• Time in Patent Office: 1,076 Days
• Field of Search: 257/668, 257/691, 257/693, 257/699, 257/700, 257/708, 257/779, 257/780, 257/673, 257/706, 257/707
• US Class Current: 257/693
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45155 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48639 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48655 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/85439 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/85444 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/85455 : Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 23/13 : characterised by the shape
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A thermally and electrically enhanced surface mount package with up to at least 600 I/O connections, but possessing the flexibility and simplicity of conventional leadframes. The package includes an integrated circuit die having a plurality of bonding pads, a conductive substrate having a cavity formed therein for receiving the integrated circuit die, and a flexible circuit laminated on the conductive substrate. The flexible circuit includes at least a wiring pattern and an area array of bumps formed on pads at the periphery of the flexible circuit. The flexible circuit may include a plurality of openings through the flexible circuit beneath certain of the pads or traces of the wiring pattern so as to ground the certain of the pads (ground pads) or traces to the conductive substrate. Preferably, the lamination of the flexible circuit to the conductive substrate would be performed using a conductive adhesive which substantially fills the openings to facilitate the concomitant electrical connection of the ground pads to the conductive substrate. The package is advantageous because it provides excellent thermal performance and controlled impedance signal transmission which are important in packages having a high number of I/O connections, yet it is relatively inexpensive to produce, has a generic finger layout like leadframes, and lends itself to surface mount assembly by conventional pick-and-place and mass reflow techniques. A method for making the package is also disclosed.

Claims

1. A metal leadless integrated circuit package comprising:

a metal body;

an integrated circuit die thermally coupled to said metal body;

a flexible circuit laminated on said metal body, said flexible circuit including at least a dielectric layer, a wiring formed on said dielectric layer and operatively connected to said integrated circuit die, and at least one opening through at least said dielectric layer of said flexible circuit for electrically connecting a portion of said wiring layer to said metal body;

wherein said wiring layer includes wiring traces and a plurality of pads, and said flexible circuit has a plurality of openings through at least said dielectric layer beneath said pads or said traces,

wherein said metal body includes at least a cavity formed therein for receiving said integrated circuit, and a wire-bondable finish on at least a region surrounding the cavity, and

wherein said integrated circuit includes at least ground bonding pads which are down-bonded to said wire-bondable finish.

2. A metal leadless integrated circuit package, comprising:

an integrated circuit die having a plurality of bonding pads;

a metal body thermally coupled to said integrated circuit die; and

a flexible circuit laminated on said metal body, said flexible circuit including at least a dielectric layer, a wiring pattern formed on said dielectric layer and operatively connected to said integrated die and an area array of pads formed at the periphery of said flexible circuit, said wiring pattern electrically connecting a plurality of the bonding pads of said integrated circuit die to said area array of pads, at least one opening through said dielectric layer of said flexible circuit for electrically connecting a portion of said wiring pattern to said metal body,

wherein said wiring layer includes wire traces and a plurality of pads, and said flexible circuit has a plurality of openings through at least said dielectric layer beneath said pads or said traces,

wherein said metal body includes at least a cavity formed for receiving said integrated circuit, and a wire-bondable finish on at least a region surrounding the cavity, and

wherein said integrated circuit includes at least ground bonding pads which are down-bonded to said wire-bondable finish.

3. A metal leadless integrated circuit package as recited in claim 2, wherein said flexible circuit is attached on said metal body using a conductive adhesive.

4. A metal leadless integrated circuit package as recited in claim 2, wherein said integrated circuit package further comprises an encapsulation layer covering at least said integrated circuit die, said encapsulation layer further functions as a stand-off when said integrated circuit package is mounted to a main printed circuit board.

5. An integrated circuit package, comprising:

an integrated circuit die having a plurality of bonding pads;

a metal body having a cavity formed therein for receiving said integrated circuit die, said integrated circuit die being thermally coupled to said metal body;

a flexible circuit laminated on said metal body, said flexible circuit including at least

a dielectric layer,

an area array of outer pads formed on said dielectric layer at the periphery of said flexible circuit, the outer pads including signal pads and ground pads, wherein said metal body includes a wire-bondable finish on at least a region surrounding the cavity, wherein said integrated circuit includes at least said ground pads which are down-bonded to said wire-bondable finish,

a wiring pattern formed on said dielectric and operatively connected to said integrated circuit die, said wiring pattern electrically connecting a plurality of the bonding pads of said integrated circuit die to the signal pads of said area array of outer pads, and

a plurality of openings through at least said dielectric layer of said flexible circuit beneath the ground pads, whereby the ground pads are electrically connected to said metal body; and

solder bumps formed on the outer pads of said area array of said flexible circuit.

6. An integrated circuit package as recited in claim 5, wherein said metal body functions as a ground plane.

7. An integrated circuit package as recited in claim 6, wherein said flexible circuit 10, wherein said flexible circuit is laminated on said metal body using a conductive adhesive, and wherein said openings are substantially filled with the conductive adhesive to electrically connect the ground pads to said metal body.

8. An integrated circuit package as recited in claim 5, wherein said integrated circuit package further comprises an encapsulation layer covering at least said integrated circuit die, said encapsulation layer further functions as a stand-off when said integrated circuit package is mounted to a main printed circuit board.

9. A metal leadless integrated circuit package, comprising:

an integrated circuit die having a plurality of bonding pads;

a metal body thermally coupled to said integrated circuit die;

a flexible circuit laminated on said metal body, said flexible circuit including at least a dielectric layer, a wiring pattern formed on said dielectric layer and operatively connected to said integrated die and an area array of pads formed at the periphery'"'"' of said flexible circuit, said wiring pattern electrically connecting a plurality of the bonding pads of said integrated circuit die to said area array of pads, at least one opening through said dielectric layer of said flexible circuit for electrically connecting a portion of said wiring pattern to said metal body,

wherein said wiring layer includes wire traces and a plurality of pads, and said flexible circuit has a plurality of openings through at least said dielectric layer beneath said pads or said traces; and

a ground bar formed at the inner periphery of said flexible circuit, and wherein at least one of the bonding pads of said integrated circuit die are wire-bonded to said ground bar of said flexible circuit.

10. A metal leadless integrated circuit package as recited in claim 9, wherein said flexible circuit is attached on said conductive substrate using a conductive adhesive.

11. A metal leadless integrated circuit package as recited in claim 9, wherein said integrated circuit package further comprises an encapsulation layer covering at least said integrated circuit die, said encapsulation layer further functions as a standoff when said integrated circuit package is mounted to a main printed circuit board.

12. An integrated circuit package, comprising:

an integrated circuit die having a plurality of bonding pads;

a metal body having a cavity formed therein for receiving said integrated circuit die, said integrated circuit die being thermally coupled to said metal body;

a flexible circuit laminated on said metal body, said flexible circuit including at least

a dielectric layer,

an area array of outer pads formed on said dielectric layer at the periphery of said flexible circuit, the outer pads including signal pads and ground pads,

a wiring pattern formed on said dielectric and operatively connected to said integrated circuit die, said wiring pattern electrically connecting a plurality of bonding pads of said integrated circuit die to the signal pads of said area array of outer pads, and

a plurality of opening through at least said dielectric layer of said flexible circuit beneath the ground pads, whereby the ground pads are electrically connected to said metal body;

a ground bar formed at the inner periphery of said flexible circuit, and wherein at least one of the bonding pads of said integrated circuit die are wire-bonded to said ground bar of said flexible circuit; and

solder bumps formed on the outer pads of said area array of said flexible circuit.