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High pin count package for semiconductor device

  • US 5,468,994 A
  • Filed: 12/10/1992
  • Issued: 11/21/1995
  • Est. Priority Date: 12/10/1992
  • Status: Expired due to Fees
First Claim
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1. A metal leadless integrated circuit package comprising:

  • a metal body;

    an integrated circuit die thermally coupled to said metal body;

    a flexible circuit laminated on said metal body, said flexible circuit including at least a dielectric layer, a wiring formed on said dielectric layer and operatively connected to said integrated circuit die, and at least one opening through at least said dielectric layer of said flexible circuit for electrically connecting a portion of said wiring layer to said metal body;

    wherein said wiring layer includes wiring traces and a plurality of pads, and said flexible circuit has a plurality of openings through at least said dielectric layer beneath said pads or said traces,wherein said metal body includes at least a cavity formed therein for receiving said integrated circuit, and a wire-bondable finish on at least a region surrounding the cavity, andwherein said integrated circuit includes at least ground bonding pads which are down-bonded to said wire-bondable finish.

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