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Cooling system for modular power supply device

  • US 5,469,331 A
  • Filed: 04/07/1994
  • Issued: 11/21/1995
  • Est. Priority Date: 04/07/1994
  • Status: Expired due to Fees
First Claim
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1. A high density electric power supply device comprising:

  • a plurality of stacked circuit modules including top, bottom and intermediate modules;

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  • 2 Assignments
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