Implantable medical device with multi-layered ceramic enclosure

• US 5,470,345 A
• Filed: 06/16/1994
• Issued: 11/28/1995
• Est. Priority Date: 06/16/1994
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Donders, Adrianus P., Hassler, Beth A.
• Primary Examiner(s): Kamm, William E.
• Assistant Examiner(s): SCHAETZLE, KENNEDY
• Application Number:
  US08/260,866
• Time in Patent Office: 530 Days
• Field of Search: 607/36, 607/2, 607/116, 607/37, 607/57, 607/60, 607/61, 607/54, 607/39, 607/40, 607/42-46, 607/32, 361/736, 361/752, 361/820, 174/52.1, 174/52.4, 174/52.2, 174/262
• US Class Current: 607/36
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

An implantable medical device has a novel ceramic enclosure with joinable multi-layered clamshells. In the preferred embodiment one half of the enclosure carries the hybrid circuitry and feedthroughs of, for example, a pacemaker, while, the other half carries a battery. The advantages over the prior art include higher transparency to radio frequency waves (for telemetry purposes), and reduced costs and construction time.

Claims

1. A packaging arrangement for the outer packaging of an implantable medical device comprising:

at least a first multi-layered enclosure shell; and

at least a second multi-layered enclosure shell;

wherein said enclosure shells are joinable to sealably enclose components of said implantable medical device, and layers of said enclosure shells are adapted to conduct signals between implantable medical device components mounted on said shells.

2. The packaging arrangement of claim 1 wherein the layers of said enclosure shells are ceramic.

3. The packaging arrangement of claim 1 wherein at least one of said enclosure shells comprises a multi-layered feedthrough having multiple feedthroughs for electrically coupling circuitry mounted on said shell to the outside of said shell.

4. The packaging arrangement of claim 2 wherein at least one of said enclosure shells comprises a multi-layered feedthrough having multiple feedthroughs for electrically coupling circuitry mounted on said shell to the outside of said shell.

5. The packaging arrangement of claim 1 wherein said first enclosure shell is adapted to carry a hybrid circuit of a pacemaker, and said second enclosure shell is adapted to carry a battery circuit of said pacemaker.

6. The packaging arrangement of claim 2 wherein said first enclosure shell is adapted to carry a hybrid circuit of a pacemaker, and said second enclosure shell is adapted to carry a battery circuit of said pacemaker.

7. The packaging arrangement of claim 3 wherein said first enclosure shell is adapted to carry a hybrid circuit of a pacemaker, and said second enclosure shell is adapted to carry a battery circuit of said pacemaker.

8. The packaging arrangement of claim 4 wherein said first enclosure shell is adapted to carry a hybrid circuit of a pacemaker, and said second enclosure shell is adapted to carry a battery circuit of said pacemaker.

9. The packaging arrangement of claim 1 further comprising a connector block for coupling to said enclosure shells.

10. The packaging arrangement of claim 2 further comprising a connector block for coupling to said enclosure shells.

11. The packaging arrangement of claim 3 further comprising a connector block for coupling to said enclosure shells.

12. The packaging arrangement of claim 4 further comprising a connector block for coupling to said enclosure shells.

13. The packaging arrangement of claim 5 further comprising a connector block for coupling to said enclosure shells.

14. The packaging arrangement of claim 6 further comprising a connector block for coupling to said enclosure shells.

15. The packaging arrangement of claim 7 further comprising a connector block for coupling to said enclosure shells.

16. The packaging arrangement of claim 8 further comprising a connector block for coupling to said enclosure shells.

17. The packaging arrangement of claim 2 wherein said enclosure shells further comprise an outer metallic layer.

18. The packaging arrangement of claim 4 wherein said enclosure shells further comprise an outer metallic layer.

19. The packaging arrangement of claim 6 wherein said enclosure shells further comprise an outer metallic layer.

20. The packaging arrangement of claim 8 wherein said enclosure shells further comprise an outer metallic layer.

21. The packaging arrangement of claim 10 wherein said enclosure shells further comprise an outer metallic layer.