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Semiconductor power module

  • US 5,471,089 A
  • Filed: 06/24/1993
  • Issued: 11/28/1995
  • Est. Priority Date: 06/30/1992
  • Status: Expired due to Fees
First Claim
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1. A semiconductor power module comprising:

  • (a) a semiconductor element for electric power control;

    (b) a circuit board, comprising;

    (b-1) a circuit board body having an insulator; and

    (b-2) first and second wiring patterns disposed on one major surface of said circuit board in such a manner that principal parts of said first and said second wiring patterns are longitudinally adjacent each other, said first and said second wiring patterns transmitting first and second power source potentials to said semiconductor element for electric power control, respectively; and

    (c) a first and a second power source terminals which are connected to said first and said second wiring patterns, respectively,said first and second wiring patterns and said first and second power source terminals being disposed in such a manner that power source currents flow in said first and said second wiring patterns in substantially parallel but opposite directions.

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