Metallurgical joint including a stress release layer

• US 5,471,092 A
• Filed: 12/21/1994
• Issued: 11/28/1995
• Est. Priority Date: 09/15/1992
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Chan, Chin-Jong, Romankiw, Lubomyr T., Chang, Jei-Wei
• Primary Examiner(s): Limanek, Robert P.
• Assistant Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US08/360,528
• Time in Patent Office: 342 Days
• Field of Search: 257/751, 257/753, 257/779, 257/766, 257/737, 257/763, 257/762, 257/772, 257/764
• US Class Current: 257/753
• CPC Class Codes: H01L 2224/0361 Physical or chemical etching
• CPC Class Codes: H01L 2224/03912 the bump being used as a mask for patterning the bonding area
• CPC Class Codes: H01L 2224/05111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05164 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05169 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05181 Tantalum [Ta] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

A metallurgical joint structure between two workpieces to be joined by soldering or brazing includes a stress release layer of a low yield point metal, preferably silver, gold, copper, palladium or platinum. The joint structure also includes a juxtaposed barrier layer to prevent the diffusion of a solder element, such as tin, to the stress release layer. Preferred barrier layers are chromium, titanium-tungsten and tantalum. Preferably, the joint includes one or more stress relief layer and associated barrier layer combinations in the joint structure for improved joint reliability.

Claims

1. A metallurgical joint between a first workpiece and a second workpiece to be joined comprising:

a first workpiece,

an adhesive layer coupled to said first workpiece;

a low yield point metal stress release layer coupled to said adhesive layer;

a barrier layer which does not react with Sn and will block Sn penetration into the stress release layer selected from the group consisting of Cr, TiW, Ta and alloys of Cr, TiW or Ta coupled to said stress release layer;

a phased metal layer coupled to said barrier metal layer;

a solder reactive metal layer selected from the group consisting of CrCu, Cu, Ni, Co, Au, Ag, Pd, Pt, Rh, Ni(P), Co(P) and combinations thereof coupled to said phased metal layer;

a solder layer selected from the group consisting of PbSn, AuSn, PbIn, AuIn, AuInSn and BiSn coupled to said solder reactive layer and isolated from said low yield point metal stress release layer by said barrier layer, and

a second workpiece coupled to said solder layer.

2. A metallurgical joint as set forth in claim 1 wherein said adhesive layer is selected from the group consisting of Cr, Ta and Ti and alloys of Cr, Ta or Ti.

3. A metallurgical joint as set forth in claim 1 wherein said stress release layer is selected from the group consisting of Ag, Au, Cu, Pd and Pt.

4. A metallurgical joint as set forth in claim 3 wherein said adhesive layer is Cr.

5. A metallurgical joint as set forth in claim 1 wherein said second workpiece is a controlled collapse chip connection.

6. A metallurgical joint as set forth in claim 1 wherein said first and said second workpieces are joined by tab automated bonding.

7. A metallurgical joint between a first workpiece and a second workpiece to be joined comprising:

a first workpiece;

an adhesive layer coupled to said first workpiece;

a first low yield point metal stress release layer coupled to said adhesive layer;

a first barrier layer which does not react with Sn and will block Sn penetration into the stress release layer selected from the group consisting of Cr, TiW, Ta and alloys of Cr, TiW or Ta coupled to said first stress release layer;

at least one additional low yield point metal stress release layer interleaved with an associated at least one additional barrier layer which does not react with Sn and will block Sn penetration, said interleaved layers being coupled to said first barrier layer;

a phased metal layer coupled to a last of said barrier layers;

a solder reactive metal layer selected from the group consisting of Cr Cu, Cu, Ni, Co, Au, Ag, Pd, Pt, Rh, Ni(P), Co(P) and combinations thereof coupled to said phased metal layer;

a solder layer selected from the group consisting of PbSn, Au Sn, PbIn, AuIn AuInSn and BiSn coupled to said solder reactive layer and isolated from said low yield point metal stress release layer by one of said barrier layers; and

a second workpiece coupled to said solder layer.

8. A metallurgical joint as set forth in claim 7, wherein said adhesive layer is selected from the group consisting of Cr, Ta and Ti and alloys of Cr, Ta or Ti.

9. A metallurgical joint as set forth in claim 7, wherein said first and said at least one additional stress release layers are selected from the group consisting of Ag, Au, Cu, Pd and Pt.

10. A metallurgical joint as set forth in claim 9, wherein said adhesive layer is Cr.

11. A metallurgical joint as set forth in claim 7, wherein said second workpiece is a controlled collapse chip connection.

12. A metallurgical joint as set forth in claim 7, wherein said first and said second workpieces are joined by tab automated bonding.

13. A metallurgical joint between a first workpiece and a second workpiece to be joined comprising:

a first workpiece,

a first adhesive layer coupled to said first workpiece;

a first low yield point metal stress release layer coupled to said first adhesive layer;

a first barrier layer which does not react with Sn and will block Sn penetration selected from the group consisting of Cr, TiW, Ta and alloys of Cr, Ti or Ta coupled to said first stress release layer;

a first phased metal layer coupled to said first barrier metal layer;

a first solder reactive metal layer selected from the group consisting of CrCu, Cu, Ni, Co, Au, Ag, Pd, Pt, Rh, Ni(P), Co(P) and combinations thereof coupled to said first phased metal layer;

a solder layer selected from the group consisting of PbSn, AuSn, PbIn, AuIn AuInSn and BiSn coupled to said solder reactive layer and isolated from said low yield point metal stress release layer by said barrier layer; and

a second solder reactive metal layer selected from the group consisting of CrCu, Cu, Ni, Co, Au, Ag, Pd, Pt, Rh, Ni(P), Co(P) and combinations thereof coupled to said solder layer;

a second phased metal layer coupled to said second solder reactive metal layer;

a second barrier layer which does not react with Sn and will block Sn penetration selected from the group consisting of Cr, TiW, Ta and alloys of Cr, TiW, or Ta coupled to said second phased metal layer;

a second low yield point metal stress release layer coupled to said second barrier layer;

a second adhesive layer coupled to said second stress release layer; and

a second workpiece coupled to said second adhesive layer.

14. A metallurgical joint as set forth in claim 13 wherein said first and said second adhesive layer are selected from the group consisting of Cr, Ta and Ti and alloys of Cr, Ta or Ti.

15. A metallurgical joint as set forth in claim 13 wherein said first and said second stress release layers are selected from the group consisting of Ag, Au, Cu, Pd and Pt.

16. A metallurgical joint as set forth in claim 15 wherein said first and said second adhesive layers are Cr.

17. A metallurgical joint as set forth in claim 13 wherein said second workpiece is a controlled collapse chip connection.

18. A metallurgical joint as set forth in claim 13, wherein said first and said second workpieces are joined by tab automated bonding.

19. A metallurgical joint between a first workpiece and a second workpiece to be joined comprising:

a first workpiece;

a first adhesive layer coupled to said first workpiece;

a first low yield point metal stress release layer coupled to said first adhesive layer;

a first barrier layer which does not react with Sn and will block Sn penetration selected from the group consisting of Cr, TiW, Ta and alloys of Cr, TiW, or Ta coupled to said first stress release layer;

at least one additional low yield point metal stress release layer interleaved with an associated at least one additional barrier layer, said interleaved layers being coupled to said first barrier layer;

a first phased metal layer coupled to a last of said barrier layers;

a first solder reactive metal layer selected from the group consisting of CrCu, Cu, Ni, Co, Au, Ag, Pd, Pt, Rh, Ni(P), Co(P) and combinations thereof coupled to said first phased metal layer;

a solder layer selected from the group consisting of PbSn, AuSn, PbIn, AuIn AuInSn and BiSn coupled to said first solder reactive layer and isolated from low yield point metal stress release layers by at least one of said barrier layers; and

a second solder reactive metal layer selected from the group consisting of CrCu, Cu, Ni, Co, Au, Ag, Pd, Pt, Rh, Ni(P), Co(P) and combinations thereof coupled to said solder layer;

a second phased metal layer coupled to said second solder reactive metal layer;

a second barrier layer selected from the group consisting of Cr, TiW, Ta and alloys of Cr, TiW or Ta coupled to said second phased metal layer;

a second low yield point metal stress release layer coupled to said second barrier layer;

at least one additional barrier layer interleaved with an associated at least one additional stress release layer, said interleaved layers being coupled to said second stress release layer;

a second adhesive layer coupled to a last of said stress release layers; and

a second workpiece coupled to said second adhesive layer.

20. A metallurgical joint as set forth in claim 19, wherein said first and second adhesive layers are selected from the group consisting of Cr, Ta and Ti and alloys of Cr, Ta or Ti.

21. A metallurgical joint as set forth in claim 19, wherein said first said second and said at least one additional stress release layers are selected from the group consisting of Ag, Au, Cu, Pd and Pt.

22. A metallurgical joint as set forth in claim 21, wherein said first and said second adhesive layers are Cr.

23. A metallurgical joint as set forth in claim 19, wherein said second workpiece is a controlled collapse chip connection.

24. A metallurgical joint as set forth in claim 19, wherein said first and said second workpieces are joined by tab automated bonding.

25. A metallurgical joint between a first workpiece and a second workpiece to be joined comprising:

a first workpiece,

an adhesive layer coupled to said first workpiece;

a low yield point metal stress release layer coupled to said adhesive layer;

a barrier layer coupled to said stress release layer which barrier layer does not react with Sn and will block Sn penetration into the stress release layer and is isolated from the first workpiece and the adhesive layer by said low yield point metal stress release layer, said barrier layer selected from the group consisting of Cr, TiW, Ta and alloys of Cr, TiW or Ta;

a phased metal layer coupled to said barrier metal layer;

a solder reactive metal layer selected from the group consisting of CrCu, Cu, Ni, Co, Au, Ag, Pd, Pt, Rh, Ni(P), Co(P) and combinations thereof coupled to said phased metal layer;

a solder layer selected from the group consisting of solders that are Sn alloys and In alloys coupled to said solder reactive layer and isolated from said low yield point metal stress release layer by said barrier layer, and

a second workpiece coupled to said solder layer.