Printed circuit board and method and apparatus for making same

• US 5,472,563 A
• Filed: 06/24/1994
• Issued: 12/05/1995
• Est. Priority Date: 09/22/1989
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Wajima, Motoyo, Ooki, Nobuaki, Akahoshi, Haruo, Nagai, Akira, Kawaguchi, Masami, Kogawa, Kiyonori
• Primary Examiner(s): Gallagher, John J.
• Application Number:
  US08/265,050
• Time in Patent Office: 529 Days
• Field of Search: 156/629, 156/313, 156/902, 156/629.1, 427/98, 427/305, 216/33
• US Class Current: 216/13
• CPC Class Codes: H05K 2203/0307 Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 3/383 by microetching
• CPC Class Codes: H05K 3/384 by plating
• CPC Class Codes: H05K 3/385 by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

Claims

1. A method for making a multi-layer printed circuit board having a higher mechanical strength at an increased temperature, the method comprising:

a step of etching a copper surface of copper circuit pattern on an insulating substrate to roughen the copper surface;

an oxidizing step of forming a dark brown/black copper oxide layer on the roughened surface of copper circuit pattern on both sides of the insulating substrate using an oxidizing agent;

a reducing step of forming a reduced copper layer by reducing the copper oxide layer;

a plating step of forming a metallic film having nickel or cobalt metal particles discretely distributed thereon on the surface of the reduced copper oxide layer in a plating solution containing a nickel salt or a cobalt salt and a boron compound free from palladium to form a layered body; and

a step of water washing and drying the layered body and then laminating a plurality of the layered bodies, each separated by an insulating resin layer, followed by bonding the insulating resin layers under pressure;

wherein no treatment with water is carried out between the reducing step and the plating step.

2. A method according to claim 1, wherein the bonding is carried out at a temperature in a range of 170°

C. to 200°

C.

10. A method according to claim 3 or 1 wherein the reducing step comprises a step of reducing the copper oxide with a boron based reducing agent and the plating step comprises a step of plating nickel or cobalt to a thickness of 10 to 2,000 angstroms.

11. A method according to claim 3 or claim 1, wherein the oxidizing agent is sodium chlorite.

3. A method for making a primed circuit board having a higher mechanical strength at an increased temperature, the method comprising:

a step of etching a copper surface of copper circuit pattern on an insulating substrate to roughen the copper surface;

a step of forming dark brown/black copper oxide on the roughened surface of copper circuit pattern on the insulating substrate using an oxidizing agent;

a step of reducing said copper oxide; and

a plating step of forming a metallic film having nickel or cobalt metal particles discretely distributed therein on the surface of said reduced copper oxide in a plating solution containing a nickel salt or a cobalt salt and a boron compound free from palladium;

wherein no treatment with water is carried out between the step of reducing and the plating step.

4. A method according to claim 3, wherein the step of reducing reduces the copper oxide with a boron based reducing agent and the plating step performs the plating with a solution containing boron compound and nickel or cobalt free from palladium.

5. A method according to claim 4, wherein a step of keeping the surface of reduced copper oxide in the state of being covered with the boron based reducing agent is provided between the step of reduction and the step of plating.

6. A method according to claim 4, wherein a step of keeping the surface of reduced copper oxide in the state of being covered with a non-oxidizing gas is provided between the step of reduction and the step of plating.

7. A method according to any one of claims 5 or 6, wherein a predipping step for removing oxide film spontaneously produced on the surface of the reduced copper oxide in the solution of boron compound used in the step of plating is provided after the step of reduction.

8. A method according to any one of claims 5 or 6, wherein the boron based reducing agent and the solution of boron compound contain at least one compound selected from the group consisting of dimethylamine, diethylamine borane, ammonia borane, and sodium borohydride.

9. A method according to any one of claims 5 or 6, wherein concentration of reducing agent in the solution of boron compound in the step of plating is nearly equal to that in the boron based reducing agent.

12. A method according to claim 7, wherein the boron based reducing agent and the solution of boron compound contain at least one compound selected from the group consisting of dimethylamine borane, diethylamine borane, ammonia borane, and sodium borohydride.

13. A method according to claim 7, wherein concentration of reducing agent in the solution of boron compound in the step of plating is nearly equal to that in the boron based reducing agent.

14. A method according to claim 8, wherein concentration of reducing agent in the solution of boron compound in the step of plating is nearly equal to that in the boron based reducing agent.